SMTA International Conference and Exhibition

Call for Papers

Thank you for submitting an abstract for SMTAI 2017. The program is now being finalized and we are no longer accepting abstracts.
The Abstract Deadline has now passed.
Please contact SMTA about other options for presenting your work.

Acceptance Notification: April 15, 2017 | Final Papers Due: July 7th, 2017

When a paper is accepted by the Technical Committee, it is our expectation that you have budget approval for travel costs and conference registration which is required for speakers.



Advanced Packaging/Components:
  • 2.5/3D Packaging and Integration
  • BGA/CSP
  • Biomedical Packaging
  • Component Storage
  • Connector Technology
  • Copper Pillars
  • Copper Wire Bonding
  • Diffusion Bonding
  • Embedded and Miniature Passives
  • Environmental Testing
  • Failure Analysis Techniques
  • Flip Chip
  • High Temperature Packaging
  • Lead Finishes
  • Magnetic Soldering
  • MEMS and Sensors
  • Moisture Sensitive Devices (MSD)
  • Package on Package (PoP)
  • Photonics
  • Photovoltaics and Solar
  • Reliability
  • Silver Wire-bonding
  • Stacked Die
  • System in Package (SiP)
  • Through Silicon Vias (TSVs)
  • Tin Whiskers
  • Wafer Level Packaging (WLP)


  • Assembly:
  • 01005/03015 Components/Assembly
  • 3D Board Assembly
  • Additive Manufacturing
  • SMT Adhesives
  • Alternate Solder Alloys
  • BGA/CSP Assembly
  • Bottom Terminated Components
  • Cavity Board Assembly
  • Cleaning, Conformal Coating and Potting
  • Connector Assembly to PCB
  • DFX/Design for Six Sigma
  • Direct Chip Attach to PCB (DCA)
  • Dispensing & Underfill
  • Epoxy Fluxes
  • Facility Layout
  • Halogen and Halogen-Free
  • Head on Pillow Defect/Warpage Induced Solder Joint Defects
  • High Melting Point Solder
  • Laser Soldering
  • Leadless Area Array Packages
  • Lead-Free Soldering/Reliability
  • Low Temperature Processing
  • Low Volume/Prototype
  • Non-Wet Open (NWO) Defects
  • Package-on-Package Assembly
  • Part Obsolescence
  • Placement
  • Printing
  • Reflow Soldering/ Wave Soldering
  • Rework and Repair of QFNs (01005,
  • Leadless Components, PoP)
  • Rework Reliability
  • Robotic Soldering
  • Selective Soldering
  • Solder Jetting
  • Solder Paste/Solder Voids in Joints
  • Solderless Interconnections
  • Supplier Engineering
  • Thermo Compression Bonding
  • Underfill/ Corner Glue/ Other Polymeric Reinforcements
  • Vapor Phase Reflow
  • Yield Improvement


  • Business/Supply Chain:
  • Capacity Modeling
  • Conict Minerals
  • Contract Manufacturing
  • Counterfeit Parts
  • Doing Business in Overseas
  • Environmental Issues
  • Lean Manufacturing
  • Onshoring
  • Operations Management
  • Part Obsolescence
  • RoHS/REACH Compliance
  • Supplier Management
  • Technology Roadmaps


  • Emerging Technologies:
  • <= 0.3mm Pitch Area Array Technologies
  • 3D Circuits
  • 3D Printing & Design Rules
  • Advanced Packaging
  • Assembly to Flex Substrates
  • Assembly to Glass Substrates
  • Cavity Assembly
  • Consumer Applications
  • Embedded Active Technology
  • Embedded Passive Technology
  • Flexible Electronics
  • High Frequency
  • Jetting of Solder Pastes
  • LED Technology/Assembly/Reliability
  • MEMS/RF/MOEMS
  • Microsystems Packaging / Modular Microsystems
  • Nanomaterials
  • Nanotechnology, Materials, & Electronics
  • New Materials and Processes
  • Optoelectronics
  • Plastic 3D PCB to PCB Technology
  • Power or Thermal Management
  • Power Electronics
  • Printed Electronics Technology
  • Reliability of Nanodevices
  • Resin Reinforcement Solder Pastes
  • Sensors and Manufacturing
  • Smart Manufacturing Systems
  • Small Die Size Singulation
  • Solid State Lighting
  • Solar Technology
  • System in a Package
  • Thermal Interface Materials
  • Touch Screen Technologies
  • Virtual Prototyping
  • Wearable Electronics
  • Wireless Applications


  • Harsh Environment Applications
    (Military, Aerospace, Automotive, Industrial, Oil & Gas):
  • Alternate Energy
  • Battery Prognostics
  • Components and Reliability
  • Copper Corrosion
  • COTS
  • High Lead Solder Replacement
  • High Temperature Electronics
  • Lead-free Issues
  • Non-Destructive Inspection
  • Micro-Computed Tomography
  • Multiphysics Modeling
  • Substrates and Finishes
  • Thermal Management
  • Tin Whiskers


  • PCB Technology:
  • Bio-Compatible Substrates
  • Black Pad and Surface Finish Defects
  • Conductive Anodic Filament (CAF)
  • Creep Corrosion
  • Embedded Passive/Active Components
  • Halogen Free
  • HDI
  • High Power PCBs
  • Micro-vias (including filled/unfilled)
  • Moisture Sensitivity
  • New Laminate Materials
  • New Surface Finishes & Solderability
  • Pad Cratering
  • Soldermask
  • Substrate Reliability


  • Process Control:
  • Acoustic Imaging (C-SAM)
  • Bene-ts of AOI & SPI
  • CIM
  • In-Circuit Test
  • Process Modeling
  • Software
  • Test Strategies
  • 2D/3D X-Ray




  • Thanks and the SMTAI Technical Committee looks forward to hearing from you!

    SMTAI Conference Chair, Rob Rowland, Axiom Electronics
    SMTA VP Technical Programs, Raiyo Aspandiar, Ph.D., Intel Corporation




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