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Indium Corporation Wins Global Technology Award

World’s first reworkable, air reflowable, Pb-free no-flow underfill
12/02/2005

Visit the SMTA corporate member detail page in the Member Directory for Indium Corporation Indium Corporation has received the Global Technology Award for its NF260 No-Flow Underfill. Sponsored by Global SMT & Packaging magazine, the award recognizes product excellence and innovation in semiconductor packaging and electronics assembly. It was presented at Productronica in Munich, Germany.

NF260 is the world’s first reworkable, air reflowable, Pb-free no-flow underfill. It is designed for chip scale package (CSP) and BGA or flip-chip assemblies using a single reflow process. NF260 offers both a fluxing and underfilling capability for the chip, while providing increased reliability and environmental protection. Designed for Pb-free assembly, NF260 is fully compatible with the SMT process and offers a wide process window to accommodate solder reflow and underfill curing. The underfill curing is completed in one reflow pass and no post-cure is required. NF260 reduces costs when compared to capillary flow underfills, and also achieves higher yields.


Two trends are converging and driving the need for more advanced PCB assembly materials:

  • Pb-Free: Higher soldering temperatures make no-flow underfilling more difficult, while greater solder rigidity makes underfilling more necessary.
  • Miniaturization & Portability: Portability demands greater crack-resistance in drop tests, hence a greater need for underfilling.


  • NF260 satisfies both these needs. To learn more about NF260 visit the Indium Web site. Also visit the SMTA corporate member detail page in the Member Directory for Indium Corporation.

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