Electronics Industry News

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Online SMT Auction (September 20th and 21st) Featuring Items From TX Solutions

TX Solutions has decided to liquidate some of their surplus and unused assets.
Baja Bid and FabExchange will be conducting an online auction to sell this equipment.
The bidding for this event will open on September 20 at 6:00 am PDT and will begin closing on September 21 at 2:00 pm PDT. 
 
Featured Items Including: Juki FX-1R SMT Pick & Place, TRI 3D Solder Paste Inspection, Camalot FX-D Dispensing System, Focal Spot X-Ray, Assorted Conveyors, Nutek PC Board Handler And More!!!
 
Auction preview will take place on September 18 – 19 2017 from 9am – 5pm. Click here to view the complete line of items currently up for auction.
 
Any questions about the event should be directed to Arlin Horsley (813) 992-2437.





SHENMAO Technology, Inc. introduces New Generation Lead-free Zero Halogen Solder Paste at SMTAI

SHENMAO Technology, Inc. introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.
 
SHENMAO PF606-P245 improves ICT testability with flux completely removed from top of solder to prevent contamination of Test Pins during Test operation. Minimal Flux Residue gathers near outside of Solder Joint on the PCB Substrate, a substantial improvement over legacy solder Paste.
 
For more than 44 years, SHENMAO has been dedicated to produce Solder Products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preform, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.
 
SHENMAO Solder Materials are available at affordable cost from 10 worldwide locations.
 
For more information, please contact: SHENMAO America, Inc. www.shenmao.com Tel: 408-943-1755 e-mail: usa@shenmao.com





ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

MEDINA, MINNESOTA - September  2017 - ASC International, a leading global manufacturer of 3-D solder paste inspection (SPI) and automated optical inspection (AOI) systems, today announced that it will exhibit at the SMTA International Expo, Booth 1412, on September 19-20, 2017 at the Donald E. Stephens Convention Center in Rosemont, IL.

ASC International will provide live demonstrations of their industry leading SPI and AOI solutions.  Product innovations will be highlighted by the LineMaster Fusion offering the industry’s only true 3D offline SPI /AOI combination package - all wrapped up into a price point similar to single technology platforms. The VisionPro HSi with recent sensor advancements now capable of high speed, 100% inspection coverage and the VisionPro M500 offering the industry’s standard for an affordable approach to cutting edge true 3D bench top SPI. 

"We are very excited to once again be part of the SMTA International Expo," stated Steve Arneson, National Business Manager.  "ASC continues to advance our mainline products and the recent release of our LineMaster Fusion is a testament to our relentless commitment of offering our customers the most affordable inspection solutions possible."  

The VisionPro  and LineMaster series of inspection systems  incorporate the most  advanced, rapid 3D/2D sensor technologies coupled with a feature-rich, intuitive graphical user interface all packaged in a rugged, bench-top or stand alone platform.   

For more information about ASC International, visit www.ascinternational.com





SHENMAO Introduces New Solder Paste at SMTAI

SHENMAO Technology, Inc. introduces New Generation Lead-free Solder Paste PF606-P140. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues and can easily fit into highly complicated PCB designs through excellent convergence performance.

SHENMAO PF606-P140 improves ICT testability with flux completely removed from top of solder to prevent contamination of Test Pins during Test operation. Minimal Flux Residue gathers near outside of Solder Joint on the PCB Substrate, a substantial improvement over legacy solder Paste.

For more than 44 years, SHENMAO has been dedicated to produce Solder Products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.

SHENMAO Solder Materials are available at affordable cost from 10 worldwide locations.

 

For more information, please contact:

SHENMAO America, Inc. www.shenmao.com Tel: 408-943-1755 e-mail: usa@shenmao.com





Naveen Ravindran, ZESTRON Americas, to Present at SMTAI

[Manassas, VA – September 7, 2017] - ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that Naveen Ravindran, M.S.Ch.E, Application Engineer will present “PCB Surface Finishes and the Cleaning Process - A Compatibility Study” at SMTA International 2017, in Rosemont, IL.

 

All PCBs that are manufactured require a surface finish to protect exposed copper on the surface which if left unprotected, can oxidize, rendering the board unusable. To address this issue, it is common to surface treat the PCB prior to assembly and reflow. The surface finish not only prevents oxidation of the underlying copper, but guarantees a solderable surface. However, as circuit complexity and component density have increased, HASL has reached its limitations, necessitating the need for thinner coatings. Thus, coatings such as Immersion Tin, Immersion Silver, Organic Solderability Preservatives, and Electroless Nickel Immersion Gold are becoming more widely used.

Depending on the cleaning process employed, it is possible for stains to appear on the plating or in the worst case, for the plating to be completely stripped from the PCB rendering the applied surface finish useless. This study was designed to investigate the effect of reflow and various cleaning agent types on surface finishes.  Additionally, baseline tests were conducted on boards with all finish types without exposure to reflow or the cleaning process in order to assess the effect of the reflow process.

 

Visit ZESTRON’s booth #215 at SMTA International 2017 where our team will be available to discuss our complete family of PCB and semiconductor defluxing agents.





ZESTRON to Feature HYDRON® Technology at SMTAI

[Manassas, VA – August 21, 2017] - ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce it will feature HYDRON®, our latest single-phase cleaning technology, at SMTA International 2017, in Rosemont, IL.

 

“We are excited to feature our latest cleaning technology at the expo” said Sal Sparacino, Sales & Marketing Manager, ZESTRON. “HYDRON® cleaning agents are single-phase formulations that offer exceptional cleaning performance, and excellent rinseability ensuring the complete removal of flux residues.”

 

HYDRON® products, similar to all ZESTRON’s industry leading solutions, completely remove contaminants from various electronic and semiconductor substrates. This innovative technology is ideal for applications with limited mixing capabilities, offers excellent material compatibility with sensitive materials and extends wash bath lifetimes.

 

Visit ZESTRON’s booth #215 at SMTA International 2017 where our team is available to discuss our complete family of PCB and semiconductor defluxing agents.

 





Announcing Newly Designed Qualitek Website

qualitek_logo.pngThe new and completely redesigned website offers visitors a cleaner more direct experience into product information, company details, services and distributors. We have updated all product information to focus on our latest and award winning products.

Access our new website at the same address qualitek.com

 

 





Sivilay (Nick) Sengmany joins Saki America as application/field service engineer

Fremont, CA - 25 July 2017 - Saki Corporation, an innovator in the field of automated optical and x-ray inspection equipment, announces the selection of Alex Malek as vice president of sales and service for North America and Sivilay (Nick) Sengmany as an application/field service engineer.
Alex Malek
Malek will head sales and service for Saki's 2D and 3D automated optical, 3D automated solder paste, and 3D in-line x-ray measurement and inspection systems in the US and Canada. He will also be actively involved in continuing Saki's development, coordination, participation in, and leadership of the Industry 4.0/Smart Factory initiative.
 
Malek has many years of experience in the global Electronics Manufacturing Services and supply chain markets. Most recently he was president and owner of Operation Excellence Inc., a California Corporation. Operation Excellence provided consulting services for small and start-up high-technology companies in the areas of global operations management, global supply chain management, automation, quality, business development, sales, and marketing. Prior to that he held the positions of senior director of global supply chain and material for Bruker Nano Surfaces, senior VP for global supply chain and material for Flextronics's FlexPower, VP of global business development for Lean Stream, and senior global commodity manager in charge of capital equipment for Sanmina-SCI Corporation. Malek holds a BS degree in Industrial and Systems Engineering from San Jose State University and is a graduate of the Stanford Executive Program from the Stanford Graduate School of Business in Stanford, CA.
 
As part of Saki's growth in North America, Sengmany, who is based in Virginia, has joined Saki to support customers and the Saki team with installation, training, and support of all Saki inspection and measurement systems. Before joining Saki, Sengmany was a process engineer/SMT lead for Sutron, Inc. and a field service engineer for Apex Factory Automation. 
 
"Although Saki has been in business since 1994, we started our Americas expansion in 2014. Since then, we've expanded our facilities, the Saki representative network, and our sales and support team. With increased business in the Americas, and to continue our emphasis on customer satisfaction and local support, we are adding even more application engineers and increasing our sales representative network," explained Satoshi Otake, general manager of SAKI America. "We are excited that Alex has joined our team, as he brings a strong knowledge base and years of experience working with companies of all sizes and a wide array of products and requirements. Along with Nick, we can ensure that Saki customers have the inspection and measurement capabilities they need for success."
 
"I am delighted to be a part of Saki's team," Malek stated. "I have had the pleasure of knowing Saki and its team for many years. I have always been very impressed with their products -- on the hardware side with their reliability, quality, capability, and performance and on the software side with programming, inspection, measurement, imaging, and data capture capabilities. I truly believe that Saki's systems are the best on the market and that they provide the lowest total cost-of-ownership among our competitors. I plan to assure that our customers feel the same."
 
For more information contact Saki at +1.510.623.SAKI (7254), email sales.us@sakiglobal.com, or visit our website at www.sakiglobal.com.
 
About Saki Corporation
 
Since its inception in 1994, Saki has led the way in the development of automatic recognition through robotic vision technology, applying ground-breaking image processing tools to solve inspection problems associated with printed circuit board assembly. Saki Corporation has headquarters in Tokyo, Japan with offices and sales and support centers around the world. Saki has Quality Management System JIS Q 9001:2008 and ISO 9001:2008 certifications.





ZESTRON Celebrates 25 Years of Globally Leading Innovation

[Manassas, VA – July 24, 2017] - ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is celebrating 25 years of innovation. 

 

“Within 25 years, we have grown to be the global leader in precision cleaning due to our unwavering commitment to process improvement,” says Dr. Harald Wack, President of ZESTRON worldwide.  “ZESTRON prides itself on providing electronics manufacturers that have an ongoing need to eliminate long-term reliability concerns as electronics designs continue to increase in complexity, with the latest engineered cleaning agent technological developments for precision cleaning processes available.”


In 1992, Dr. O.K. Wack, founder of ZESTRON, discovered the need for environmentally friendly cleaning agents for the electronics market. Within the next few years, ZESTRON began introducing several aqueous based VIGON® cleaning agents that quickly gained industry attention. With cleaning agent concentrations at 30% or greater at the time, ZESTRON cleaning agent technology performed at concentrations of 20%. In the ensuing years, continued R&D investment in product development reduced working concentrations further resulting in the launch of cleaning agents that performed at concentrations as low as 7%. Additional product developments resulted in the launch of the first true pH neutral defluxing agent in 2009, and the first automatic concentration monitoring unit, the ZESTRON® EYE, in 2013. These industry leading advances enabled our customers to meet their cleaning challenges.

 

In addition to continuous product development, ZESTRON has become the market leader for high precision cleaning solutions by providing unparalleled technical support with the largest team of engineers in the industry. With seven state of the art globally linked Technical Centers located in the Americas, Europe and Asia, and equipped with over 90 cleaning machines from world leading equipment manufacturers, electronics industry OEMs and ECMs can easily and quickly assess multiple cleaning processes for their products to ensure selection of the most effective solution.

 

ZESTRON is proud to be a second generation family owned company now guided by Dr. Harald Wack. In addition to his continued drive for product development to meet the ever increasing cleaning challenges, Dr. Wack is a champion for industry education.  From his passion to share best practices and the latest technological solutions for tough cleaning challenges, he created ZESTRON Academy.  Today, ZESTRON Academy is a global resource accessible around the world to educate the electronics manufacturing industry through customized webinars, workshops and training, either on-site or at the ZESTRON Technical centers.

 

“Our dedication to providing the best process solutions and services is driven by our passion for innovation. On behalf of the entire ZESTRON family, we thank our customers for their loyalty as we could not celebrate such a milestone as this without their support,” says Dr. Harald Wack, President of ZESTRON worldwide.





SHENMAO Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology

SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
 
SHENMAO introduces New Generation Lead-free Solder Paste PF606-P140 and Zero-Halogen Lead-free Solder Paste PF606-P245 with a wide process window, superior print and solderability to solve Head on Pillow issues and improve ICT testability, easily fit into complicated PCB designs through excellent convergence performance.
 
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high-quality sphericity. Various diameters (0.76, 0.65, 0.64, 0.5, 0.45, 0.4, 0.3, 0.25, 0.2, 0.15, 0.1, 0.09, 0.08, 0.075, 0.07, 0.06, 0.055 and 0.05 mm Dia.- 0.045 and 0.040 mm Dia. are in development) are available in SAC305, SAC405 and SAC1205 Alloys at affordable low cost from 10 worldwide SHENMAO locations.
 
As the World's Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Cored Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.
 
For more information, please contact:
SHENMAO America, Inc. www.shenmao.com  Tel: 408-943-1755   e-mail: usa@shenmao.com





RIT Partners with ASM Assembly Systems

RIT is expanding its university/corporate partnership with ASM Systems focusing on next-generation electronics manufacturing, research and workforce development. The partners highlighted projects underway during "Enabling the Digital World: The Future of Electronics and Manufacturing," on June 21, 2017.





SHENMAO Introduces New Low Residue Liquid Flux SMF-B51

SHENMAO Technology. Inc. introduces New Generation Ultra Low Residue Liquid Flux SMF-B51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.

SHENMAO introduces New Generation Lead-free Solder Paste PF606-P140 and Zero-Halogen Lead-free Solder Paste PF606-P245 with a wide process window, superior print and solderability to solve Head on Pillow issues and improve ICT testability, easily fit into complicated PCB designs through excellent convergence performance.

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high-quality sphericity. Various diameters (0.76, 0.65, 0.64, 0.5, 0.45, 0.4, 0.3, 0.25, 0.2, 0.15, 0.1, 0.09, 0.08, 0.075, 0.07, 0.06, 0.055 and 0.05 mm Dia.- 0.045 and 0.040 mm Dia. are in development) are available in SAC305, SAC405 and SAC1205 Alloys at affordable low cost from 10 worldwide SHENMAO locations.

As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Cored Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

 

For more information, please contact: SHENMAO America, Inc. www.shenmao.com Tel: 408-943-1755 e-mail: usa@shenmao.com





Fine Line Stencil and Metal Etching Technology Announce Merger

Lumberton, NJ - Fine Line Stencil (FLS) and Metal Etching Technology (MET) Associates announce they are merging. The new company will be known as BlueRing Stencils. BlueRing Stencils will maintain 8 manufacturing locations across the USA (TX, NJ, NH, CA, FL, IN, MN & NC). Fred Cox of MET has been appointed President of BlueRing Stencils. Mr. Cox said, “We look forward to providing improved technology and greater service to all of our stencil customers. Our combined companies will allow us to offer the latest innovations in SMT stencil printing.”
 
Brent Nolan of Fine Line Stencil had this to say; “FLS and MET are a perfect match. We have different technical solutions that will now be combined. Additionally, our new geography will allow us to reach 90% of the demanding stencil market in 1 day using ground freight.” BlueRing Stencils will provide laser cut and electroformed stencil solutions. They will offer NanoSlic Gold and Microshield coatings, EZ-Step laser welded steps, Mesh-Weld foil bonding, Root Cause Analysis and CAD-matic software solutions, as well as other stencil printing technologies.
 
You can learn more at www.blueringstencils.com





Vision Engineering Launches FREE Electronics Academy Webinar Series to help identity and rectify PCB

Vision Engineering Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar Series aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The 3 part webinar is focused on improving quality and reducing costs through improving the inspection process.

About-Bob-Willis-200px.jpg

The series begins on June 16th with Solder Joint Inspection & Process Defects. During this webinar participants will learn how to minimize inspection and process defects, identify common joint failures, causes, cures and corrective actions. Bob will explain the best ways to inspect solder joints on conventional and surface mount assemblies with reference to international standards (e.g. IPC 610 and IPC J-STD-001). On June 29th Counterfeit Component Inspection & Detection will be broadcasted. Production, quality and purchasing teams will learn how to inspect conventional and surface mount devices to identify counterfeit component and avoid expensive consequences. In this webinar Bob will illustrate the most common issues faced by these teams, how to test parts and demonstrate the importance of photographic documentation to provide reference standards for the future.

The 3 part series closes on July 21st with Conformal Coating Inspection & Coating Faults. The use of conformal coating is growing in popularity. Regardless of application method, either manual or automated inspection is required in most applications, carried out under normal or UV light, with reference to international standards. During this webinar, Bob will cover the inspection of coatings, setting up of inspection standards, as well as the common process defects and corrective actions Bob Willis is a globally-recognized expert in surface mount and area array technology, providing training and consultancy to electronics manufacturers worldwide for over 30 years. Bob regularly speaks at international events, providing expert knowledge to improve skills and knowledge for electronics production staff and engineers. For more information on the Electronics Academy Webinar or to register visit www.visioneng.com/electronicswebinar





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