Join the Best Virtual Experience of 2020 

 

Bringing the Industry Together at the

SMTA International Conference and Exposition

On-Demand Conference & Expo: September 28 - October 23, 2020 

Live Virtual Exposition: September 28 - 30, 2020

 

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Program scheduled to begin September 28th

View the Technical Program

 

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Jump in and buckle up! We are heading to the Women's Leadership Program!

Join us on Wednesday, September 28th and show your support for diversity in engineering fields!

RSVP Today!

More Information Here

 

 

 


  

Calling all Chapter Officers!

Don't miss the 2020 Chapter Officer Meeting at SMTAI, grab a lunch and discuss with your fellow officers on Tuesday, September 29th!

More Information Here

 

 

 

 


Future Dates

SMTA International 2021:
Conference: November 1 - 4, 2021
Exposition: November 3 - 4, 2021
Minneapolis, Minnesota, USA
Co-located with MD&M Minneapolis

 

 

 



2019 Best Paper Awards:

"Rich Freiberger Best of Conference" Presentation

Conference attendees voted for the following presenter to receive the 2019 Best of Conference award. The award is based on the conference attendees' rating of each speaker at the technical session.

Mike Konrad, Aqueous Technologies
“IPC's New Cleanliness Testing Standard is Now Active. What's New? What Stays the Same?”


"Best of Proceedings" Papers

1st Place: Chris Gourlay, Imperial College London
“Phase Formation and Solid Solubility in High Reliability Pb-Free Solders Containing Bi, Sb, In”
(Co-Authors: S.A. Belyakov, Imperial College London, B. Arfaei Binghamton University NY, USA & Ford Motor Company CA, USA, C. Johnson, R. Coyle Nokia Bell Labs NJ, USA K. Howell, Nihon Superior Co., Ltd, Suita, Japan)

2nd Place: Richard Coyle, Ph.D., Nokia Bell Labs
“Vacuum Reflow Processing of Ball Grid Array Packages for Reduced Solder Joint Voiding and Improved Attachment Reliability”
(Co-Authors: Charmaine Johnson, Richard Popowich,; Tim Pearson, Dave Hillman, Collins Aerospace; Michael Meilunas, Universal Instruments; Fred Dimock, Bob Bouchard, BTU International; Richard Parker, iNEMI; Keith Howell, Nihon Superior Co., Ltd.; *Jörg Trodler, Dipl.-Ing, Heraeus Electronics; Arvind Karthikeyan, Auburn University; Elizabeth Barr, Iowa State University)

3rd Place: Yoshinori Ejiri, Hitachi Chemical Co., Ltd.
“Wire Bonding Reliability of Electroless Ni/Pd/Au Plating Influence of Electroless Pd Deposition Reaction”
(Co-Authors: Takehisa Sakurai, Yoshinori Arayama, Yoshiaki Tsubomatsu, Kiyoshi Hasegawa, Hitachi Chemical Co., Ltd.)

Best Student Presentation

Faramarz Hadian, Binghamton University
“Study Electromigration in SnBiAg / SAC (305) Mixed Solder Alloy”


 

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