Pan Pacific Microelectronics Symposium

The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

Save the Date for Pan Pac 2021!

February 1-4, 2021
Kahala Resort and Hotel
Honolulu, Oahu, Hawaii


Thanks for Attending the 25th Annual Pan Pacific!

February 10-13, 2020
The Big Island of Hawaii

The 25th Annual Pan Pacific Microelectronics Symposium that took place February 10-13, 2019, at the Westin Hapuna Resort on the Big Island of Hawaii was well received by attendees from North America, Asia, and Europe. Over fifty papers were presented to attendees from eight countries. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.


View the 2020 Program

Pan Pac Provides You The Latest Research On

  • Advanced Packaging & Processes
  • Automotive Systems & Hardware
  • Cleaning Technologies
  • Heterogeneous Integration
  • Inspection & Test Techniques
  • Interposer & Packaging Technology
  • Materials & Reliability
  • Nanotechnology Applications
  • Trends, Roadmaps, and more...

  • Steering Committee

    Phil Isaacs, IBM Corporation,  Chair
    Charles E. Bauer, Ph.D., TechLead Corporation
    Dock Brown, DfR Solutions
    Keith Bryant, Independent Consultant
    Dwight Howard, APTIV LPC
    Ronald Lasky, Ph.D., P.E., Indium Corporation
    Yasumitsu Orii, Ph.D., NAGASE Group
    David Raby, STI Electronics
    Kirsten Weide-Zaage, Ph.D., University of Hannover