SMTA International Conference Sneak PreviewTechnical committee dedicated to world-class program
The SMTA proudly announces the formation of the SMTA International Technical Committee for 2006. The SMTA will again co-locate its world-class SMTA International conference (September 26-28) with Assembly Tech Expo (ATExpo) in Chicago, IL, at the Donald Stephens Convention Center.
The 2006 team of industry professionals includes Gerry Adams, Dade Behring; Donald Banks, 3M Company; Dr. Dan Baldwin, Engent, Inc.; Mike Buetow, Circuits Assembly Magazine; Dr. Srinivas Chada, Medtronic; Dr. John Evans, Auburn University; Gail Flower, SMT Magazine; Rich Freiberg, ZF Array Technology; Dr. Reza Ghaffarian, Jet Propulsion Labs; Dr. Ken Gilleo, ET-Trends LLC; Steve Greathouse, Intel Corporation; Jeff Kennedy, Celestica; Andrew Mawer, Freescale Semiconductor; and Dr. Paul Vianco, Sandia National Labs.
They will be led by veteran conference chair, RadiSys process engineering manager Rob Rowland. Rowland is the primary author of the book Applied Surface Mount Assembly, and he is also editorial advisory board member of and contributor to SMT magazine. Rowland has conducted classes for the SMTA Academy and the SMTA annual conferences at SMI and SMTA International.
Tracks for this year’s conference include Emerging Technologies, Process Control, Soldering, Advanced Packaging, SMT Manufacturing and Assembly, Business, and PCB Technology. A major emphasis of this year’s technical program will be on “What’s Next?” Special events will include a full day DfE (Design for Environment) workshop as well as a full day mini-conference on “Staying Competitive.” The keynote lunch address by Jon Vardaman, Tech Search International will focus on “What’s Driving Trend in IC Packaging for the Future?” New paper sessions include 3D packaging, stacked packaging, backward compatibility, alternate alloys, copper erosion, conformal coating, six sigma and tin whiskers.
The ever-popular Lead-free Symposium will include participation from the JCA/JCPP Consortia, and the Emerging Technologies Summit will include sessions of Nanotechnology, MEMS/MOEMS, wireless, RFID and the always popular ET panel of industry experts.