Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Thursday, August 24th, 2017
Registration Opens at 8:00AM
Free Technical Program & Schedule:
Special Thanks to our Coffee Sponsor, Summit Interconnect!
Special Thanks to our Technical Sessions Sponsor, Cumberland Electronics!
9:30AM – 11:00AM
The “Deadly Sins” of SMT Assembly
Speaker: Phil Zarrow, ITM Consulting
Everyone has heard of the “7 Deadly Sins” that will, supposedly, lead one to Hell. There are also the “Deadly Sins” of SMT - there are more than just 7 – and they can make your assembly process a “hell on earth”.
During the course of ITM’s assembly process audits and troubleshooting work, we tend to see trends in the types of errors and problems. In other words, a lot of people are making the same mistakes. The resulting process problems wreak havoc with an impact on assembly yields ranging from 5 to 20%. In addition to this direct cost, there is also additional financial impact with regard to time spent reworking and repairing, the on corrective action by QC, Engineering and Management, and, of course, “do-over”.
This workshop identifies the “deadly sins” of SMT assembly, both for Pb-free and “leaded” processes. Besides the symptoms and consequences of each type of error, root-cause, rectification and prevention techniques will be presented. Best Practices will be discussed for each of the key process steps. The workshop will, thus, provide the participant with an understanding of how to identify and correct the most common SMT assembly problems. It will include identification of vendor and source problems including components and materials as well as design related problems.
Areas of General Process “Sins”
• Utilization of Process Feedback Data
• Design for Manufacturability and Assembly
• In-Process Inspection and AOI
• Procedures and Documentation
• Stencil Printing o Stencil Design o Stencil Cleaning
• Component Placement and Feeders
• Reflow Soldering o Parameters and Nitrogen
• Wave Soldering
• Inefficiency o Unbalanced lines o Excessive Downtime
Special Thanks to our Lunch Sponsor, Printed Circuits Corporation!
1:00PM – 1:45PM
Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly
Speaker: Gerry Partida, Summit Interconnect
Printed circuit boards are the platform for all surface mount technology processes and electronics manufacturing. There have been tremendous advancements in high speed and microwave materials, via structures and processing techniques. The material constructions and attributes provide unique opportunities for designers and unique challenges for bare printed circuit board fabricators. Mr. Partida will explore the various material options and their trade-offs, provide insight into the manufacture of multiple lamination cycle requirements, review stack-up and routing considerations, managing registration requirements, micro drilling and copper wrap plating processes. This will be an invaluable session to understand materials considerations, cost trade-offs and leading-edge processing technologies for the design, manufacture and assembly of high-technology printed circuit boards.
2:00PM – 2:45PM
Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics
Speaker: Shannan O’Shaughnessy, Ph.D., GVD Corporation
Radio frequency (RF) micro-electronics are used everywhere in today’s technology, from the internet of things to military radar systems. It is challenging for these advanced RF systems to meet size, weight, power and cost requirements set by consumer market or defense agency demand, what the military calls “SWaP-C”, due to the need for packaging of the RF components and integrated circuits (ICs) in to ensure long term reliability. Reliability concerns traditionally necessitate the environmental protection of these high-frequency RF devices at either the component or the assembly level by hermetically sealing the device in a bulky, heavy expensive metal enclosure to prevent degradation caused by hazards in device operating environments. Industry standard conformal coatings are unusable due to the significant signal degradation which occurs if applied directly over an RF circuit. There is a critical need for a coating alternative to which is compatible with high-frequency RF devices to provide a lower weight and lower volume environmental protection scheme with high reliability and negligible performance impact for RF devices. This approach would allow RF device integration on size, weight, and cost effective PCBs and eliminate the hermetically packaged chip-and-wire assemblies currently in use. To address this need, GVD Corporation has developed a high reliability environmental coating, Exilis, for RF electronics devices that can be applied to both the bare device and completed assemblies.
GVD’s Exilis coating has an extremely low dielectric constant and loss tangent; this coupled with the coating’s low thickness (~1 micron) results in virtually no impact to RF performance. This becomes ever more important as the operating frequency of the device being coated increases as the immediate dielectric environment surrounding the circuit creates a more significant impact. GVD’s Exilis coating has demonstrated high-reliability environmental protection of electronic components in harsh environments. RF devices coated with Exilis, which was directly applied to the open-faced die, have been subjected to 1,000 hours of accelerated stress testing at 85°C and 85% RH as well as over 500 hours of continuous salt-fog exposure per ASTM B117. Each instance demonstrated that the device was still operation and showed no signs of corrosion after exposure. Exilis has also passed electronics industry standards for environmental protection in harsh environments, including the military MIL-I-46058C specification and IPC-CC-830. The soon to be released revision to the IPC-CC-830 standard will encompass new ultra-thin coating technologies, allowing for Exilis to be qualified to the standard.