Pan Pacific Microelectronics Symposium

Save the Date for Pan Pac 2018!

Plan to join us next year at the Hapuna Beach Prince Hotel on the Big Island of Hawaii.
February 5-8, 2018

Pan Pac 2018 Call for Abstracts

Still accepting abstracts!
Start planning now to present your research next year. Abstracts of 500 words should be submitted with title and author contact information.

Submit an abstract today!

The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.



View the latest Pan Pacific Newsletters!
Pan Pac Newsletter Issue 3
   Pan Pac Newsletter Issue 2



Pan Pac Provides You The Latest Research On

  • 3D/Heterogeneous Integration
  • Emerging Technologies
  • Green Electronics
  • High Performance Low I/O
  • Internet of Things (IoT)
  • Material Advances
  • Nanotechnology
  • Photonics
  • Reliability and Quality
  • Trends, Roadmaps, and more...



  • Steering Committee

    Phil Isaacs, IBM Corporation, Chair
    Denis Barbini Ph.D., Universal Instruments Corporation
    Charles E. Bauer, Ph.D., TechLead Corporation
    Ross Berntson, Indium Corporation
    Dock Brown, DfR Solutions
    Dwight Howard, Delphi
    Soeren Noerlyng, MICRONSULT
    Yasumitsu Orii, Ph.D., NAGASE Group
    David Raby, STI Electronics
    Roy Starks, Libra Industries
    Jing Zhang, IBM Corporation


    David Ravy, STI Electronics "Pan Pac is unique because of the high-quality attendees and exceptional presentations it draws, as well as the casual and social atmosphere that permeates the conference."
    David Raby, STI Electronics, Inc.