Call for Abstracts
Technical Conference: October 9 - October 12
Minneapolis, Minnesota, USA
We invite you to submit an abstract at the industry's largest technical program, the SMTA International Conference! The annual SMTA International Conference brings together professionals around the world to discuss, collaborate, and exchange vital information to further all aspects of the electronic manufacturing industry.
Proposals are also being solicited from individuals interested in teaching professional development courses related to surface mount technology, advanced packaging, and electronics manufacturing.
Upon acceptance into the SMTA International technical program, a full technical paper and discounted speaker registration is required for conference participation.
Call for abstract document and track descriptions found below.
All abstracts submitted for consideration must represent original research that has not been previously published in an industry event or media publication. We believe that this policy ensures that the SMTA International technical conference remains at the forefront of the electronics manufacturing and assembly industry. Accepted speakers will be required to submit a full technical paper and register for the conference at a discounted rate.
Click the image below to view the 2023 SMTAI call for abstracts or click here
Advanced Packaging (APT) Track
The Advanced Packaging Track highlights advances in first level packaging and assembly.
We invite you to submit papers on:
- Innovations in package materials, structures and assembly processes
- Advances in CSP, FCBGA, FCCSP, bumping, 2.5/3D, SiP, PoP, PiP, in homogeneous and other novel integrations
- Component and board level reliability of electronic packaging and other components
- Unique application environments and challenging mission profiles
- Materials improvements or innovations to address reliability or hazardous substance restrictions
- First and second level interconnect, including Cu wire, Ag wire, Copper Pillar, lead finishes, wettable flanks, novel alloys
Test and Inspection (INS) Track
The Test and Inspection (INS) Track considers matters related to ensuring products work as designed, and reliably, in the short-term as well as long-term, at the component, board, subsystem, and full system level.
Topics include, but are not limited to:
- Metrology
- Component Test Methodologies (Wire Bond Pull Strength, Flying Probe and others)
- Component Inspection Methodologies (Optical, X-ray, CT, IR, and others)
- Board Test Methodologies (ICT, Flying Probe, JTAG/Boundary Scan, and derivatives)
- Board Inspection Methodologies (X-ray, AOI, CT-Scanning, CSAM, FTIR, XRF and others)
- Reliability Assessment Methods
- Short-term and Long-term Reliability Testing Methods (HASS, HALT, ESS, Shock/Vibration, etc.)
- Test Data Collection, Aggregation, Interpretation, and Use for Manufacturing Effectiveness and Excellence, Including Industry 4.0 Applications
- System-Level and Custom Test Methodologies (Functional Test, System Test, and Related Topics)
- Failure Analysis and Root Cause Identification Techniques (nondestructive and destructive)
- Test Plan Creation and Implementation and Comparative Risk Analysis of Differing Test Methodologies
- Test Troubleshooting (A Lost Art)
- Test Completeness: Who Decides? How is a Complete Test Expressed and Quantified?
- Reliability: Who Decides What is Reliable, and When? How is Reliability Expressed and Quantified?
- Counterfeit Mitigation Techniques: Inspection Methods and Processes Used to Identify Counterfeit Components
- Case Studies: How Inspection Impacts the Flow of Business as a Cost vs Profit center
High Performance and Reliability (HPR) Track
The High Performance and Reliability (HPR) Track enables the developers and users in the aerospace, defense, automotive, medical, and harsh environment industries to learn about materials and technologies to support the unique needs for these applications. It is intended to bring together the needs of end-users with the capabilities of the research community and the industrial supply base. Examples are the challenges of meeting expanding temperature ranges (-55°C to +150°C/+200°C) with increased vibration, exposure to chemically aggressive environments, vehicle electrification/power electronics, higher package density and demand for extended life.
Specific subject areas include, but are not limited to:
- Alloy and material development for interconnects addressing high performance / high reliability / high value applications
- Soldering, Sintering, Laser reflow, and unique assembly challenges for high reliability requirements
- Materials Selection and Test Methods for high performance and reliability.
- Ruggedization practices for harsh environment applications
- Thermal and mechanical solder joint reliability and predictive modeling.
- Electronic Component Lifecycle Management
- Prognostic Health Management/Monitoring (PHM)
- Impact of Long-term Storage conditions (temperature, humidity) on reliability
- Managing Sourcing Challenges (Counterfeit/Obsolescence)
Participants represent individual companies, industry consortia and working groups, universities, and research institutes. Participant business interests include medical electronics, automotive, and high reliability defense and avionics.
Low Temperature Solder (LTS) Track
The Low Temperature Solder (LTS) Track explores developments in solders that can be reflow soldered below 200°C. The sessions in this track address topics including but not limited to the following topics:
- Alloy development for interconnects addressing low temperature applications, including reliability study results
- Microstructural characterization and structure/property relationships of low temperature materials
- Process development for manufacturing using low temperature solder
Participants represent individual companies, industry consortia and working groups, universities, and research institutes. Participant business interests include low-cost consumer electronics, telecom, high-end computing equipment.
Materials for Electronics (MAT) Track
The Materials for Electronics (MAT) Track showcases and studies new materials used in electronics assembly, including solders, fluxes, substrates, PCB fabrication, reinforcement and bonding. Processability and reliability studies of new materials are included.
The sessions in this track address topics including but not limited to the following:
- PC assembly materials
- PCB manufacture: materials and processes
- Substrate materials for low cost, robustness, 5G, etc
- Plating processes: metallization, inner layer adhesion, or surface finishing
- Other PCB materials or processes: solder mask, nomenclature, alignment/registration advancements
- Innovations in creating electronic circuits from things/materials outside of PCB
Participants represent individual companies, industry consortia and working groups, universities, and research institutes. Participant business interests include low-cost consumer electronics, telecom, high-end computing equipment. Applications in high performance, high reliability, harsh environments are in the HPR track. Component packaging materials are included in the APT track. SnBi and other low temperature solders are in the LTS track.
Manufacturing for Excellence (MFX) Track
The MFX track educates on current project work in several manufacturing process areas. This includes assembly challenges, associated with processing the materials, operation of the machine, process, inspection, box level assembly, and testing.
Share your experiences related to:
- Miniaturization & Cavity board assembly
- Odd form factor
- Increased interconnect density
- DFX for next generation products
- Cleaning and conformal coating challenges and solutions
Automation and Control (e.g. Industry 4.0, Smart Manufacturing, Supply Chain)
- Factory Integration & Industry 4.0
- Lean Six Sigma case studies
- Interesting Failure Analysis and Root Cause Corrective actions
- All aspects of the SMT process (i.e. Screen Printing, Pick and Place, Reflow & Inspection
The MFX sessions aim to bring together expert input and detailed case analysis as well as experiments dedicated to highlight problems and solutions of today and the future.
Interconnect Research and Reliability (IRR) Symposium
The Interconnect Research and Reliability Assessment (IRAR) Symposium is focused on the reliability testing and evaluation of soldered and mechanical interconnects, other attachment interfaces, and novel joining methods. The sessions in this track address topics including:
- Thermal and mechanical attachment reliability at the board and package levels
- Predictive modeling of attachment reliability.
- R&D-oriented work on solder attachment and specific alloy phenomena
- Ball drift, Bi migration or Bi stratification
- Interconnect failure modes
- Specific test topics include but are not limited to results of thermal cycling, thermal shock, vibration, drop/shock,
and bending.
Papers are encouraged that advance the understanding of attachment reliability based on the science of alloy design and development, microstructural characterization, and structure/property relationships.
Participants represent individual companies, industry consortia and working groups, universities, and research institutes.
Technical Innovations (TI) Symposium
The Technical Innovation Symposium includes all manufacturing and materials that innovate the manufacturability and reliability of electronic circuit board assemblies and systems. Papers may be part of a session or combined in a panel or forum on an area of innovation. Could be a spotlight session on the expo floor (invited).
Share your research on:
- Additive Manufacturing
- Unique processes
- Novel materials
- Challenging environments
Women's Leadership Program
An inclusive culture in the workforce increases organization's efficiency and creates a competitive advantage. Join us for the Women's Leadership Program at SMTA International, which aims to promote diversity in engineering fields and a culture of inclusion for women in technical conferences.
Questions?
1. Send an email to speakerinfo@smta.org
2. Call SMTA HQ (+1 952-920-7682)
3. Send your question via the submission form found here.