Join the Best Virtual Experience of 2020 


Bringing the Industry Together at

SMTA International! 

On-Demand Conference & Expo: September 28 - October 23, 2020 

Live Virtual Exposition: September 28 - 30, 2020

View the Pre-Event Guide!


            Download printable PDF here!


Program scheduled to begin September 28th

View the Technical Program


Sign Up to Exhibit or Sponsor Here


Pre-Event Webinar: SMTA International Explained - Answering Your Virtual Event Questions! 


Watch the recording of our pre-event webinar above. Follow the SMTA staff through the virtual event and answer your questions! Get advice from the panel of SMTA Members, on how to best prepare yourself before hand and how utilize the virtual event to it's best abilities.



Jump in and buckle up - we are heading to the Women's Leadership Program!

Join us on Wednesday, September 28th and show your support for diversity in engineering fields!

*RSVP by Monday, September 14th to receive your Road Trip Care Package! Included in this package are essential road trip items donated by companies dedicated to make sure you have great enjoyable ride! 


RSVP Today!

More Information Here




We invite all Chapter Officers to take a virtual road trip with us for our Annual Chapter Officer's Meeting! 

Pre-Registration is required to receive the Zoom link.

Stop by the Drive Thru and Bring Your Takeout Lunch! Bring ideas, questions, and a sense of FUN. Miles may separate us, but we can still enjoy and learn in each other's company.

More Information Here




Future Dates

SMTA International 2021:

Conference: November 1 - 4, 2021

Exposition: November 3 - 4, 2021

Minneapolis, Minnesota, USA

Co-located with MD&M Minneapolis


2019 Best Paper Awards:

"Rich Freiberger Best of Conference" Presentation

Conference attendees voted for the following presenter to receive the 2019 Best of Conference award. The award is based on the conference attendees' rating of each speaker at the technical session.

Mike Konrad, Aqueous Technologies
“IPC's New Cleanliness Testing Standard is Now Active. What's New? What Stays the Same?”

"Best of Proceedings" Papers

1st Place: Chris Gourlay, Imperial College London
“Phase Formation and Solid Solubility in High Reliability Pb-Free Solders Containing Bi, Sb, In”
(Co-Authors: S.A. Belyakov, Imperial College London, B. Arfaei Binghamton University NY, USA & Ford Motor Company CA, USA, C. Johnson, R. Coyle Nokia Bell Labs NJ, USA K. Howell, Nihon Superior Co., Ltd, Suita, Japan)

2nd Place: Richard Coyle, Ph.D., Nokia Bell Labs
“Vacuum Reflow Processing of Ball Grid Array Packages for Reduced Solder Joint Voiding and Improved Attachment Reliability”
(Co-Authors: Charmaine Johnson, Richard Popowich,; Tim Pearson, Dave Hillman, Collins Aerospace; Michael Meilunas, Universal Instruments; Fred Dimock, Bob Bouchard, BTU International; Richard Parker, iNEMI; Keith Howell, Nihon Superior Co., Ltd.; *Jörg Trodler, Dipl.-Ing, Heraeus Electronics; Arvind Karthikeyan, Auburn University; Elizabeth Barr, Iowa State University)

3rd Place: Yoshinori Ejiri, Hitachi Chemical Co., Ltd.
“Wire Bonding Reliability of Electroless Ni/Pd/Au Plating Influence of Electroless Pd Deposition Reaction”
(Co-Authors: Takehisa Sakurai, Yoshinori Arayama, Yoshiaki Tsubomatsu, Kiyoshi Hasegawa, Hitachi Chemical Co., Ltd.)

Best Student Presentation

Faramarz Hadian, Binghamton University
“Study Electromigration in SnBiAg / SAC (305) Mixed Solder Alloy”



Thank you to our Premiere Sponsors!

Supporting Media:

Global SMT
SMT Today
US Tech