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Adhesion in Microelectronics

Adhesion in Microelectronics
Author: K. L. Mittal and Tanweer Ahsan
Publisher: John Wiley and Sons
Copyright Year: 2014
Number of Pages: 368
Non-Member Price: $205.00
Member Price: $195.00

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Topics covered in the book include various theories or mechanisms of adhesion, surface (physical or chemical) characterization of materials as it pertains to adhesion, surface cleaning as it pertains to adhesion, ways to improve adhesion, unraveling of interfacial interactions using an array of pertinent techniques, characterization of interfaces / interphases, polymer-polymer adhesion, metal-polymer adhesion (metallized polymers), polymer adhesion to various substrates, adhesion of thin films, underfills, molding compounds, and different dielectric materials, delamination and reliability issues in packaged devices, interface mechanics and crack propagation, and adhesion measurement of thin films and coatings.


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