Electronics Industry News
Online SMT Auction (September 20th and 21st) Featuring Items From TX Solutions
SHENMAO Technology, Inc. introduces New Generation Lead-free Zero Halogen Solder Paste at SMTAI
ASC International to Highlight 3D AOI/SPI Innovations at SMTA International
MEDINA, MINNESOTA - September 2017 - ASC International, a leading global manufacturer of 3-D solder paste inspection (SPI) and automated optical inspection (AOI) systems, today announced that it will exhibit at the SMTA International Expo, Booth 1412, on September 19-20, 2017 at the Donald E. Stephens Convention Center in Rosemont, IL.
ASC International will provide live demonstrations of their industry leading SPI and AOI solutions. Product innovations will be highlighted by the LineMaster Fusion offering the industry’s only true 3D offline SPI /AOI combination package - all wrapped up into a price point similar to single technology platforms. The VisionPro HSi with recent sensor advancements now capable of high speed, 100% inspection coverage and the VisionPro M500 offering the industry’s standard for an affordable approach to cutting edge true 3D bench top SPI.
"We are very excited to once again be part of the SMTA International Expo," stated Steve Arneson, National Business Manager. "ASC continues to advance our mainline products and the recent release of our LineMaster Fusion is a testament to our relentless commitment of offering our customers the most affordable inspection solutions possible."
The VisionPro and LineMaster series of inspection systems incorporate the most advanced, rapid 3D/2D sensor technologies coupled with a feature-rich, intuitive graphical user interface all packaged in a rugged, bench-top or stand alone platform.
For more information about ASC International, visit www.ascinternational.com
SHENMAO Introduces New Solder Paste at SMTAI
SHENMAO Technology, Inc. introduces New Generation Lead-free Solder Paste PF606-P140. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues and can easily fit into highly complicated PCB designs through excellent convergence performance.
SHENMAO PF606-P140 improves ICT testability with flux completely removed from top of solder to prevent contamination of Test Pins during Test operation. Minimal Flux Residue gathers near outside of Solder Joint on the PCB Substrate, a substantial improvement over legacy solder Paste.
For more than 44 years, SHENMAO has been dedicated to produce Solder Products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.
SHENMAO Solder Materials are available at affordable cost from 10 worldwide locations.
For more information, please contact:
SHENMAO America, Inc. www.shenmao.com Tel: 408-943-1755 e-mail: email@example.com
Naveen Ravindran, ZESTRON Americas, to Present at SMTAI
[Manassas, VA – September 7, 2017] - ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that Naveen Ravindran, M.S.Ch.E, Application Engineer will present “PCB Surface Finishes and the Cleaning Process - A Compatibility Study” at SMTA International 2017, in Rosemont, IL.
Depending on the cleaning process employed, it is possible for stains to appear on the plating or in the worst case, for the plating to be completely stripped from the PCB rendering the applied surface finish useless. This study was designed to investigate the effect of reflow and various cleaning agent types on surface finishes. Additionally, baseline tests were conducted on boards with all finish types without exposure to reflow or the cleaning process in order to assess the effect of the reflow process.
ZESTRON to Feature HYDRON® Technology at SMTAI
[Manassas, VA – August 21, 2017] - ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce it will feature HYDRON®, our latest single-phase cleaning technology, at SMTA International 2017, in Rosemont, IL.
“We are excited to feature our latest cleaning technology at the expo” said Sal Sparacino, Sales & Marketing Manager, ZESTRON. “HYDRON® cleaning agents are single-phase formulations that offer exceptional cleaning performance, and excellent rinseability ensuring the complete removal of flux residues.”
HYDRON® products, similar to all ZESTRON’s industry leading solutions, completely remove contaminants from various electronic and semiconductor substrates. This innovative technology is ideal for applications with limited mixing capabilities, offers excellent material compatibility with sensitive materials and extends wash bath lifetimes.
Visit ZESTRON’s booth #215 at SMTA International 2017 where our team is available to discuss our complete family of PCB and semiconductor defluxing agents.
Announcing Newly Designed Qualitek Website
The new and completely redesigned website offers visitors a cleaner more direct experience into product information, company details, services and distributors. We have updated all product information to focus on our latest and award winning products.
Access our new website at the same address qualitek.com
Sivilay (Nick) Sengmany joins Saki America as application/field service engineer
ZESTRON Celebrates 25 Years of Globally Leading Innovation
[Manassas, VA – July 24, 2017] - ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is celebrating 25 years of innovation.
“Within 25 years, we have grown to be the global leader in precision cleaning due to our unwavering commitment to process improvement,” says Dr. Harald Wack, President of ZESTRON worldwide. “ZESTRON prides itself on providing electronics manufacturers that have an ongoing need to eliminate long-term reliability concerns as electronics designs continue to increase in complexity, with the latest engineered cleaning agent technological developments for precision cleaning processes available.”
In 1992, Dr. O.K. Wack, founder of ZESTRON, discovered the need for environmentally friendly cleaning agents for the electronics market. Within the next few years, ZESTRON began introducing several aqueous based VIGON® cleaning agents that quickly gained industry attention. With cleaning agent concentrations at 30% or greater at the time, ZESTRON cleaning agent technology performed at concentrations of 20%. In the ensuing years, continued R&D investment in product development reduced working concentrations further resulting in the launch of cleaning agents that performed at concentrations as low as 7%. Additional product developments resulted in the launch of the first true pH neutral defluxing agent in 2009, and the first automatic concentration monitoring unit, the ZESTRON® EYE, in 2013. These industry leading advances enabled our customers to meet their cleaning challenges.
In addition to continuous product development, ZESTRON has become the market leader for high precision cleaning solutions by providing unparalleled technical support with the largest team of engineers in the industry. With seven state of the art globally linked Technical Centers located in the Americas, Europe and Asia, and equipped with over 90 cleaning machines from world leading equipment manufacturers, electronics industry OEMs and ECMs can easily and quickly assess multiple cleaning processes for their products to ensure selection of the most effective solution.
ZESTRON is proud to be a second generation family owned company now guided by Dr. Harald Wack. In addition to his continued drive for product development to meet the ever increasing cleaning challenges, Dr. Wack is a champion for industry education. From his passion to share best practices and the latest technological solutions for tough cleaning challenges, he created ZESTRON Academy. Today, ZESTRON Academy is a global resource accessible around the world to educate the electronics manufacturing industry through customized webinars, workshops and training, either on-site or at the ZESTRON Technical centers.
“Our dedication to providing the best process solutions and services is driven by our passion for innovation. On behalf of the entire ZESTRON family, we thank our customers for their loyalty as we could not celebrate such a milestone as this without their support,” says Dr. Harald Wack, President of ZESTRON worldwide.
SHENMAO Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology
RIT Partners with ASM Assembly Systems
RIT is expanding its university/corporate partnership with ASM Systems focusing on next-generation electronics manufacturing, research and workforce development. The partners highlighted projects underway during "Enabling the Digital World: The Future of Electronics and Manufacturing," on June 21, 2017.
SHENMAO Introduces New Low Residue Liquid Flux SMF-B51
SHENMAO Technology. Inc. introduces New Generation Ultra Low Residue Liquid Flux SMF-B51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.
SHENMAO introduces New Generation Lead-free Solder Paste PF606-P140 and Zero-Halogen Lead-free Solder Paste PF606-P245 with a wide process window, superior print and solderability to solve Head on Pillow issues and improve ICT testability, easily fit into complicated PCB designs through excellent convergence performance.
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high-quality sphericity. Various diameters (0.76, 0.65, 0.64, 0.5, 0.45, 0.4, 0.3, 0.25, 0.2, 0.15, 0.1, 0.09, 0.08, 0.075, 0.07, 0.06, 0.055 and 0.05 mm Dia.- 0.045 and 0.040 mm Dia. are in development) are available in SAC305, SAC405 and SAC1205 Alloys at affordable low cost from 10 worldwide SHENMAO locations.
As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Cored Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.
For more information, please contact: SHENMAO America, Inc. www.shenmao.com Tel: 408-943-1755 e-mail: firstname.lastname@example.org
Fine Line Stencil and Metal Etching Technology Announce Merger
Vision Engineering Launches FREE Electronics Academy Webinar Series to help identity and rectify PCB
Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar Series aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The 3 part webinar is focused on improving quality and reducing costs through improving the inspection process.
The series begins on June 16th with Solder Joint Inspection & Process Defects. During this webinar participants will learn how to minimize inspection and process defects, identify common joint failures, causes, cures and corrective actions. Bob will explain the best ways to inspect solder joints on conventional and surface mount assemblies with reference to international standards (e.g. IPC 610 and IPC J-STD-001). On June 29th Counterfeit Component Inspection & Detection will be broadcasted. Production, quality and purchasing teams will learn how to inspect conventional and surface mount devices to identify counterfeit component and avoid expensive consequences. In this webinar Bob will illustrate the most common issues faced by these teams, how to test parts and demonstrate the importance of photographic documentation to provide reference standards for the future.
The 3 part series closes on July 21st with Conformal Coating Inspection & Coating Faults. The use of conformal coating is growing in popularity. Regardless of application method, either manual or automated inspection is required in most applications, carried out under normal or UV light, with reference to international standards. During this webinar, Bob will cover the inspection of coatings, setting up of inspection standards, as well as the common process defects and corrective actions Bob Willis is a globally-recognized expert in surface mount and area array technology, providing training and consultancy to electronics manufacturers worldwide for over 30 years. Bob regularly speaks at international events, providing expert knowledge to improve skills and knowledge for electronics production staff and engineers. For more information on the Electronics Academy Webinar or to register visit www.visioneng.com/electronicswebinar