Thursday, July 13, 2017
Location: Embassy Suites Cleveland Rockside
5800 Rockside Woods Boulevard
Independence (Cleveland), OH 44131
The Ohio Valley Expo & Tech Forum has SOLD OUT!
Please contact Emily to be put on a wait list at email@example.com or call 952-920-7682. Thank you!
The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early registration pricing ends on June 16th, 2017!
Important Exhibitor Materials:Exhibitor Details
Hard Copy of Exhibitor Reg Form
Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.
Online registration is now closed. Please register on site.
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Thursday, July 13, 2017
A Special Thank You To Our Breakfast Sponsor:
A Special Thank You To Our Coffee Sponsor:
A Special Thank You To Our Technical Session Sponsor:
Modeling an SMT Line to Improve Throughput
Greg Vance, Sr. Project Engineer, Rockwell Automation
One of the major challenges for an electronic assembly manufacturing engineer is determining how a SMT machine will impact throughput. Typically an SMT equipment supplier will ask for few (5-10) products to simulate the throughput capability of their machine. Unfortunately, if the engineer works in a high mix low volume environment he may need to know the impact of a new machine on a 1,000 or more products. Currently there are a lack of simulation tools to model this. This is confirmed in the IPC Technology Roadmap for Electronics Interconnections 2015 it states “In order to better deal with the demands for increased interconnection density and respond to market demands for better return on capital investment in assembly equipment, there is a need within the manufacturing industry for continued improvement in tools and software for modeling and simulation. Needs in this area include better methods of load balancing and improved machine utilization? The tools for determining the balance on assembly lines will need to be flexible to handle the mix of assembly types that manufacturers now face.”
Rockwell Automation partnered with Universal Instruments to develop a tool to model a large quantity of products and the impact of SMT line configurations. The information used for the modeling includes placement per panel information and machine components placed per hour capability. With these tools an electronic assembly plant can be modeled and analyzed to identify improvement opportunities and perform “what if” analysis to model impact of machine changes.
12:00 PM–1:00 PM
Free Hot Lunch!
A Special Thank You To Our Lunch Sponsor:
Advances in Stencil Technology for Achieving Successful Printing Results
Chrys Shea, Shea Engineering Services
Fresh from the SMTA International Conference, Chrys is bringing the latest research and development in stencil printing to address important questions from the users’ perspective:
• How does nanocoating help the print process? Is it worth the cost?
• Will high tension stencils improve print quality?
• When should Type 5 solder paste be considered for fine feature printing?
• What’s the difference between wet wiping and dry wiping?
• Do wiper parameters, papers, solvents and sequences make a big difference?
• What are the new methods of making stepped stencils?
• What is the role of wall roughness in the print process?
Come to this presentation to:
• REVIEW the data
• SEE the photos
• WATCH the videos
• LISTEN for tips and tricks that will help your process
If you couldn’t get to the SMTA International conference, the latest published research is coming to you!
Highlights of technical studies published by AIM, KYZEN, Shea Engineering Services, MET, FCT, and a 4-company New England consortium will be included in the presentation.