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LORD CORPORATION'S STAPLETON TO SPEAK AT INTERNATIONAL WAFER-LEVEL PACKAGING CONFERENCE


10/07/2009

Cary, NC – Oct. 7, 2009 - LORD Corporation - a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics industry - has announced that Russell Stapleton, Ph.D., Staff Scientist, will speak at the International Wafer-Level Packaging Conference (IWLPC).

To be held in Silicon Valley, Calif. on October 27-30, Stapleton will be presenting a research paper that he co-authored on the "Reliability of 400mm Pitch WLCSP Assemblies with Solder Supporting Material." The co-authors are Jeff Schake of DEK USA Inc., Michael Meilunas of Universal Instruments Corporation, and Rex Anderson, Ph.D. of Amkor Technology.

The paper will detail research regarding a wafer level solder supporting material that was jet dispensed. The jetting method proved to be a simplified method for quickly applying and evaluating wafer level protective materials in the laboratory setting.

Stapleton received his B.S. in Polymer Chemistry from Rochester Institute of Technology in 1999 and his Ph.D. in polymer science from the University of Akron in 2004. His background is in polymer synthesis, organometallics and kinetics. He has been with LORD Corporation's Electronic Materials Technology group since 2004 and has authored several papers and patents in the area of electronic packaging adhesives and coatings.

The event will take place at the Santa Clara Marriott, located in Silicon Valley. Stapleton will be speaking at Session 13 on Friday, Oct. 30 from noon to 1 p.m. in the Exhibit Hall. To register, please visit www.iwlpc.com/register_now.cfm.

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