SMTA International Conference and Exhibition

Call for Papers

Rob Rowland, SMTAI Conference Director
On behalf of the SMTA International Technical Committee, I invite you to submit an abstract for the 2018 conference. Short course (1/2 day - 3.5 hours) proposals are also being solicited.

Materials must be original, unpublished and non-commercial in nature. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data.

There are many benefits to participating!

You will:
1. Make a contribution to our industry by sharing your work.
2. Network with industry colleagues and showcase your company's position in the industry as an author and speaker,
3. Receive a discount on your conference registration.
4. Be eligible for cash prizes for best paper awards:
     Top 3 for best of proceedings/paper = $1000/$500/$500
     Best of conference (panels excluded) = $1000
     Best student paper = $500

We look forward to reviewing your abstract!
Rob Rowland
SMTAI Committee Chair
Axiom Electronics

Abstract Deadline: February 16, 2018
Acceptance Notification: April 2018 | Final Papers Due: July 27th, 2018

When a paper is accepted by the Technical Committee, it is our expectation that you have budget approval for travel costs and conference registration which is required for speakers.



Submit a Course




Advanced Packaging/Components:
  • 2.5/3D Packaging and Integration
  • BGA/CSP
  • Biomedical Packaging
  • Component Storage
  • Connector Technology
  • Copper Pillars
  • Copper Wire Bonding
  • Diffusion Bonding
  • Embedded and Miniature Passives
  • Environmental Testing
  • Failure Analysis Techniques
  • Flip Chip
  • High Temperature Packaging
  • Lead Finishes
  • Magnetic Soldering
  • MEMS and Sensors
  • Moisture Sensitive Devices (MSD)
  • Package on Package (PoP)
  • Photonics
  • Photovoltaics and Solar
  • Reliability
  • Silver Wire-bonding
  • Stacked Die
  • System in Package (SiP)
  • Through Silicon Vias (TSVs)
  • Tin Whiskers
  • Wafer Level Packaging (WLP)


  • Assembly:
  • 01005/03015 Components/Assembly
  • 3D Board Assembly
  • Additive Manufacturing
  • SMT Adhesives
  • Alternate Solder Alloys
  • BGA/CSP Assembly
  • Bottom Terminated Components
  • Cavity Board Assembly
  • Cleaning, Conformal Coating and Potting
  • Connector Assembly to PCB
  • DFX/Design for Six Sigma
  • Direct Chip Attach to PCB (DCA)
  • Dispensing & Underfill
  • Epoxy Fluxes
  • Facility Layout
  • Halogen and Halogen-Free
  • Head on Pillow Defect/Warpage Induced Solder Joint Defects
  • High Melting Point Solder
  • Laser Soldering
  • Leadless Area Array Packages
  • Lead-Free Soldering/Reliability
  • Low Temperature Processing
  • Low Volume/Prototype
  • Non-Wet Open (NWO) Defects
  • Package-on-Package Assembly
  • Part Obsolescence
  • Placement
  • Printing
  • Reflow Soldering/ Wave Soldering
  • Rework and Repair of QFNs (01005,
  • Leadless Components, PoP)
  • Rework Reliability
  • Robotic Soldering
  • Selective Soldering
  • Solder Jetting
  • Solder Paste/Solder Voids in Joints
  • Solderless Interconnections
  • Supplier Engineering
  • Thermo Compression Bonding
  • Underfill/ Corner Glue/ Other Polymeric Reinforcements
  • Vapor Phase Reflow
  • Yield Improvement


  • Business/Supply Chain:
  • Capacity Modeling
  • Conict Minerals
  • Contract Manufacturing
  • Counterfeit Parts
  • Doing Business in Overseas
  • Environmental Issues
  • Lean Manufacturing
  • Onshoring
  • Operations Management
  • Part Obsolescence
  • RoHS/REACH Compliance
  • Supplier Management
  • Technology Roadmaps


  • Emerging Technologies:
  • <= 0.3mm Pitch Area Array Technologies
  • 3D Circuits
  • 3D Printing & Design Rules
  • Advanced Packaging
  • Assembly to Flex Substrates
  • Assembly to Glass Substrates
  • Cavity Assembly
  • Consumer Applications
  • Embedded Active Technology
  • Embedded Passive Technology
  • Flexible Electronics
  • High Frequency
  • Jetting of Solder Pastes
  • LED Technology/Assembly/Reliability
  • MEMS/RF/MOEMS
  • Microsystems Packaging / Modular Microsystems
  • Nanomaterials
  • Nanotechnology, Materials, & Electronics
  • New Materials and Processes
  • Optoelectronics
  • Plastic 3D PCB to PCB Technology
  • Power or Thermal Management
  • Power Electronics
  • Printed Electronics Technology
  • Reliability of Nanodevices
  • Resin Reinforcement Solder Pastes
  • Sensors and Manufacturing
  • Smart Manufacturing Systems
  • Small Die Size Singulation
  • Solid State Lighting
  • Solar Technology
  • System in a Package
  • Thermal Interface Materials
  • Touch Screen Technologies
  • Virtual Prototyping
  • Wearable Electronics
  • Wireless Applications


  • Harsh Environment Applications
    (Military, Aerospace, Automotive, Industrial, Oil & Gas):
  • Alternate Energy
  • Battery Prognostics
  • Components and Reliability
  • Copper Corrosion
  • COTS
  • High Lead Solder Replacement
  • High Temperature Electronics
  • Lead-free Issues
  • Non-Destructive Inspection
  • Micro-Computed Tomography
  • Multiphysics Modeling
  • Substrates and Finishes
  • Thermal Management
  • Tin Whiskers


  • PCB Technology:
  • Bio-Compatible Substrates
  • Black Pad and Surface Finish Defects
  • Conductive Anodic Filament (CAF)
  • Creep Corrosion
  • Embedded Passive/Active Components
  • Halogen Free
  • HDI
  • High Power PCBs
  • Micro-vias (including filled/unfilled)
  • Moisture Sensitivity
  • New Laminate Materials
  • New Surface Finishes & Solderability
  • Pad Cratering
  • Soldermask
  • Substrate Reliability


  • Process Control:
  • Acoustic Imaging (C-SAM)
  • Bene-ts of AOI & SPI
  • CIM
  • In-Circuit Test
  • Process Modeling
  • Software
  • Test Strategies
  • 2D/3D X-Ray




  • Thanks and the SMTAI Technical Committee looks forward to hearing from you!

    SMTAI Conference Chair, Rob Rowland, Axiom Electronics
    SMTA VP Technical Programs, Raiyo Aspandiar, Ph.D., Intel Corporation




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