Most Downloaded Articles from the SMTA Knowledge Base

Knowledge BaseThis list of articles contains the most searched and downloaded articles from the SMTA Knowledge Base during 2019. SMTA members have unlimited access to download these papers. You can become a member for just $95.

 

How Does Printed Solder Paste Volume Affect Solder Joint Reliability?
Tony Lentz, Jasbir Bath and N. Pavithiran
FCT Assembly, Bath Consultancy, LLC and Nihon Superior

Rheology of Flux and Solder Paste
Fan Gao, Ph.D., Yanrong Shi, Ph.D., Kyle Loomis, Bruno Tolla, Ph.D.
Kester Inc.

Dissolution Rate of Specific Elements in SAC305 Solder
David Hillman, Ross Wilcoxon, Tim Pearson and Paul McKenna
Rockwell Collins

Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys
Richard Coyle, et al., iNEMI/HDPUG 3rd Generation Pb-Free Alloys Project

The Effect of Bismuth, Antimony, or Indium on the Thermal Fatigue of High Reliability Pb-Free Solder Alloys
Richard Coyle, et al., iNEMI/HDPUG 3rd Generation Pb-Free Alloys Project

Advancement of Solder Paste Inspection (SPI) Tools to Support Industry 4.0 & Package Scaling
Abhishek Prasad, Larry Pymento, Srinivasa Aravamudhan, and Chandru Periasamy, Intel Corporation

SIR Characterization of No-Clean Flux Residues under the QFN Component using Different PCB Board Design Options
Mark McMeen, Collin Langley, Mike Bixenman and David Lober
STI Electronics and KYZEN Corporation

How Does Surface Finish Affect Solder Paste Performance?
Tony Lentz, FCT Assembly

Practical Implementation of Assembly Processes for Lowmelting Point Solder Pastes
Adam Murling, et al., Indium Corp. and Rochester Institute of Technology

Rational Application of Impractical Stencil Aperture Designs to Enable M0201 Heterogeneous Assembly
Jeff Schake and Mark Whitmore, ASM Assembly Systems

Reflow Blower and Vibration Characterization, Effect on BGA Bridging
Jason Stafford, Intel Corporation

Solder-Joint Reliability of a 0.65mm Pitch Molded Array Package for Automotive Applications
Burton Carpenter, Mollie Benson and Andrew Mawer, NXP Semiconductors

Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly Usage
Pradeep Lall, Kartik Goyal, Ben Leever and Jason Marsh
Auburn University, US Air Force Research Labs and NextFlex Manufacturing Institute

The Role of Nickel in Solder Alloys - Parts 1 and 2
Kazuhiro Nogita, Ph.D., Keith Sweatman and Tetsuro Nishimura, Ph.D.
The University of Queensland and Nihon Superior Co. Ltd.

Fill The Void III
Tony Lentz, FCT Assembly

AOI Process Improvement
Jeff Danner, Jabil Circuit Inc.

Low Temperature Curable PI/PBO for Wafer Level Packaging
Daisaku Matsukawa, et al., Hitachi Chemical Co., Ltd.

Component Removal Techniques with Underfill on Printed Circuit Boards for Failure Analysis
Priyanka Dobriyal, Ph.D., James Wade, Anil Kurella, Intel Corporation

Method Of Determining Solder Paste Inspection Tolerance Settings
Johnny Chen, et al., Flex

Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate - Influence of Eigenmodes
Viktoria Rawinski, Joe Clure, Marcel Buck and Denis Jean
Kurtz Ersa Group and Kester Inc.

Rework Practices for MicroLEDs and Other Highly Miniaturized SMT Components
Neil O’Brien and Robert Avila, Finetech

PCB Reliability: Auditing your Supply Chain to Insure it
Yash Sutariya, Saturn Electronics Corporation

Accelerated Life Testing Solder Reliability in Combined Environments: Isothermal Conditions with Harmonic Vibration
Ivan Tan, et al., Celestica, Honeywell, Curtiss Wright, Rockwell Collins, BAE Systems, University of Toronto