Position: Director of Engineering Development Reports to: Chief Operating Officer
Company Overview Corfin Industries (www.corfin.com) is a leading provider of component preparation services to the Aerospace, Defense and Industrial/Commercial sectors. With +20% CAGR over the past five years and strong financials, Corfin is well positioned to become the platform of a much larger company that will grow organically, as well as through the acquisition of adjacent technologies and vertically integrated processes.
With current proprietary technology and processes, Corfin’s Robotic Hot Solder Dip (RHSD) process is proven to safely mitigate the risk of tin whiskers by robotically refinishing Pb-free COTS component terminations with tin-lead (SnPb). This process eliminates the tin whisker risk, restores solder joint reliability and refinishes components to reliable defense industry standards. While RHSD is the core business today, Corfin also offers gold mitigation services, BGA re-balling, trim and form services, re-conditioning of leads and lead-attachment.
As Director, position has overall engineering design and development responsibility for Corfin Industries component preparation services; works closely with the leadership team to develop strategy, lead continuous improvement efforts, and manage performance standards in building a best-in-class industry operation.
Essential Duties and Responsibilities
Provide strategic development, guidance, direction and oversight to an engineering team to plan and coordinate daily activities, and meet performance expectations. Direct, plan, and implement policies and objectives to increase operations productivity and maximize return on investments. Provide mentorship and coaching to enhance individual and organizational technical knowledge and capabilities. Develop and/or expand manufacturing processes and services to help the company scale and improve the overall value of the business. Meet or exceed company goals and cost objectives through management and oversight of engineering development and sustaining activities. Exceptional judgment and decision-making skills. Self-directed with the ability to lead, take charge, and offer opinions and direction. Good listener with the ability to communicate information, ideas, and feedback verbally and in writing so others clearly understand. Support a work environment of continuous improvement, where the fundamentals of lean manufacturing and process control are actively practiced with measurable results and sustain a culture of continue improvement through team member participation. Conceive, direct, plan, and implement new equipment and solder plating processes to increase automation, productivity, and maximize return on capital investments. Establish manufacturing / processing design standards – ensure compliance. Create, design, & source process equipment tooling, dies, & component handling devices. Design, organize, and source robotic equipment tooling such as grippers, manifolds, & hand tools. Apply broad experience with manufacturing processes and controls; Demonstrate ability to architect and manage new process development / qualification activities. Research equipment, supplies, & technologies to evaluate best-in-class processing solutions; Research emergent semiconductor process technologies and impart into business. Coordinate w/ Sales, Quality, Engineering, & Production to comprehend customer make-to-order quote requests & determine Corfin ability to comply w/ customer specifications; Resolve conflicts between customer requirements and company capabilities to ensure alignment with capabilities to RFQ’s. Provide applications support to customers; facilitate audits and technical exchanges with customers. Conduct product validations on custom make-to-order requirements. Investigate new vendors for outsourcing applications & quality and reliability testing. Ability to draft engineering white papers, authoritative, in-depth report(s) on industry related topics which can be utilized to advance and promote company IP / design methodologies. Participate in industry working seminars and help define industry regulations and standards. Works with integrity and ethical business practices. Security Clearance is a plus.
Education Requirements / Work Experience:
B.S. degree – materials science (i.e. metallurgy), and/or related chemistry / mechanical degree. Knowledge of SnPb & SAC305 solders, robotic hot solder dip processes. +10 years of experience in related semiconductor assembly and/or PCB assembly operations with demonstrated successive levels of managerial growth. Intimate knowledge of semiconductor packaging technologies. Working knowledge of GEIA-STD-0006, MIL-STD-883, AS9100, ISO quality standards. Demonstrated working knowledge and use of quality tools: DOE, PFMEA, SPC, etc. Working knowledge of Solidworks and/or related engineering 3D design / CAD tools. Established written and verbal communications skills. Senior management level experience in a low volume/high mix build to print or contract manufacturing environment. Managing growth in a technical environment, preferably from within the defense and aerospace industries. Demonstrated ability to develop constructive, long-term customer and supplier relationships.
Serious candidates only: send resume to email@example.com