Reflow Soldering 101
Reflow soldering, the most common method of attaching surface mount components to a circuit board, plays a critical role in the overall electronics assembly process. Successful reflow soldering depends on knowledge of the reflow process setup, requirements for fixturing and tooling, baseline process parameters and their influence on solder joint quality, and troubleshooting common process defects.
Professor Martin Anselm, Ph.D. from Rochester Institute of Technology will guide you through this informative online course providing a basic understanding of the reflow soldering process.
Who Should Take This Course?
This course will be useful for companies who want to train their equipment operators and technicians who want to understand more about the overall process and who have a basic familiarity with the equipment referenced in each section.
- Solder Paste Materials
- Substrates and Surface Finishes
- Components and Moisture Sensitivity
- Board Fixturing and Support
- Reflow Profiling
After taking the online course, the trainee should be capable to accomplish the following tasks:
Note: some prior familiarity with the specific equipment is expected.
Course Length and Format