News Archive

UP Media Group Issues Call For Presentations For Virtual PCB 2011


10/20/2010

SMYRNA, GA - UP Media Group Inc. seeks abstracts for the fourth annual VIRTUAL PCB, the industry's only virtual trade show and conference for the PCB design, fabrication and assembly markets. The free two-day worldwide event takes place March 8-9, 2011. 
 
Presentations and moderated chats are sought for the technical conference, while papers are sought for the Virtual Resource Center.  
 
Suggested presentation and moderated chat topics include RF and microwave design; high speed, high frequency and signal integrity; screen printing; component placement; soldering; EMI/EMC analysis; thermal analysis; lead-free processes; environmental legislation (REACH, RoHS, etc.) and its effects; packaging design; mixed-signal design; area arrays; FPGA design and implementation; embedded passives and active devices; flexible circuitry; HDI design and technologies; PCB design/layout basics; component library creation and management; design for manufacture, test and assembly; PCB fabrication; surface finishes; industry forecasts, and business and supply chain issues. 
 
Presentations should be roughly 30 minutes to one hour in length. Please note presentation length when submitting an abstract. Accepted papers will be offered as downloadable pdfs in the Virtual Resource Center. 
 
Presentations and papers must be noncommercial in nature and should focus on technology, techniques or methodology. Abstracts of 300 words or less should be submitted to conference co-chairs Pete Waddell (pwaddell@upmediagroup.com) or Mike Buetow (mbuetow@upmediagroup.com) by Dec. 27. If selected, final papers and presentations will be due Feb. 1, 2011. 
 
Moderated chats are 30-minute or one-hour chat room discussions on a specific topic. These interactive forums are led by an expert in a particular technology and, unlike the lecture environment of a presentation, are intended to spur direct dialogue with users.  
 
PRINTED CIRCUIT DESIGN & FAB and CIRCUITS ASSEMBLY magazines are media partners for the event, which this year drew more than 2,900 registrants and 1,600 attendees from around the world.
 
A fully interactive, Web-based event, VIRTUAL PCB (virtual-pcb.com) incorporates all the critical features of a live event, while allowing PCB design, fabrication and assembly equipment and materials buyers and sellers to interact online. VIRTUAL PCB is supported by a proven software platform (provided by INXPO), and will be accessible on-demand for one month beyond the free two-day live event.
 
For more information about VIRTUAL PCB, visit virtual-pcb.com or contact Alyson Skarbek, show manager, at 404-665-7749 or askarbek@upmediagroup.com. 

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