Special EventsThe opportunity to gain new skills and update your technical knowledge is around every corner at SMTA International. From the exhibition area to the conference, you are sure to find valuable information that will prepare you to succeed in today's highly competitive market.
Many events below are free and some require fees and advance registration.
|IPC Fall Standards Development Committee Meetings||Saturday, September 16 -
Friday, September 22
|Women's Leadership Program||Monday, September 18 @ 2:00pm
|Opening Keynote Session and SMTA Annual Meeting
Experiencing Mixed Reality - using the Microsoft HoloLens
|Tuesday, September 19 @ 8am
|After Hours Events|
|Fun Run||Wednesday, September 20 @ 7am|
|Free Technical Sessions|
|Spotlight Sessions||Tuesday, September 19
Wednesday, September 20
|Free Activities on the Show Floor|
|Poster Session||Tuesday, September 19 @ 12pm|
|Spotlight Panel Session: Wearable Technologies||Tuesday, September 19 @ 11am|
|Tech Tours||Tuesday, September 19
Wednesday, September 20
|Beer Tasting||Tuesday, September 19 @ 4:30pm|
|User Solution Share||Wednesday, September 20 @ 12:30pm|
|Career Center||Tuesday, September 19
Wednesday, September 20
|10th Annual SMTAI Golf Tournament
Maple Meadows Golf Course
|Thursday, September 21 @ 8:30am|
IPC Fall Standards Development Committee Meetings
Sept. 16 - 22, 2017Contribute to the industry standards and guidelines that your company, customers and suppliers rely on by participating in the IPC Standards Development Committee Meetings.
View the full schedule for IPC committee meetings.
Opening Keynote Session and SMTA Annual Meeting
Experiencing Mixed Reality - using the Microsoft HoloLensRune Jensen, GM HoloLens, Microsoft Corporation
Tuesday, September 19 | 8:00am
Join us for coffee and breakfast treats, a terrific presentation about Storage Technology Trends, and the kick off of SMTA International!
FREE to All Attendees!
Market projections put the virtual reality, augmented reality, and mixed reality (VR/AR/MR) devices at anywhere from 90 to 120 million devices per year by 2020. Today on the market, there are a number of VR devices – mostly designed and marketed for entertainment. Basic augmented reality in the form of 2D images superimposed on video or pictures on our cellphones (e.g. Pokémon or Instagram filters) also exist today, mainly for entertainment. The ability to project 3D images into a user’s field of view has many exciting applications in the industrial space with the ability to provide real-time information or images fixed in-space to a real-world object. We call this mixed reality.
The Microsoft HoloLens is a premier mixed reality device. HoloLens is an untethered holographic computer that creates high-definition, 3D holograms using advanced nano-optics. These holograms become part of the real world through an array of sensors, which continuously sample the user’s environment. HoloLens combines all the processing and components in a form factor that enables interaction with the real and the virtual worlds - in a natural way. In his keynote, Mr. Jensen will share some of the technical challenges and triumphs as well as illustrate several practical applications of this innovative technology.
Rune Jensen, General Manager, HoloLens Hardware Design, joined Microsoft in 2007. He is responsible for leading a highly technical team of Electrical, Mechanical and Design Verification engineers responsible for building the HoloLens Hardware. Prior to that, he was a Partner, Director of Silicon Engineering, responsible for SOC Development for HoloLens, Xbox One, Xbox 360 and Zune. Prior to joining Microsoft, Rune was a Chip Implementation lead at Philips Semiconductors and ReShape. Rune holds an MS in Electrical Engineering from Aalborg University, Denmark. Rune lives with his wife and 2 kids in Silicon Valley. In his free time, he enjoys spending time with his kids, coaching soccer and other outdoor activities.
Congratulations to the 2016 SMTA International Conference Award Winners
Rich Freiberger Best of Conference Presentation
BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes
Mike Bixenman, DBA, KYZEN Corporation
Best of Proceedings Paper
Predicting the Reliability of Package-on-Package-on-Package (PoPoP) Interconnections Based on Accelerated Aging Experiments and Computational Modeling
Paul Vianco, Ph.D., Sandia National Laboratories
Best International Paper
Comparison of Active and Passive Temperature Cycling
Mathias Nowottnick, Ph.D., University of Rostock
Best Student Paper
Microstructure and Performance of Micro Cu Pillars Assemblies
Mohammed Genanu, Binghamton University
Women's Leadership Program
Monday, September 18, 2:00 - 6:00pmA session of only women presenters.
All are welcome to attend!
Chair: Priyanka Dobrial, Ph.D., Intel Corporation
Co-Chair: Michelle Ogihara, Seika Machinery, Inc.
We extend an invitation to everyone at SMTA International to attend a session of all women presenters on Monday afternoon. This will be followed by a panel discussion at 4:00pm on the technical achievements of women, mentoring, and STEM initiatives. The afternoon concludes with our annual Women's Leadership Connection Reception with wine and hors d'oeuvres from 5:00pm - 6:00pm.
WLP Keynote Address: Certification for the Future: Meeting Challenges of New Packaging Technologies in Rapidly Evolving MarketsMilena Vujosevic, Ph.D., Intel Corporation
The consumer electronics market is rapidly evolving and the manufacturers are under tremendous pressure to build faster, better, and cheaper products with short time to market. Electronic device producers also need to ensure the devices meet their design, performance, quality and reliability goals. At the same time, the increasing complexity of products and technologies requires more radical changes in materials and processes. This results in the changes in existing failure modes and the discovery of new failure modes and mechanisms, making high confidence quality and reliability risk assessments even more challenging. The qualification process needs to be optimized to meet these increasing challenges.
This talk discusses a novel approach to the definition of requirements for package certifications. The developed methodology challenges the existing industry practices that are a basis of the industry certification standards. This new methodology leverages the knowledge of use conditions and fundamental physics, and couples it with advanced computational mechanics modeling. The special focus is on the essential role of the physics based damage metrics in scaling from use condition to test conditions and in design for reliability. This Knowledge-based Qualification methodology is discussed relative to Standards-Based Qualifications showing that Knowledge-Based Qualification provides a superior technical framework for enabling future packaging technologies and customer designs.
Multiple examples will be provided to illustrate the impact of Knowledge-based Qualification on design, cost, and system level optimization. Included in the examples will be the specifics of how this advanced certification approach can enable proliferation of low temperature solder paste for SMT yield improvements.
Effectiveness of Conformal Coatings in Preventing Resistor Silver Sulfide Corrosion
*Marie Cole, Jacob Porter, Jason Wertz, and Marc Coq, IBM Corporation; *Jim Wilcox and Mike Meilunas, Universal Instruments Corporation
Conformal Coating- Relative Performance Comparison Through Environmental Testing Using B-52 Test Board
Iulia Muntele, Domingo Vazquez, Alfredo Garcia, Ricardo Macias, Humberto Ramirez, Cristina Amador, Shane Lewis, and Mulugeta Abtew, Sanmina Corporation; Jeff Chinn, Integrated Surface Technologies, Inc.
WLP Panel- Featuring Technical Accomplishments of Women Engineers in SMT
Moderator: *Chrys Shea, Shea Engineering
Women'sLeadership Connection Reception
Networking - wine and cheese are provided
Special Panel Session: Wearable Technologies – Emerging Opportunities and Challenges
September 19 | 11am-12:00pm | Exhibit Hall Theater #1Chair: Tom Borkes, The Jefferson Project
According to Forbes, the Wearable Tech market will be worth $34 billion by 2020, creating huge opportunity for manufacturers. But prior to realizing this market valuation, unique design and manufacturing challenges must be overcome. For starters, everyone knows you should always check your pockets before doing the laundry… But what about when your sensitive electronics are stitched into your jeans? Join (insert names) for a deep-dive discussion of the unique challenges of wearable electronics manufacturing, ranging from miniaturization and flexibility, to durability, power and testing. Participants include:
Tuesday, September 19 and Wednesday, September 20 | Exhibit HallBack by popular demand, Tech Tours is returning to the exhibit hall show floor! This is an opportunity for attendees to participate in technology focused tours that showcase the latest equipment and solutions in a small group setting with no sales pressure. The topical areas will be placement or printing and dispensing. Our exhibiting partners will provide a demo of their product, a short technology-based presentation or specific application support. Tech Tours are complimentary to all attendees and pre-registration is not required - feel free to hop on and off each tour as your schedule permits!
Click the map to view a printable flyer:
SMTA International "Pick & Taste" Beer Tasting
Tuesday, September 19 | 4:30pm - 5:30pm
Exhibit Hall Courtyard
Come "Pick & Taste" FREE craft beer and root beer from several of our SMTA chapter regions on Tuesday from 4:30pm - 5:30pm. Relax while making new connections at the multiple bars in the Exhibit Hall Courtyard.
SMTA Fun Run
CALLING ALL RUNNERS!
Get your run in.
You don't have to skip your run just because you are travelling. Join us for a 5 mile run on Wednesday, September 20th at 7:00 a.m. We will be meeting in the Doubletree lobby. You can register for the run when registering for SMTA International.
User Solution Share
Wednesday, September 20th | 12:30pm
Share a Manufacturing Challenge, and What You are Doing About It!
USER Companies Only (no suppliers or sales)
"Learn what your peers are experiencing"
Meeting Format: Each Presenter has 10 minutes and will be required to present 1-5 slides.
1. Describe the Problem
2. Discuss the Theorized Causes
3. Discuss the Experimentation or DOE
4. Explain the Corrective Action
5. Q & A Discussion
Please RSVP to Krissy Ohnstad by August 31st, 2016 and include the problem/solution and how many others from your company might attend.
PPT Deadline: September 8th, 2016
Download powerpoint slide template here.
Companies who attended past years include Celestica, Cisco Systems, Inc., Benchmark Electronics, Engent, Inc., IBM Corporation, Libra Industries, Inc., Lincoln Electric Company, Lutron Electronics Company Inc., Plexus Corp., Rockwell Automation, Sandia National Laboratories, and Textron Systems.
"The SMTA International SMTA Corporate User Session was a valuable opportunity to share information with industry peers. It was interesting to see that some problems are common to all of us and to see other concerns that may not have been considered. It was also helpful to observe the different approaches taken to diagnose and solve problems. The session was a good networking opportunity and resulted in discussions on future collaboration."
- Bob Trinnes, Rockwell Automation
Please contact Krissy Ohnstad at firstname.lastname@example.org to indicate if you or a colleague will consider participating, the problem/solution and how many others from your company might attend this event.
Students and Young Professionals Night Out
Wednesday, September 20 | 6:00pm - 9:00pm
This event is geared toward millennials age 30 and under.
Ready for some fun? This special event offers a great networking opportunity mixed with an evening of entertainment! Dust off your bowling shoes and head to Kings Bowling & Entertainment for a chance to connect with fellow students and other “millennial” young professionals in the industry. Food, beverage, bowling and shoe rental is provided. Please select this option on your registration form.
5505 Park Place
Rosemont, IL 60018
10th Annual SMTAI Golf Tournament
Thursday, September 21st, 2017 Sign up now for the 10th Annual SMTA International Golf Tournament. Maple Meadows Golf Club is a championship course featuring a modern combination of links and prairie design. Conveniently located just 10 miles from the Convention Center! COST:
Maple Meadows Golf Club
272 Addison Rd
Wood Dale, IL 60191 - map
8:30 am Shotgun Start
Best Ball Scramble
Prizes for Performance
Hot Buffet Lunch
$85.00 per player, $340 per foursome team
Sign up now for the 10th Annual SMTA International Golf Tournament.
Maple Meadows Golf Club is a championship course featuring a modern combination of links and prairie design. Conveniently located just 10 miles from the Convention Center!
Carter Severinson, SMTA
View all SMTA International and Golf Tournament Sponsorships