Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Thursday, August 24th, 2017
Registration Opens at 8:00AM
Free Technical Program & Schedule:
Special Thanks to our Coffee Sponsor, Summit Interconnect!
9:30AM – 11:00AM
The “Deadly Sins” of SMT Assembly
Speaker: Phil Zarrow, ITM Consulting
Everyone has heard of the “7 Deadly Sins” that will, supposedly, lead one to Hell. There are also the “Deadly Sins” of SMT - there are more than just 7 – and they can make your assembly process a “hell on earth”.
During the course of ITM’s assembly process audits and troubleshooting work, we tend to see trends in the types of errors and problems. In other words, a lot of people are making the same mistakes. The resulting process problems wreak havoc with an impact on assembly yields ranging from 5 to 20%. In addition to this direct cost, there is also additional financial impact with regard to time spent reworking and repairing, the on corrective action by QC, Engineering and Management, and, of course, “do-over”.
This workshop identifies the “deadly sins” of SMT assembly, both for Pb-free and “leaded” processes. Besides the symptoms and consequences of each type of error, root-cause, rectification and prevention techniques will be presented. Best Practices will be discussed for each of the key process steps. The workshop will, thus, provide the participant with an understanding of how to identify and correct the most common SMT assembly problems. It will include identification of vendor and source problems including components and materials as well as design related problems.
Areas of General Process “Sins”
• Utilization of Process Feedback Data
• Design for Manufacturability and Assembly
• In-Process Inspection and AOI
• Procedures and Documentation
• Stencil Printing o Stencil Design o Stencil Cleaning
• Component Placement and Feeders
• Reflow Soldering o Parameters and Nitrogen
• Wave Soldering
• Inefficiency o Unbalanced lines o Excessive Downtime
Special Thanks to our Lunch Sponsor, Printed Circuits Corporation!
1:00PM – 1:45PM
Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly
Speaker: Gerry Partida, Summit Interconnect
Printed circuit boards are the platform for all surface mount technology processes and electronics manufacturing. There have been tremendous advancements in high speed and microwave materials, via structures and processing techniques. The material constructions and attributes provide unique opportunities for designers and unique challenges for bare printed circuit board fabricators. Mr. Partida will explore the various material options and their trade-offs, provide insight into the manufacture of multiple lamination cycle requirements, review stack-up and routing considerations, managing registration requirements, micro drilling and copper wrap plating processes. This will be an invaluable session to understand materials considerations, cost trade-offs and leading-edge processing technologies for the design, manufacture and assembly of high-technology printed circuit boards.
2:00PM – 2:45PM
Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics
Speaker: Shannan O’Shaughnessy, Ph.D., GVD Corporation
Radio frequency (RF) micro-electronics are used everywhere in today’s technology, from the internet of things to military radar systems. Many of these systems, such as military active electronically scanned array (AESA) radar, read and analyze a high volume of RF signals and data using sophisticated analog-to-digital conversation and high-power processors. However, it is challenging for these advanced RF systems to meet size, weight, power and cost requirements set by consumer market or defense agency demand, what the military calls “SWaP-C”, due to the need for packaging of the RF components and integrated circuits (ICs) in to ensure long term reliability. Reliability concerns traditionally necessitate the environmental protection of these high-frequency RF devices at either the component or the assembly level by hermetically sealing the device in a bulky, heavy expensive metal enclosure to prevent degredation caused by hazards in device operating environments. Industry standard conformal coatings are unusable due to the significant signal degradation which occurs if applied directly over an RF circuit. There is a critical need for a coating alternative to which is compatible with high-frequency RF devices to provide a lower weight and lower volume environmental protection scheme with high reliability and negligible performance impact for RF devices. This approach would allow RF device integration on size, weight, and cost effective PCBs and eliminate the hermetically packaged chip-and-wire assemblies currently in use. To address this need, GVD Corporation has developed a high reliability environmental coating, Exilis, for RF electronics devices that can be applied to both the bare device and completed assemblies. GVD’s coatings are applied through a dry, room-temperature, vapor deposition process that gently encapsulates RF boards and/or components in a micron-thin polymer. The coating’s low dielectric constant and low thickness has been demonstrated to have negligible impact on RF signal integrity when applied directly to the surface of Monolithic Microwave Integrated Circuits (MMICs) operating in Ku, Ka, and W bands, as validated by independent testing. Exilis’s high thermal stability makes it compatible with hot-running semiconductor technologies, such as gallium nitride (GaN) components.
GVD’s Exilis coating has an extremely low dielectric constant and loss tangent; this coupled with the coating’s low thickness (~1 micron) results in virtually no impact to RF performance. This becomes ever more important as the operating frequency of the device being coated increases as the immediate dielectric environment surrounding the circuit creates a more significant impact. For instance, a RF device operating at C band can accommodate a parylene coating with a low impact on signal performance; however, a Ka band device operating at 40 GHz coated with parylene would see such a large performance shift to render the device unusable. This performance impact due to conventional conformal coatings is typically seen starting at X-band (8-12 GHz) and increases over higher RF frequencies, at which point hermetic packaging is seen as the only high-reliability option for environmental protection. In comparison with Parylene C, GVD’s Exilis coating has a dissipation factor over 10 times lower (~ 0.001). In RF testing, Exilis showed negligible impact on s-parameters, gain, isolation, and return loss from 0 to 20 GHz frequency; this low impact was observed before and after 8 days of environmental exposure at 85°C/85% relative humidity (RH). This low performance impact when applied directly over the RF circuit enables a chip, component, or assembly designer to consider high-reliability environmental protection without the added weight, volume, and expense of hermetic packaging.
GVD’s Exilis coating has demonstrated high-reliability environmental protection of electronic components in harsh environments. RF devices coated with Exilis, which was directly applied to the open-faced die, have been subjected to 1,000 hours of accelerated stress testing at 85°C and 85% RH as well as over 500 hours of continuous salt-fog exposure per ASTM B117. Each instance demonstrated that the device was still operation and showed no signs of corrosion after exposure. Exilis has also passed electronics industry standards for environmental protection in harsh environments, including the military MIL-I-46058C specification and IPC-CC-830. The soon to be released revision to the IPC-CC-830 standard will encompass new ultra-thin coating technologies, allowing for Exilis to be qualified to the standard.
GVD developed the Exilis coating initially as a long-term electrical insulator for neurological implants where failure during the life of the implanted device is not an option. The deposition process simultaneously adsorbs molecules of monomer units on the surface of the board and crosslinks those monomer units to grow a cohesive polymer film, resulting in molecular-level conformal coverage of the surface. This molecular-level coverage ensures excellent adhesion to the device, which is critical in providing protection from exposure to harsh operating environments. The dense networked structure renders Exilis resistant to dissolution or delamination. Chemical compatibility has been demonstrated through long-term soak testing with a variety of solvents and liquids, specifically in aerospace operating environments, such as acetone, isopropyl alcohol, jet fuel, hydraulic fuel, and de-icing agents.