Event Sponsors

We couldn't have an event this good without the dedication and support of our sponsors and exhibitors.

If you would like to see your company listed on this page, sign up to become a sponsor!

 

Platinum Sponsor

SUSS MicroTec                                                                           

SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8,000 installed systems worldwide.

 

Gold Sponsors

EV Group

EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lithography(NIL), metrology, photoresist coating, cleaning and inspection equipment.

 

PacTech USA, Inc.

Packaging Technologies GmbH (PAC TECH), a group member of NAGASE & CO., Ltd., is a world-leading manufacturer of advanced wafer bumping, packaging, and solder ball placement equipment, including innovative Laser Assisted Solder-Jetting solutions. PAC TECH also specializes in low cost contract services for electroless under-bump-metallization (UBM) and solder ball placement. PAC TECH Headquarters: Nauen, Germany.

100% subsidiaries: PAC TECH USA-Packaging Technologies Inc. (Silicon Valley, USA) & PAC TECH ASIA Sdn. Bhd. (Penang, Malaysia).

 

Yield Engineering Systems, Inc.

YES supplies innovative, reliable and environment-friendly products and services that transform materials and interfaces for "More than Moore" markets including Advanced Packaging, Life Sciences, AR/VR and MEMS. YES's "lab-to-fab "clean, coat, and cure" solutions combine advanced technology, high yield and low cost of ownership to empower technological breakthroughs. Customers ranging from cutting-edge research labs to the world's largest, most demanding high-volume manufacturers trust YES's proven track record (over 3,000 systems installed worldwide) and its years of technology leadership in plasma cleaning, monolayer coating and polymer curing. When the future asks for surface modification, YES is the answer!

 

Silver Sponsors

Applied Materials

The Applied Global Services organization develops products, services and automation software designed to improve the performance and productivity, and reduce the environmental impact, of the fab operations of semiconductor, LCD and solar PV manufacturers. The in-depth expertise and best known methods of Applied Materials' extensive global support infrastructure enable Applied Materials to continuously support customers' production requirements. Applied Materials automation software coordinates and streamlines every aspect of a factory - the processes, equipment and people - to provide competitive advantage to our customers.

 

Micross

Micross is the one-source solution offering multiple advanced interconnect and assembly technologies facilitating next-generation electronic systems, including wafer level packaging processes for solder (Pb-based and Pb-free) and Cu pillar bumping, high density (fine pitch) interconnects, through silicon vias (TSV) and silicon and glass interposers. Out ITAR-registered facility supports wafer sizes up to 200mm; a breadth of 2.5 and 3D heterogeneous integration packaging options and the flexibility to tailor unique solutions to customer's most demanding requirements. Whether there is a need to process a single wafer or if you are looking for a source to provide recurring production services, Micross offers full in-house wafer bumping solutions and a wide array of WLP technologies.

In business for 40+ years, Micross' comprehensive array of high-reliability capabilities serves the global aerospace & defense, space, medical, industrial and commercial markets. Micross is the leading one-source provider of bare die & wafers, wafer bumping & advanced interconnect technologies, custom packaging & assembly, component modification services, electrical & environmental testing and Hi-Rel products to manufacturers and users of semiconductor devices. Learn more: visit micross.com or email: onesource@micross.com.

 

XPERI

Xperi Corporation and its brands DTS, IMAX Enhanced, HD Radio, and Invensas are dedicated to creating innovative technology solutions that enable extraordinary experiences for people around the world. Xperi's solutions are licensed by hundreds of leading global partners and have shipped in billions of products in areas including premium audio, automotive, broadcast, computational imaging, computer vision, mobile computing and communications, memory, data storage, and 3D semiconductor interconnect and packaging. For more information, please visit www.xperi.com.

 

ERS Electronic GmbH

ERS has been supplying innovative thermal test solutions to the semiconductor industry since 1970 and is famous for fast-ramping and precise low-noise thermal systems(-65ºC to +400ºC) for analytical, parametric and wafer sort probing up to 300mm. The patented ERS flagship product for hot/cold wafer test, AC3(R), is available for package-level tri-temp applications for MEMS test. We design and build stand-alone thermal-forcing systems and custom production tools for difficult thermal applications. We also supply the advanced wafer level packaging market with its fully automatic and manual debonders and warpage adjust tools used in the production of both 200mm and 300mm eWLB device packages. On a broader scale, ERS supports not only eWLB but many other Fan-Out Wafer-Level-Packaging (FOPLP) technologies. Our headquarter, sales department, engineering center and production facilities are in the Munich suburb of Germering, and we also have sales and support offices in the US, China, Singapore, and Taiwan.