Indium Corporation's Dr. Lee to Present at SMT/Hybrid/Packaging
Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present two tutorials at SMT/Hybrid/ Packaging exhibition and conference in Nuremberg, Germany, May 3-5, 2011.
The first tutorial, Solder Defects for Advanced SMT Manufacturing - Formation Mechanisms and Troubleshooting, will explore new challenges engineers face with the advancement of the electronics industry and approaches to prevent solder defects.
The second tutorial, Materials Selection for Lead-Free Soldering, covers the detailed material considerations required for lead-free soldering, including how to select proper solder alloys and surface finishes for achieving high reliability.
Indium Corporation is also participating in the exhibition at stand 7-430.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.