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SMTA International Conference Proceedings 2019

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The SMTA International Conference Proceedings contain the latest and highest quality information and research on electronics assembly and manufacturing including Advanced Packaging Technology, Flux, Solder, Adhesives, Inspection Technologies, Manufacturing Excellence, Substrates/PCB Technology, and more. You can download over 100 papers from all sessions at SMTA International held September 22 - 26, 2019 in Rosemont, Illinois. Includes papers from the Harsh Environments Symposium, the Technical Innovations Symposium, the Lead-Free Soldering Technology Symposium, and presentations from the co-located Low Temperature Solder Symposium.


Note: You will be sent a link to download the files within 48 hours by headquarters staff after the order has been reviewed and processed.