SMTA International Wafer-Level Packaging Conference (IWLPC) 2016 Proceedings Download
Copyright Year: 2016
Non-Member Price: $160.00
Member Price: $150.00
Sponsored jointly by the SMTA and Chip Scale Review magazine, the 13th annual IWLPC addressed cutting edge topics in 3 key technology tracks: Wafer-Level, 3D, and MEMS packaging. The proceedings contain over 50 technical papers from leading experts in the advanced packaging industry. The conference took place October 18-20, 2016 at the DoubleTree by Hilton San Jose Hotel.