LORD CORPORATION DEVELOPS NEW EPOXY MATERIAL THAT OFFERS NXP SEMICONDUCTOR COST REDUCTION
(Cary, NC – Jan. 21, 2009) - LORD Corporation, a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics industry, has announced the availability of a new epoxy adhesive/sealant.
Developed for NXP Semiconductor, formerly Philips, the material, Thermoset® MA-511, is a one component thixotropic epoxy material designed for use as either an adhesive or a sealant in microelectronic applications requiring high-speed dispensing. According to Arnita Podpod, Project Engineer for NXP Semiconductor, they sought a reworkable, low-modulus, non-slumping, high-speed dispensing adhesive for cap sealing (clear and green caps) their CATV module. The previous materials used by NXP were not suitable for all cap types and therefore didn’t provide strong enough adhesion. Key objectives for the new project included cost reduction and material standardization.
LORD extensively tested MA-511 and it passed all reliability tests for clear caps, an area in which NXP had previously experienced problems. Further, since MA-511 can be applied via an automated dispenser, they no longer experience tailing issues. The material cures rapidly, offers excellent adhesion to a variety of plastics and its thixotropic rheology allows shape to be maintained after dispensing.