SMTA International 2020 is a Virtual Event!

Who do I contact with any additional questions?

For conference attendees and speakers, please contact karlie@smta.org
For exhibitors, sponsors and advertisers, please contact expos@smta.org



Access to SMTA International:

On-Demand Conference & Expo: September 28 - October 23, 2020 

Live Virtual Exposition: September 28 - 30, 2020

 


Program scheduled to begin September 28

View the Technical Program Here!

 


 

Future Dates

SMTA International 2021:
Conference: November 1 - 4, 2021
Exposition: November 3 - 4, 2021
Minneapolis, Minnesota, USA
Co-located with MD&M Minneapolis

 



Thank you to everyone who make our 2019 SMTA International such a success!

SMTA International Conference and Exhibition, which took place September 22 - 26, 2019 at the Donald E. Stephens Convention Center in Rosemont, IL, concluded successfully.

View 2019 Photo Highlights!

 

Best Papers from the 2019 SMTAI Conference


"Rich Freiberger Best of Conference" Presentation

Conference attendees voted for the following presenter to receive the 2019 Best of Conference award. The award is based on the conference attendees' rating of each speaker at the technical session.

Mike Konrad, Aqueous Technologies
“IPC's New Cleanliness Testing Standard is Now Active. What's New? What Stays the Same?”


"Best of Proceedings" Papers

1st Place: Chris Gourlay, Imperial College London
“Phase Formation and Solid Solubility in High Reliability Pb-Free Solders Containing Bi, Sb, In”
(Co-Authors: S.A. Belyakov, Imperial College London, B. Arfaei Binghamton University NY, USA & Ford Motor Company CA, USA, C. Johnson, R. Coyle Nokia Bell Labs NJ, USA K. Howell, Nihon Superior Co., Ltd, Suita, Japan)

2nd Place: Richard Coyle, Ph.D., Nokia Bell Labs
“Vacuum Reflow Processing of Ball Grid Array Packages for Reduced Solder Joint Voiding and Improved Attachment Reliability”
(Co-Authors: Charmaine Johnson, Richard Popowich,; Tim Pearson, Dave Hillman, Collins Aerospace; Michael Meilunas, Universal Instruments; Fred Dimock, Bob Bouchard, BTU International; Richard Parker, iNEMI; Keith Howell, Nihon Superior Co., Ltd.; *Jörg Trodler, Dipl.-Ing, Heraeus Electronics; Arvind Karthikeyan, Auburn University; Elizabeth Barr, Iowa State University)

3rd Place: Yoshinori Ejiri, Hitachi Chemical Co., Ltd.
“Wire Bonding Reliability of Electroless Ni/Pd/Au Plating Influence of Electroless Pd Deposition Reaction”
(Co-Authors: Takehisa Sakurai, Yoshinori Arayama, Yoshiaki Tsubomatsu, Kiyoshi Hasegawa, Hitachi Chemical Co., Ltd.)

Best Student Presentation

Faramarz Hadian, Binghamton University
“Study Electromigration in SnBiAg / SAC (305) Mixed Solder Alloy”