In making the announcement, Brian Watson, Founder, said, “Our manual and automated taping systems allow for flexible, reliable, and quick service as per industry standards EIA-481-E.  Additionally, armed with the addition of automated tape forming process and a broad inventory of taped pockets—including hard-to-find component pockets—we can readily support a variety of component package types.”

These include SMT (surface mount, pocketed reels made with embossed and punched carrier and cover tape), inside paper tape spacing for capacitors, punched paper tape for leads, and we offer in-house pocket design and tool services for non-standard shaped components.

Other services include Component Laser marking and bar coding, GEIA-STD-0003 and JEP160 Long Term Storage packaging, J-STD-033 Dry bake and MSL packaging, and Custom Thermoformed Trays.

“In every tape and reel or packaging project,” Brian continues, “Our expert team carefully chooses the appropriate materials to prevent loading/unloading issues and electrostatic discharge (ESD) failures in sensitive electronic parts.”

About HYREL Technologies

Based in Santa Ana, California, Regal Technology Partners provides engineering and manufacturing services for aerospace and defense programs, supporting applications across air, land, sea, and space platforms. The company focuses on high-mix, mission-critical electronics manufacturing, including circuit card assemblies, cable and harness systems, and complex box builds within ITAR-controlled and AS9100-certified environments.

The new Hanwha equipment adds both speed and flexibility to Regal’s production floor. "In this latest investment, Regal is now operating with 100% Hanwha equipment to stay industry-leading and to produce highly reliable CCAs, all while being implemented and live within four days,” said Scott Lantiegne, Operations, VP at Regal Technology Partners, Inc. “A four-day install with zero disruption to our production schedule speaks to the strength of the partnership and gives our team the throughput and consistency our defense and aerospace customers depend on."

The SM481 Plus is designed for high-speed chip placement, giving the line the throughput needed for large volumes of standard SMT components while maintaining placement accuracy. Paired alongside it, the SM485 Plus expands the line’s capability to handle a wider range of component types and board configurations, including larger and odd-shaped parts commonly found in aerospace and defense assemblies.

The addition of the 10-zone reflow oven provides tighter thermal control and more stable soldering profiles across different products and build requirements. Together, the systems give Regal more control over throughput, process consistency, and overall line efficiency.

Hanwha Semitech Americas and PMR Representatives supported the installation and startup, working alongside the Regal team to get the line up and running.

Regal Technology Partners expressed appreciation for the support and collaboration from both teams throughout the project.

For more information about Regal Technology Partners, visit www.regaltechnology.com.

For more information about Hanwha Semitech, visit www.hanwhasemitech.com/en/.

About Hanwha Semitech Americas:
Hanwha Semitech Americas is a leading global provider of precision manufacturing and technology solutions. Renowned for its innovative approach and cutting-edge technology, Hanwha Techwin is committed to driving advancements in the electronic manufacturing industry, supporting manufacturers worldwide in their pursuit of global competitiveness.

“This collaboration brings together the teams’ advanced research capabilities and deep materials expertise to address a critical gap in the U.S. supply chain,” Indium Corporation President and CEO Ross Berntson said. “By focusing on scalable, data-driven solutions, we’re confident our work will enable more reliable gallium access for the industries that depend on it—and position Indium Corporation at the forefront of a domestic supply chain that is increasingly vital to U.S. semiconductor and electronics manufacturing.”

“There are currently no domestic gallium production and no complete U.S. gallium supply chain,” said Ames Lab scientist and project leader Long Qi, an expert in chemical separations and catalysis. “The partnership goal is to change that, and the effort aligns well with the Department of Energy’s mission to develop critical materials production here.”

In the U.S., gallium is recovered as a byproduct of well-established, high-volume aluminum refining operations. Called the Bayer process, this method uses caustic liquids and high temperatures to extract and refine aluminum from raw ore. Gallium is typically present in the refining process waste in low concentrations of about 100 parts per million.

“Despite the low concentrations, we see an opportunity to develop a process that efficiently separates and extracts gallium as an additional high-value material from aluminum production,” Berntson said. “Indium Corporation’s experience as a materials refiner and smelter, and Ames Labs’ specialized techniques are the perfect union to make this happen.”

Liquid-based refining methods typically use specialized polymers, called resins, that can separate and concentrate metals from mining solutions. For this project, Ames Lab researchers are designing a heat-stable, efficient resin that is selective for gallium.

Ames Lab’s innovative robotic lab capabilities can carry out a large number of experiments and generate high-quality data quickly. When paired with AI tools, the data can be rapidly analyzed to uncover patterns, optimize processes, and guide the iterative design of materials. These accelerated workflows can shrink the development timeline from decades to as little as two to three years.

“By using our automated chemistry capabilities and AI tools, we can generate over 100 data points daily for our AI model,” Qi said. “This dramatically accelerates our timeline for developing a solution that surpasses current industry-leading materials.”

Scaling the technology is a joint effort, which will be done through a Cooperative Research and Development Agreement (CRADA): Indium Corporation will provide a U.S. resin testbed that mirrors high-volume production and techno-economic models to define the required material properties, and Ames Lab will synthesize materials up to the hundreds-of-grams scale. Future scale-up to kilograms and tons will continue collaboratively.

“This work is an important step toward unlocking new value from existing industrial processes,” said Robert Ploessl, Indium Corporation Product Manager for Metals and Compounds, and CRADA lead for the company. “By combining innovative materials development with practical scale-up pathways, we’re helping lay the groundwork for more resilient and sustainable sourcing of gallium and other critical elements.”

About Indium Corporation

Indium Corporation^® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil^®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

Alongside the live demos, Inovaxe will also be highlighting its new InoHD™ platform through video walkthroughs and on-site discussions. The system takes a different approach to a familiar problem—floor space.

InoHD™ replaces traditional storage aisles with servo-driven mobile shelving combined with smart sensing and pick-to-light technology. The result is dense storage without sacrificing accessibility. Operators can access materials directly where they’re needed, with built-in verification to help prevent picking mistakes.

In terms of capacity, the system is designed to store 10,560 SMT reels within a compact footprint of 8 ft x 4 ft, while still maintaining fast, guided retrieval. For manufacturers working with limited space—or trying to avoid expanding it—that kind of density can make a noticeable difference.

Inovaxe team members will be on-site throughout the event to walk through both systems, answer questions, and talk through how smart storage can fit into different production environments, from smaller operations to high-mix, high-volume lines.

Attendees are encouraged to stop by to see the LS350 in action and learn more about how Inovaxe is rethinking material storage on the factory floor.

To learn more, visit www.inovaxe.com

“I was glad to visit Cirtronics last week to see firsthand the work they are doing to drive innovation in critical fields like robotics and medical technology and discuss how we can continue to grow these important industries in New Hampshire,” said Governor Ayotte. “I appreciated the opportunity to reconnect with the team after working with Cirtronics during my time in the private sector and to hear how their employee stock ownership model continues to invest employees in the company’s success. Companies like Cirtronics have helped make our state a hub for advanced manufacturing, and we’ll continue working to create a talent pipeline through our community colleges and workforce training programs to support them.”

The Governor, who served on the company’s board during her time outside of government, addressed employees and toured the manufacturing floor during her visit. Governor Ayotte and company leadership also emphasized a shared commitment to growing advanced manufacturing in the Granite State, including building a talent pipeline through workforce training programs and the community college system.

“We were thrilled to welcome Governor Ayotte back to Cirtronics last week. Having previously served on our Board, Kelly uniquely understands our culture and our focus on advancing technology and manufacturing innovation,” said Cirtronics CEO Pat Moody. “We were proud to show her firsthand how our employee stock ownership model (ESOP) continues to empower our team to drive that innovation forward. Cirtronics fully shares her vision for growing New Hampshire’s advanced manufacturing sector, and we look forward to partnering with her administration to build a strong talent pipeline through regional workforce training and community colleges.”

https://www.cirtronics.com/governor-ayotte-visits-cirtronics/

With increasing resolutions, frame rates, and heterogeneous interfaces, the complexity of testing camera and imaging systems is growing. Video Dragon 6222 addresses this challenge head-on and impresses with a modular hardware design, flexible sideband communication, and intuitive application software. The use of project-specific interface units, such as pin adapters, enables flexible implementation and a precise connection to the respective applications. Developers, test engineers, and production managers thus gain a powerful solution for reliably testing stability during continuous operation, interface compatibility, and timing.

Video Dragon 6222 combines a frame grabber and frame generator in a single device. This allows incoming video streams from high-resolution cameras to be recorded, visualized, and analyzed. It also enables the output of test patterns and videos with freely configurable resolution, color formats, and frame rates. As a “man-in-the-middle,” Video Dragon can integrate into existing systems without affecting their behavior. This flexibility enables rapid debugging of prototypes, objective verification of production products, and long-term and stress testing under realistic conditions. The modular architecture reduces integration effort and ensures investment security, as new interfaces can be added as needed.

The included Dragon Suite software offers a clear, intuitive user interface that provides access to all hardware functions—without any programming effort. The cross-hardware interface G-API is available for integration into custom applications. It maps all hardware functions and enables rapid automation, e.g., in validation environments, production test benches, or HIL systems.

The Video Dragon 6222 product family includes three models that cover all use cases:

·         G CAR 6222 (standalone device): Ideal for lab, mobile testing, and flexible setups

·         G PCIe 6222 (PCI Express card): Directly in the test PC, high data density, and automation

·         G PXIe 6222 (PXI-Express module): Optimized for modular test systems and fully automated production lines

These variants enable end-to-end deployment—from the developer’s workstation through validation test benches to production testing.

LVDS | Automotive Test - GÖPEL electronic

About GÖPEL electronic

GÖPEL electronic develops and manufactures innovative electrical and optical test, measurement, and inspection equipment for electronic components and printed circuit board assemblies as well as industrial and automotive electronics systems. GÖPEL electronic has four business units:

- Automotive Test Solutions

- Embedded JTAG Solutions

- Inspection Solutions AOI-AXI-SPI-IVS

- Industrial Function Test

The company is active worldwide, with its own subsidiaries as well as through distributors, and generated sales of approximately 40 million euros in 2023 with 240 employees.

Further information: www.goepel.com/en

The presentation, titled Addressing Advanced Packaging Thermal Challenges: Innovations and Applications of Metal Thermal Interface Materials, will systematically showcase, through practical application cases, how TIMs performance breakthroughs can be realized through alloy composition optimization, interface structure design, and precision processes, thereby enhancing thermal efficiency and ensuring the long-term stable operation of AI and high-performance computing devices.

Leo Hu is a senior area technical manager for East China and is based at Indium Corporation’s Suzhou facility. In this role, he manages the regional technical support team and partners with the company’s global organization to provide customer product and application solutions. Hu has 20 years of experience in semiconductor packaging, specializing in advanced assembly technology development, process improvement, and assembly materials applications. He has presented multiple technical articles at global forums and academic conferences and serves as a member and reviewer for the China SMTA Technical Advisory Committee. Hu holds a master’s in integrated circuit engineering from the Institute of Computing Technology, Chinese Academy of Sciences, and a bachelor’s in science from Nankai University.

FINE 2026 visitors can attend Hu’s presentation on June 11, at 9:40 a.m. China Standard Time (UTC+8). To learn more about Indium Corporation’s complete portfolio of TIMs solutions, visit indium.com.

About Indium Corporation

Indium Corporation^® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil^®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another^® (#FOETA), at www.linkedin.com/company/indium-corporation/.

This event successfully gathered approximately 140 attendees, comprising industry professionals, customers, strategic partners, and ViTrox employees. It attracted representatives from various leading companies and industry players from the manufacturing, semiconductor, electronics, and industrial automation sectors. The strong participation and positive engagement throughout the event further reinforced ViTrox’s position as a leading technology innovator committed to advancing smart manufacturing ecosystems, accelerating Industry 4.0 transformation, and fostering long-term collaboration across the industry.

A major highlight of the event was the series of technical sharing sessions conducted by ViTrox and ViE’s engineering experts, who presented ViTrox’s and ViE’s latest innovations and key solutions, including:

• ●VisionXpert XC-100 Series Smart Camera: A compact and intelligent vision inspection solution designed for industrial automation. Featuring a palm-sized design and 180° rotatable connector, it enables flexible integration in space-constrained environments.
• ●VisionXpert XC-330 Smart Camera: An advanced version of the smart camera series, engineered with imaging intelligence, processing capability, and system integration flexibility. Key features include a scalable resolution up to 26.2MP with C-mount optical flexibility for high precision imaging and advanced defect detection capability. Equipped with an expanded software suite of 134+ flexible tools with deep learning, Python scripting, and advanced grouping, supporting complex inspection logic.
• ●V-Trace Solutions: A powerful solution that integrates smart inspection with end-to-end traceability to improve operational efficiency. VisionSmartCheck is an automated product verification solution that identifies defects to prevent them from moving downstream, while VisionSmartGuide is a vision-powered manual assembly assistance system designed to ensure zero-error production through real-time process validation and guidance.
• ●V-ONE Manufacturing Intelligence Solutions Towards Industry 5.0: V-ONE with Agentic AI is a smart manufacturing platform that digitises, automates, and autonomously optimises operations. By combining real-time data visualisation with goal-driven autonomous AI agents, it delivers predictive insights, full end-to-end traceability, closed-loop self-correction, and scalable, self-executing workflow automation to support a resilient, human-centric, Industry 5.0-ready manufacturing ecosystem.
• ●ViCAT(EtherCAT) Solutions — Precision in Motion, Power in Control: A full lineup of high-precision EtherCAT products, including EtherCAT Master, I/O cards, motion controllers and Illumination controllers engineered for industrial automation that delivers deterministic real-time communication with microsecond-level cycle execution and precise network synchronisation.
• ●Autonomous Mobile Robot (AMR) Solutions: A major highlight by ViE Technologies was the demonstration of the Autonomous Mobile Robot (AMR). The AMR is a self-guided platform that utilises SLAM (Simultaneous Localisation and Mapping) for autonomous transport, supporting efficient payload lifting and handling operations while enhancing safety and control during movement. AMR is central to automating material transport and streamlining production workflows in smart factory automation environments.

These sessions provided visitors with deeper insights into ViTrox and ViE’s advanced technologies, practical industrial applications, and the commitment to driving smarter and more connected manufacturing ecosystems.

In addition, the event also featured a live demonstration session showcasing automation solutions, inviting external guests to experience firsthand the seamless integration of vision and motion. Attendees witnessed the VisionXpert Smart Cameras and Smart Code Readers, V-ONE 5.0 and AMRs operating in a real-world manufacturing environment, demonstrating how these technologies work in sync to boost operational efficiency.

Beyond technology showcases and product launches, the event also served as a strategic engagement platform that fostered meaningful discussions, technical knowledge exchange, and networking opportunities among industry practitioners, technology leaders, and manufacturing stakeholders. The strong participation and highly positive response throughout the event reflected the increasing demand for integrated smart manufacturing ecosystems capable of addressing evolving industrial challenges.

Alongside its continuous drive for technological innovation, ViTrox also places strong emphasis on talent development as a core pillar of long-term growth. This commitment was further reinforced through dedicated knowledge-sharing initiatives during the event. In a dedicated sharing session titled 'Bridging Talent with Industry Excellence,' presented by Dr. Sung from ViTrox Academy, which highlighted that 72% of employers face challenges in sourcing skilled talent. It emphasised ViTrox Academy’s role in addressing this gap through specialised technical training in product development and manufacturing process engineering, supporting the development of industry-ready talent for smart manufacturing.

The successful conclusion of the event further reinforces ViTrox’s commitment to driving innovation in smart manufacturing while building stronger connections across the industrial ecosystem.

About ViTrox Technologies

ViTrox is committed to being the World’s Most Trusted Technology Company and the leading solutions provider through the most innovative, advanced, and cost-effective, excellent-quality machine vision solution to its customers by integrating ViTrox’s technologies, people, and strategic alliances.

ViTrox offers a full spectrum of solutions, ranging from  Middle & Back-end Semiconductor Inspection Solutions, SMT PCB Assembly Vision Inspection Solutions, Integrated Industrial Embedded Solutions, and Manufacturing Intelligence Solutions Towards 5.0. ViTrox is headquartered in Penang, Malaysia, with regional offices in Asia, Germany, the United States, and is supported by a global network of sales and support sites.

Space hardware presents a unique challenge. Unlike many commercial products, there are very few opportunities for "we'll fix it later." Once hardware leaves the ground, assumptions become expensive and uncertainty becomes unacceptable.

Datest helps customers reduce that uncertainty.

Supporting organizations from prototype development through production and failure investigation, Datest provides a broad portfolio of services including In-Circuit Testing (ICT), Flying Probe Testing and Programming, Boundary Scan/JTAG, Automatic X-Ray Inspection (AXI), 3D CT Scanning, and Failure Analysis services designed to identify issues before they become mission risks.

A primary focus at Space Tech Expo Anaheim will be Datest's advanced CT scanning capabilities utilizing its VJ Technologies 225kV CT system. The technology supports highly detailed, non-destructive internal inspection and 3D reconstruction of complex components and assemblies, enabling engineers to uncover hidden defects, evaluate internal structures, and validate critical hardware without physically sectioning or destroying the part.

Datest's CT capabilities are backed by fast lead times, flexible project support, and decades of electronics-focused X-ray and failure analysis experience. "Space hardware has a tendency to keep secrets," said Rob Boguski, Owner of Datest. "Fortunately, we've made a career out of finding them."

Attendees are encouraged to stop by Booth 439 and discuss prototype validation, pre-production sampling, contract and supplier compliance requirements, and high-reliability aerospace components.

For more information about Datest and its advanced test engineering and inspection services, visit: Datest | Home

The collaboration focuses on high-throughput server board manufacturing, a sector requiring the highest levels of quality and defect detection. TRI's advanced inspection solutions ensure high precision and stability for complex server printed circuit board assemblies (PCBAs), optimizing production line yields and minimizing downtime.

Equipped with cutting-edge software and robust mechanical platforms, TRI's smart factory solutions deliver comprehensive inspection coverage tailored for the demanding telecommunication and server industries. This partnership reinforces TRI's commitment to supporting industry leaders with world-class test and inspection technology.

For more information about Wiwynn’s plant expansion, please visit source.

The AQUANOX line of aqueous cleaning chemistries, including AQUANOX A4618, from KYZEN are formulated to meet all manner of electronics cleaning challenges removing solder flux residues and their concentrations are effectively monitored by the KYZEN ANALYST² RI.

AQUANOX A4618 is a groundbreaking aqueous cleaning chemistry designed to address the challenges of cleaning contemporary lead-free flux residues, including no-clean residues, while achieving immaculate, mirrored solder finishes. It is formulated to effectively clean all flux types and boasts a long tank life and outstanding materials compatibility in addition to high efficacy at lower concentrations and temperatures.

KYZEN ANALYST² RI uses advanced sapphire-based Refractive Index Technology to measure concentration in real-team, providing more precise measurements than other sensors with its on-device process analysis and traceability. KYZEN ANALYST² RI provides fast and stable measurements of chemistries, produced by KYZEN and other providers, all reported to 0.1% resolution.

For 35 years, KYZEN has developed innovative chemistries like AQUANOX A4618 in addition to effective concentration monitoring tools like KYZEN ANALYST² RI, which fit seamlessly into a variety of electronics cleaning processes and provide effective cleaning performance.

SMarTsol Technologies, a leading provider of automation solutions, specialized consumables, and technical support for the high-tech industry, officially announced it has received two prestigious awards from the global consultancy Great Place To Work® (GPTW) Mexico in its 2026 edition.

The company ranked #17 in the 50 to 500 employees category (Multinationals). Concurrently, reflecting its ongoing commitment to gender equity and inclusive professional development, the organization achieved #9 in the national Great Place To Work® for Women ranking within the same multinational category.

Talent as the Driving Force of Advanced Manufacturing

With a 14-year track record in the market, SMarTsol has built its expansion upon a clear corporate philosophy: cutting-edge technology and innovation on production lines only make sense when backed by an exceptional human team.

"This achievement belongs entirely to the SMarTsol family; we celebrate and appreciate their boundless passion and talent," stated Ivan Romo, CEO and Director of SMarTsol Technologies. Referring to the impact of this internal culture on the company's operations, Romo highlighted the maxim that guides the firm's workplaces: "Our vision has always been to dream, sow, create, and grow together."

The GPTW® validation comes at a time of strong operational consolidation for SMarTsol. Currently, the organization optimizes the production processes of the continent's most demanding industrial sectors—such as automotive, electronics, medical devices, metal mechanics, aerospace, and defense—thanks to a robust portfolio and strategic alliances with global leading partners in SMT, advanced inspection, and robotics, such as ASMPT, Koh Young, Creative Electron, and Kurtz Ersa, to name a few.

Transnational Infrastructure and Local Support

Beyond cultural recognition, SMarTsol reaffirms its market positioning through a high-proximity infrastructure network. The company boasts a strategic presence with corporate offices and advanced technology demonstration centers in key industrial hubs: Guadalajara (HQ), Ciudad Juárez, Tijuana, Monterrey, and Querétaro, alongside direct operations in the United States through El Paso and its newly opened facility in Dallas.

This logistical network guarantees comprehensive coverage across Mexico, the United States, and Central America, delivering specialized technical support focused on maintaining operational continuity and efficiency for transnational manufacturing plants.

The company also extended its deepest gratitude to its customers and business partners, noting that the trust placed in its engineering solutions serves as the daily inspiration driving its culture of innovation and continuous improvement.

For more information about SMarTsol Technologies, please visit www.smartsol.mx

Through the use of Indium Corporation’s WS-575-C Ball-Attach Flux, ASE successfully lowered the cleaning water temperature in the standard BGA ball-attach process from the typical 50–60°C to room temperature, approximately 35°C. The change not only enhanced energy efficiency by reducing electricity consumption and carbon emissions but also maintained the same high standards of cleaning quality. This approach delivered estimated savings of:

• 157,680kWh/year lower electricity use
• 1,643.4 t CO₂ reduction in annual carbon emissions
• Approximately $440,000/year (U.S.) in economic benefit

“Manufacturers are facing increasing pressure to achieve greater reliability and performance without compromising their sustainability goals,” Sze Pei Lim, Senior Global Product Manager – Semiconductor and Advanced Materials, said. “We acknowledge our responsibility to support our customers by developing products that align with these objectives.

“With innovative solutions like WS-575-C, whose residue can be easily cleaned with room-temperature water, we help reduce energy consumption, enhance efficiency, and minimize environmental impact, all while delivering the reliable performance our customers rely on.”

Environmental responsibility is embedded in how Indium Corporation operates and innovates. The company continues to expand its portfolio of solutions that support global sustainability initiatives while delivering strong performance and reliability. Read the Indium Corporation 2025 Sustainability Report for more information.

Photo caption: Favien Chen (right), Indium Corporation Area Sales Manager (Taiwan), accepted the Sustainability Award from ASE CEO Tien Wu.

About Indium Corporation

During the exhibition, Essemtec will present live demonstrations of its FOX Ultra All-in-One and PUMA Ultra All-in-One platforms, highlighting the company’s expertise in advanced dispensing, high-speed jetting and hybrid packaging applications.

As electronic devices continue to become smaller, more powerful and increasingly complex, manufacturers are facing growing demands for precision, flexibility and process integration. Essemtec’s solutions are specifically designed to address these challenges, supporting applications such as Chip-on-Chip, System-in-Package (SiP), Package-on-Package (PoP), advanced component stacking and other hybrid assembly processes.

Particular focus will be placed on Essemtec’s advanced jetting and dispensing technologies for fine-pitch and advanced packaging applications, including 008004 pad sizes and pitches as fine as 0.3 mm. The live demonstrations will highlight high-speed solder paste jetting capabilities reaching up to 1.1 million dots per hour, as well as precise dispensing of epoxy and silver epoxy materials.

Essemtec’s solutions support a wide range of advanced processes including underfill, meter-mix dispensing, micro coating, cavity dispensing and dispensing at different Z-levels for complex substrates and advanced assemblies. The company’s platforms are also designed to support leadframes and carriers, enabling high-precision manufacturing for hybrid packaging and next-generation electronic applications.

By combining high-accuracy placement, advanced dispensing technologies and Jet-on-the-Fly capabilities within flexible All-in-One platforms, Essemtec enables manufacturers to optimize floor space, reduce handling and increase process efficiency for prototyping, NPI and high-mix production environments.

“Hybrid packaging and advanced dispensing applications require an exceptional level of flexibility, accuracy and process control,” said Jacky Zhou (周杰), Country Sales Manager China. “At NEPCON Shanghai, we are excited to demonstrate how Essemtec’s All-in-One solutions help manufacturers address these new production challenges while maintaining efficiency, scalability and process versatility.”

Visitors to Booth 1H70 will have the opportunity to discuss their manufacturing challenges with Essemtec and Intellengine specialists and discover solutions for advanced SMT assembly, dispensing, jetting and hybrid packaging applications.

For more information about Essemtec’s solutions, visit Essemtec and Intellengine.

At this year’s event, PVA will co-exhibit with Dymax, highlighting how equipment and materials can work together to solve real production challenges in battery manufacturing. The focus is straightforward: making automated processes more reliable, repeatable, and easier to scale.

On display will be PVA’s Delta 6 system, configured with FC100-MC and FCS300-ES coating valves and the PathMaster X software platform. The setup will be used to demonstrate a range of applications, including conformal coating, encapsulation, staking, and masking—using Dymax materials.

Rather than showing isolated capabilities, the goal is to walk through how these processes actually come together on the production floor. From protecting sensitive components to managing material placement and coverage, each step plays a role in the overall reliability of battery systems.

PVA has been working in dispensing and coating automation for more than 30 years, and that experience is increasingly being applied to battery manufacturing. As designs evolve—especially in EV and energy storage—requirements around precision, repeatability, and long-term durability continue to tighten.

The company’s approach centers on building systems that can adapt. Whether it’s cell-level bonding, thermal interface material dispensing, or final assembly protection, PVA focuses on giving manufacturers the control they need without adding unnecessary complexity.

Members of the PVA team attending the event include Rod Kasperson, Vice President of Global Sales & Marketing; Jon Urquhart, Director of Applications Engineering; Christian Lubascher, Europe Sales Manager; Krzysztof Kin, Customer Service Engineer; and Paul Kim, Regional Sales Manager for Asia Pacific.

Visitors to The Battery Show Europe are encouraged to stop by the PVA and Dymax exhibit to see the system in operation and discuss how automated dispensing and coating solutions can be applied to battery production challenges.

For more information, contact PVA at info@pva.net or (518) 371-2684, or visit www.pva.net.

This partnership focuses on navigating the complexities of Industry 4.0, combining Jabil’s manufacturing expertise with ViTrox’s smart technology to drive operational agility and data-driven decision-making.

Addressing Traditional Manufacturing Challenges

Prior to adopting V-ONE, especially with the V-ONE Control Tower feature, the technical team handled machine fine-tuning and troubleshooting directly on the production floor. This manual approach often required engineers to be physically stationed at individual machines, leading to potential bottlenecks and delays during programming adjustments. The lack of centralised, real-time data visibility made it challenging to monitor performance across multiple production lines simultaneously.

Optimising Operations with Remote Integration

The implementation of V-ONE has created flexibility on the manufacturing floor. By leveraging remote Automated Optical Inspection (AOI) programming, Jabil’s engineers can now manage operations across multiple systems simultaneously from a central location. This transition has led to:

• ●Enhanced Productivity: Reduce machine downtime by streamlining programming workflows.
• ●Operational Agility: Engineers are able to address system alerts without interrupting live production, reducing costs while enhancing inspection performance.

Enhancing Quality Control with Data-Driven Insights

V-ONE functions as a centralised system for real-time monitoring and detailed defect analysis. Jabil’s quality teams utilise the platform to:

• ●Track Metrics: Maintain consistent quality by visually tracking FPPM and DPPM performance against daily benchmarks.
• ●Enhance Visibility: Access instant equipment status updates to ensure optimal resource allocation across the entire production line.
• ●Foster Seamless Collaboration: Utilise the VVTS tool to enable engineers and technicians to review 3D and golden images concurrently, ensuring rapid and precise troubleshooting.

"V-ONE's remote AOI programming has been a game-changer, allowing us to manage multiple lines centrally and reduce our troubleshooting time," said Justin Barr, Operation Director at Jabil. "This collaboration positions us advantageously for future opportunities and long-term success."

"This successful deployment at Jabil serves as a global benchmark, confirming V-ONE's potential to drive large-scale digital transformation initiatives across complex manufacturing environments," noted Benjamin, ViTrox Global Account Manager. "We are proud to support their journey toward a more connected and efficient manufacturing environment."

This project represents a significant milestone in our enduring partnership, paving the way for future large-scale digital transformation initiatives.

The company will feature the following products:

Flip-Chip Flux:

• NC-809 is a no-clean, ultra-low residue, ball-attach flux. Its dual-purpose engineering provides high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications.
• WS-446HF Flux is a robust, halogen-free, water-wash flux designed to provide one simple solution to complicated applications, especially those with a single cleaning step, for both BGA ball-attach and flip-chip processes. Its powerful activator system promotes good wetting on even the most demanding substrate metallizations, such as Cu OSP, ENEPIG, and ENIG. Its rheology is suitable for dipping flip-chip applications, as well as pin transfer or printing BGA ball-attach applications, for sphere sizes 0.25 millimeters and above. WS-446HF helps to improve production yield by minimizing non-wet open defects, missing balls, and electrochemical migration.

   

  Sintering Paste:

• InBAKE™29 is a Cu sinter paste developed for power discrete die-attach applications and applications requiring high thermal conductivity, high electrical conductivity, and high service/operating temperatures. It is specifically designed for pressureless, batch oven sintering.
• SiPaste^® C312HFis a cleanable solder paste formulated for fine-aperture printing applications. This material exhibits optimum transfer efficiency with consistent printing stability after continuous use and a long stencil life of at least four hours without dry-out. Its benign, non-corrosive residue can remain post-reflow without cleaning or be easily removed with semi-aqueous or saponifier technology.
• InFORCE^®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE^®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers. 

   

  Thermal Solutions:

• Durafuse^® HT is an innovative high-temperature lead-free paste that is ideal for discrete power electronics devices. Durafuse^® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than those of a high-Pb solder. 
• Solder Thermal Interface Materials (sTIMs) deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1,000 watts. Optimized for BGA package applications, sTIMs enable low-void, high-reliability performance across multiple reflow cycles, ensuring thermal stability. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, sTIMs enhance battery life, reduce cooling fan size, and minimize heat-sink mass while maintaining RoHS compliance and supporting sustainability initiatives.
• Heat-Spring^® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring^® avoids pump-out and bake-out problems and offers a sustainable solution through the company’s metals and compounds reclaim and recycle program.
• Heat-Spring^® HSx is a compressible, non-reflow metal TIM designed for large-area dies with warpage of 200 microns or more. It delivers 16W/mK thermal conductivity at just 20psi, making it ideal for test heads with clamping forces of 30psi or less. Available in thicknesses from 300microns to 1 millimeter, it can be customized with or without a diffusion barrierto prevent die staining.

To learn more about Indium Corporation’s semiconductor packaging and assembly solutions, visit indium.com or meet with our company experts at ECTC 2026, booth 240.

At the event, Aven will showcase its MicroVue 2.0 All-In-One Digital Microscope, giving attendees a chance to get hands-on with a system built for real-world inspection, rework, and quality control.

Designed for PCB inspection, solder joint evaluation, and component analysis, MicroVue 2.0 delivers high-resolution imaging in a compact, all-in-one setup. The built-in 13.3-inch HD monitor eliminates the need for external screens or eyepieces, making it easier to use and easier on operators during long inspection sessions.

The system also includes a magnetic ring light with interchangeable 365nm UV lighting and sector control, helping bring out defects, contamination, and fine surface details that can otherwise be hard to spot. With extended working distance, fine focus control, and integrated software for image capture and measurement, it’s a practical tool for both production floors and lab environments.

Aven’s focus with MicroVue 2.0 is simple: make inspection clearer, faster, and more consistent without adding complexity.

If you’ll be at the show, stop by and see it for yourself—visit Aven at the SMTA Ontario Expo & Tech Forum and take MicroVue 2.0 for a test drive.

For more information, visit www.aventools.com.

As assemblies get denser and more complex, especially with large BGAs and stacked designs, inspection isn’t as straightforward as it used to be. During the event, Bill Cardoso, Creative Electron President & CEO, dug into what’s changing—and what manufacturers are running into on the floor.

“BIG BGAs aren’t just about size,” Cardoso said. “They’re about what’s hidden underneath. As things get more compact and more layered, you need better ways to actually see what’s going on inside.”

That shift is driving more interest in X-ray and CT-based inspection. Creative Electron develops both planar X-ray and 3D CT systems designed to give manufacturers a clearer view into complex assemblies—from traditional SMT to advanced packaging and stacked devices.

The company’s approach is built around flexibility. Its systems are modular, allowing customers to scale capability based on application needs—whether that’s higher resolution, larger sample sizes, or more advanced analysis. That matters in environments where product designs change quickly and inspection requirements don’t stay static for long.

Headquartered in San Marcos, California, Creative Electron designs and builds its X-ray and CT inspection systems in the United States, supporting customers with direct access to engineering, applications, and service teams. Its platforms are used across electronics manufacturing, semiconductor applications, and other industries where non-destructive inspection is critical.

The discussion at Technica also highlighted the importance of collaboration. Through its partnership with Technica USA, Creative Electron works closely with manufacturers to apply inspection technology in practical, production-focused ways.

As electronics continue to evolve, the need for clear, reliable inspection data isn’t going away—it’s becoming more central to how products are built and qualified.

For more information, visit www.creativeelectron.com.

As power devices such as IGBTs and MOSFETs continue to drive innovation in automotive, industrial, and energy applications, manufacturers are facing increasing pressure to improve reliability while reducing process complexity and cost. KOKI’s E-Series addresses these challenges with what is recognized as the industry’s first true zero flux residue solder paste platform.

Engineered specifically for power semiconductor applications, the E-Series eliminates the need for post-reflow cleaning by leaving virtually no flux residue. This is particularly important in processes such as wire bonding and molding, where even minimal contamination can impact yield and long-term device performance. By removing this variable, manufacturers can achieve greater process stability and confidence in downstream operations.

Beyond process simplification, the E-Series delivers measurable cost advantages. By replacing traditional solder preforms and conventional solder pastes, manufacturers can reduce both material usage and overall production costs by as much as 50% without compromising performance. The formulation is optimized for ultra-low voiding, supporting improved thermal management and enhanced reliability in high-power applications.

Available in multiple alloy compositions and powder sizes, the E-Series supports both stencil printing and dispensing processes, offering flexibility across a wide range of manufacturing environments.

“At PCIM, the conversation is centered around performance, efficiency, and reliability in power electronics,” said Johan Wallentin. “The E-Series was developed with those exact priorities in mind, helping manufacturers simplify their process while improving the performance of their devices.”

Visitors to PCIM Europe 2026 are invited to meet the KOKI team in Hall 6, Booth 345 to learn more about how the E-Series is redefining soldering performance for power semiconductor applications.

About KOKI

Founded in 1964, KOKI is a global leader in advanced soldering materials, focused on innovation, sustainability, and regulatory compliance. In addition to its materials portfolio, KOKI offers in-depth technical services and analytical support to help customers optimize soldering performance across a wide range of applications worldwide.

A third-generation, family-owned business with more than 60 years of experience, The Murray Percival Company is well known throughout the PCB and electronics assembly industry for its technical knowledge and strong customer relationships. The company supports manufacturers with a broad range of assembly equipment, materials, and production solutions, along with a focus on helping customers improve processes and maximize return on investment.

Through this partnership, Murray Percival will represent VJ Electronix’s full line of solutions, including automated rework systems, X-ray inspection platforms, and component counting systems. The goal is simple—provide local support and help manufacturers solve real production challenges with practical, proven technology.

“Bruce Clark and the Murray Percival team bring a deep understanding of the industry and a long track record of supporting customers the right way,” said Don Naugler, General Manager at VJ Electronix. “Their approach aligns well with how we work, and we’re looking forward to building on that in the Midwest.”

Bringing Murray Percival on board gives VJ Electronix a stronger local presence in a region with a solid base of electronics manufacturing, making it easier for customers to access support and expertise when they need it.

VJ Electronix continues to grow its North American rep network to stay closer to customers and respond more quickly.

Hosted by SMTA, the STAR Forum (Strategic Technology Advancement Research) brings together industry professionals to explore critical topics at the intersection of trade, research, and technology. The 2026 program will address advancements in electronics manufacturing, artificial intelligence, automation, supply chain resilience, and sustainable global trade practices.

Dayney’s presentation will examine the transformation of manufacturing from early mechanization through today’s connected, data-driven smart factories. Attendees will gain insight into how Industry 4.0 technologies—including automation, digitalization, and intelligent systems—are reshaping production environments to improve efficiency, flexibility, and quality.

“Understanding how factories have evolved provides important context for where manufacturing is headed,” said Dayney. “Smart factory initiatives are no longer theoretical—they are actively driving improvements in productivity, traceability, and decision-making across the electronics industry.”

The session will highlight practical considerations for implementing smart factory strategies, including integration challenges, data utilization, and aligning technology investments with business goals.

The STAR Forum offers a collaborative environment for sharing knowledge and addressing emerging challenges in global manufacturing and trade. Fuji America’s participation underscores its ongoing commitment to advancing innovation and supporting customers in navigating the next generation of manufacturing technologies.

About Fuji America Corporation

Fuji America Corporation is a recognized leader in SMT pick and place solutions and smart factory automation. The company is committed to advancing modern manufacturing through high speed, high precision placement machines and intelligent software. With decades of innovation in vision processing and part recognition, Fuji’s robotic electronic component mounters continue to set industry standards for quality, performance, and reliability.

Contact:
Fuji America Corporation
Phone: 847 821 2400
Email: inforequest@fujiamerica.com
Website: www.fujiamerica.com

Through this partnership, Horizon Sales will support the promotion and technical sales efforts of KOKI’s advanced solder materials portfolio, including high-reliability solder pastes, low-silver alloys, flux-cored wire solder, and next-generation solutions designed for demanding electronics manufacturing applications.

With decades of experience supporting the SMT and electronics assembly industries, Horizon Sales has built a strong reputation for technical expertise, responsive customer support, and deep relationships throughout the manufacturing community. The partnership strengthens KOKI’s ability to provide localized technical support and application guidance to customers throughout the territory.

“KOKI’s philosophy has always centered around developing products that solve real manufacturing challenges while supporting customers with strong technical expertise,” said Greg Starrett, National Sales Manager of KOKI Solder America. “Horizon Sales shares that same customer-focused approach, and we are excited to work together to support manufacturers throughout these regions.”

“We are excited to partner with KOKI Solder America and bring their advanced solder technologies to our customers,” said Josh Casper, Owner of Horizon Sales. “KOKI has built a strong reputation for both product performance and technical support, and we look forward to helping manufacturers improve reliability, efficiency, and process consistency.”

For more information about KOKI Solder America and its complete line of soldering materials, visit: https://koki-global.com/

In low pressure molding applications, material degradation and carbon buildup can gradually accumulate within melt tanks, hoses, and system components during normal operation. If left unmanaged, this buildup can negatively impact material flow, create cosmetic part defects, introduce shot inconsistency, and increase the likelihood of unexpected equipment interruptions.

To support long-term equipment reliability and process stability, LPMS recommends routine purging and cleaning of low pressure molding systems every 80–300 hours of heat cycles, depending on production volume and material consumption. Higher throughput operations and increased material usage may require more frequent maintenance intervals.

“Customers often focus on the molding process itself, but the condition of the system plays a major role in production consistency,” said Brian Betti of LPMS USA. “Preventive maintenance is one of the simplest ways to improve part quality, reduce variability, and maximize machine uptime.”

LPMS offers dedicated maintenance solutions designed specifically for low pressure molding equipment, including SPECTRA-MELT^® OMEGA PURGE 200 and 225 purge materials. These thermoplastic polyamide purge materials are engineered to help remove loose carbon particles and residual material from tanks, hoses, and equipment while supporting smoother material and color changeovers.

Unlike reactive cleaning chemistries, the SPECTRA-MELT® OMEGA PURGE materials provide a controlled purge process designed to maintain flow consistency and support ongoing equipment performance without introducing unnecessary process risk.

Routine maintenance can provide manufacturers with several operational benefits, including:

• Improved process consistency
• Reduced scrap and rework
• Cleaner material and color transitions
• Reduced unplanned downtime
• Extended equipment reliability and longevity

As low pressure molding continues to expand across electronics, automotive, medical, industrial, and waterproofing applications, maintaining stable and repeatable processing conditions has become increasingly important for manufacturers focused on quality and efficiency.

For more information about LPMS USA maintenance solutions and low pressure molding technologies, contact sales@lpms-usa.com or visit our website: Low Pressure Molding Material | Spectra-Melt | LPMS

About LPMS USA

LPMS USA, the leading global provider of low pressure molding equipment, delivers innovative solutions for protecting electronics across the automotive, medical, and industrial industries. Offering over 15 customizable platforms, extensive equipment inventory, and turnkey services, including engineering, tooling, and material selection with a focus on quality, efficiency, and innovation. From R&D to high-volume production, LPMS USA ensures reliability and performance for even the most demanding applications, such as waterproofing electronics.

For more information about the LPMS USA, visit www.lpms-usa.com

As Malaysia’s premier exhibition for the metalworking, machine tool, and automation industries, METALTECH & AUTOMEX provides the ideal stage for ViTrox to showcase smart manufacturing innovations, including vision solutions, intelligent traceability systems, and digital factory connectivity solutions designed to enhance operational efficiency and production quality.

For manufacturers in the metal and fabrication sectors, the transition to Industry 4.0 can often seem complex. ViTrox’s showcase focuses on "Humanised Intelligence"—user-centric solutions that simplify the digital journey and deliver trusted results.

V-ONE: The Intelligent Digital Ecosystem

Manufacturing Intelligence Solutions Towards Industry 5.0 - V-ONE serves as the digital foundation for Industry 4.0, offering real-time data connectivity and advanced analytics.

• ●[Connect] VisionXpert Smart Camera (XC Series): Enables high-speed, accurate inspection with seamless integration into production environments. Powered by a robust built-in processor and a comprehensive suite of ready-to-use vision tools, this small-footprint device performs computations directly at the source, enhancing quality control through reliable and consistent inspection performance.
• ●[Connect] VisionXpert Smart Code Reader (XS Series): Provides fast, accurate code reading in production lines, ensuring reliable automated identification and improving traceability with stable performance.
• ●[Visualise] V-ONE 5.0 App Builder: An intuitive, low-code platform that empowers users to create custom Industry 4.0 applications using simple drag-and-drop visual tools. By seamlessly converting complex factory data into tailored, actionable insights, it facilitates the rapid deployment of solutions designed to optimise manufacturing workflows.
• ●[Visualise] DIMo – Tablet Version (Job Intelligence): A cloud-based Planning and Scheduling system for precision engineering, manages work orders and production tracking digitally. Paired with DiMo interactive devices, it enhances coordination between the shop floor and planning teams.
• ●[ProAct] VisionSmartCheck: A newly launched solution that acts as your line's digital gatekeeper, powered by the VisionXpert Smart Camera. It replaces subjective manual checks with traceable automated inspection, seamlessly pushing data from the smart camera to the server for complete end-to-end traceability.
• ●[ProAct] VisionSmartGuide: A vision inspection solution powered by AI video processing that provides real-time guidance and SOP inspection. It actively error-proofs manual assembly at the source and closes the loop with your MES, ensuring only correctly assembled products advance down the production line.
• ●[ProAct] Prompt Support (for Digital Analytics, ERP & MES): V-ONE Prompt Support is an AI assistant that transforms industrial data into actionable insights via natural language interaction, enabling real-time troubleshooting and production analysis.
• ●[CCC] MES & ERP Integration: Enterprise Resource Planning (ERP) serves as the strategic backbone of the organisation, integrating critical business functions like finance, procurement, and sales to ensure seamless data flow. Complementing global objectives, the Manufacturing Execution System (MES) delivers real-time visibility and control over the production floor, translating high-level orders into precise, monitored actions that maximise shop-floor efficiency.  

Additionally, our sales and technical experts will share other innovative solutions, including our latest light sources and controllers, during the exhibition.

ViTrox also warmly invites visitors to join our Technical Sharing Session on 21 May 2026 (Wednesday) from 3.30 PM - 4.00PM presented by Mr Vernon Chean Lynn Chii. The sharing titled: “ViTrox V-ONE - Manufacturing Intelligence Solutions: Smart Manufacturing with Vision . AI . Robotics”, will highlight how vision, AI, and robotics enable intelligent and efficient manufacturing.