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Reducing QFN Voiding
Mario Scalzo, Indium Corporation
10:00AM – 11:00AM
Coping with Pb-free in High Performance Engineering Design
Anthony Rafanelli, Ph.D., Raytheon Corporation
As Pb-free technology increasingly becomes the standard for electronic interconnects and finishes, engineers must cope with the various challenges posed by these materials both as interconnections and finishes. Summarizing at a high level, these challenges represent risks associated with 1) durability of the interconnection and 2) deleterious effects of tin whiskers. The IPC PERM Council has been the lead industry group focusing on the identification of those challenges and risks associated with use of these new materials. Their efforts have led to a significant increase in the knowledge base with respect to technical guidance and risk mitigation resulting in tools for use by the many engineering disciplines (design, manufacturing, quality, production, materials science) that comprise successful aerospace and defense product development. These tools are mostly made up of standards and handbooks focused on system performance, tin whisker risk mitigation, Pb-free product testing, technical guidance, and rework/repair. What was missing was design guidance. Accordingly, IPC Task Group 8-81D (Research Coordination and Technical Guidance), of the IPC PERM COUNCIL, has undertaken an assignment to generate an industry-wide guide to aid engineers in designing with Pb-free technology. The focus is to provide insight and information such that the design will maintain performance requirements for aerospace, defense, and high-performance (ADHP) products and systems. Having started out as a "laundry list" of Pb-free concerns and challenges identified by the ADHP industry, the guide is structured such that those “delta” considerations, i.e. technical knowledge gaps with Pb-free technology are brought to the designer’s attention. Furthermore, the guide highlights Pb-free concerns, as they are encountered in the phases which generally reflect the product development cycle used by Aerospace, Defense, and High-Performance systems industries. This paper presents an overview of the PERM Council and a summary of efforts to generate a Pb-free design guide.
Complimentary Hot Lunch
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12:30PM – 1:30PM
Why Reball BGA’s
Brian Watson, SemiPack Services
Why BGA Reballing? There are multiple reasons to Reball BGA's. From design aspects to life span to EOL components that have oxidized to quality and yield improvement, BGA Reballing is an essential part of non commercial applications. We will review thee aspects, plus best practice and the options available to reball components. A brief overview will also be given on this subject.
I . Support of Sn/Pb for Military and Space designs
a. Designs that were qualified as tin/lead cannot be switched to lead-free without re qualification.
b. If additional hardware is needed years later everything must be converted to tin lead.
c. Typical programs require a 20 year spare parts purchase at the end of production.
d. Electronic parts acquired 10-20 years ago often require some kind of re-tinning.
e. Building new hardware with refinished components will increase quality and yields.
II . Reliability
a. Tin whiskers have been discovered on SAC 305 BGAs.
b. Electronic failures from tin whiskers can be intermittent and difficult to trouble shoot. (Hughes Satellite lost spacecraft due to tin whiskers)
c. Solder joint life for tin lead has been studied for many more years than lead-free.
d. The long term life of lead-free solders is still to be determined in actual use.
2:30PM – 3:30PM
Stencil Nano-coating: Filtering the Fact from the Fiction
Speaker TBA, StenTech
Stencil nano-coating has been promoted in the US for more than 4 years… but many questions remain as to when and where these techniques and products can and should be implemented. As a key figure who helped to promote and bring attention to this technology in the USA, Eric Moen hopes to answer many questions as to the benefits, uses, and effectiveness of utilizing stencil nano-coating for improving solder paste printing yields. What are the optimal conditions for nano-coating? When should nano-coating not be used? Where is the proof of the effectiveness of nano-coating? How long will the nano-coating last? The purpose of this presentation is to help in answering these and many other questions relevant to the topic of stencil nano-coating.