News Archive

High Accuracy Die Bonder on Display at IMAPS 2009


10/16/2009

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 515 at the upcoming IMAPS 2009 exhibition, scheduled for November 3-5, 2009, at the San Jose Convention Center in San Jose, Calif.

The motorized configuration of the FINEPLACER® Lambda, which will be exhibited during IMAPS, provides auto-touchdown and die placement, as well as controlled bonding operation after manual alignment of die and substrate. Advantages of this system include hands-off die placement, process reproducibility, placement of die with dimensions that exceed the optical field of view and up to 10 programmable microscope positions. Additionally, the bonder is upgradeable with an integrated microscope.

Applications for the FINEPLACER® Lambda include eutectic, Indium and Au/Sn soldering, thermo compression, thermo-/ultrasonic bonding, and adhesive technologies. The process flexibility of this system makes it ideal for prototyping and R&D.

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