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International Wafer-Level Packaging Conference (IWLPC) 2019 Proceedings Download

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Sponsored jointly by the SMTA and Chip Scale Review magazine, the 16th annual IWLPC brought together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The proceedings contain research in the form of technical papers from leading experts in advanced packaging. The conference took place October 22 - 24, 2019 at the DoubleTree by Hilton San Jose Hotel.