ZESTRON Presented at the SMTA SE Asia Technical Conference in Penang
Manassas, VA - May 25, 2011 - Umut Tosun, Application Technology Manager at ZESTRON, the worldwide leading provider of high precision cleaning products and services for the electronics manufacturing industry, presented "Fluid Flow Mechanics – Key to Low Standoff Cleaning" at the SMTA's South Asia Technical Conference in Penang, Malaysia, on May 19th, 2011.
The well attended session, hosted by Jenson Lee of Flextronics, addressed the challenges of cleaning today's intricate board geometries. More than five years ago, ZESTRON first discussed cleaning underneath 4 MIL standoff components. With the emergence of lead-free solder and flux as well as a miniaturization of components and an increase in board densities, the latest challenges include components with less than 1 MIL gaps.
The presented study was designed to specifically investigate the impact of mechanical vs. chemical energy during the removal of contamination under 1-2 MIL standoff components. To validate the results obtained, extensive experiments were conducted, including actual user case studies, specifically prepared test assemblies, iterative experimentation, as well as new mechanical innovations that might help customers in the future. These included but were not limited to various flow patterns and industry leading cleaning agents. As a result, the authors also included experimental data that addressed fluid flow mechanics as well as temperature and concentration related effects.
For more information on this and other electronics cleaning topics, please contact ZESTRON's Application Technology Department at (703) 393-9880 or visit www.zestron.com.
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