Printing is an extremely critical part of the assembly process and many defects that are created in the SMT process begin in the printing stage. Typical causes of these defects are poor alignment between the substrate and the stencil, incorrect paste chemistry, or inconsistent/excess/insufficient solder paste deposits. Understanding correct printing optimization is crucial to reducing defects and increasing yield. Industry veteran Peter Biocca, Kester ITW, guides you through this informative online course providing a basic understanding of the stencil printing and troubleshooting processes.
Who Should Take This Course?
This course will be useful for equipment operators and technicians who want to understand more about the overall process and who have a basic familiarity with the equipment referenced in each section.
- Examples of Print Defects
- SMT Overview
- Solder Paste
- Squeegee Blades
- Printing Equipment
- Printing Parameters
- Process Development and Control
- Defect Prevention
- After taking the online course, the trainee should be capable to accomplish the following tasks:
- Understand basic process including fixturing and tooling
- Understand baseline process parameters
- Identify process defects
- Perform defect troubleshooting
Note: some prior familiarity with the specific equipment is expected.
Course Length and Format
- Approximately 82 minutes of recorded material
- Content is sectioned into short video clips ranging from two to 20 minutes per topic
- You can download the 85 page PDF to follow along with the recordings
- It will take you an estimated 1-3 hours (cumulative) to complete the course
- A 21 question quiz will test your knowledge retention of the course material
- A certificate of completion can be emailed to you once a satisfactory score is achieved on the quiz
- Daniel F. Baldwin, Ph.D., Engent, Inc.
- Peter Biocca, Kester
- Charles W. Brown, Intervala, LLC
- Donald C. Burr, Global Traffic Technologies
- Ray Chartrand, CharTrain Consulting
- Miguel Arroyo Colomer, Yamaha Motor Corporation USA
- Renee Michalkiewicz, NTS
- Rita Mohanty, Henkel
- Scott Nelson, Harris Corporation
- Viswanadham Puligandla Ph.D., Nokia (Retired)
- S. Manian Ramkumar Ph.D., Rochester Institute of Technology (RIT)
- Carlos Tafoya, AIM Solder
For additional resources, check out archived webinars such as: