Panel Discussion

Wednesday, October 14, 2020

9:00am - 10:15am US Pacific Time

Meeting Future Advanced Packaging Challenges: What's Next?

As the industry moves into the next silicon nodes and enters the era of heterogeneous integration, packaging plays an increasingly important role. Material selection, design, and fabrication of features, inspection, test, and reliability will be critical. The industry struggles with options to achieve high-density substrate to support high-bandwidth memory (HBM) plus logic. New versions of FO-WLP are being adopted. The panel members will discuss views on the challenges and possible solutions.

 


Panel Moderator 


E. Jan Vardaman

President, TechSearch International, Inc.

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She is a member of SEMI and IMAPS. She received the IMAPS GBC Partnership award in 2012 and the Daniel C. Hughes, Jr. Memorial Award in 2018. She is an IMAPS Fellow. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.


Panelists 


Tim Olson

CEO, DECA

Timothy L. Olson founded Deca Technologies in 2009 with a mission to transform the way the world creates advanced electronic products. Currently CEO, Tim has also served as CTO, while continuously serving as a director on the board. Throughout his career, Tim led multiple breakthrough innovations and established industry processes. As Senior VP, Amkor Technology, he led global research and development introducing Package on Package Through Mold Via (PoP TMV*) technology, FusionQuad* and the industry’s first high-volume fine pitch Cu pillar flip chip on laminate technology. He also led the creation of Amkor’s micro-EMS model, which established direct technology and business relationships with leading electronic systems OEMs to provide system-in-package (SiP) modules and other advanced electronic interconnect solutions. Tim began his semiconductor career at Motorola where he led the creation, implementation and high-volume production operation of PRISM, a highly automated and integrated packaging and testing factory serving leading automotive and cellular OEMs. Under Tim’s leadership, semiconductor strip test technology was pioneered with the industry’s first production implementation.. In subsequent years at Fico (Besi), Tim established the Systems Integration Division where this strip testing technology breakthrough was commercialized into the semiconductor industry for leadframe and laminate-based products. Through the sale of the Fico division to Micro Component Technology (MCT), Tim was appointed Executive VP of Products and Operations. During this time, MCT established itself as the world leader in strip test technology as well as related factory automation software and systems. Tim graduated magna cum laude from the University of North Dakota with bachelor’s degrees in mechanical engineering and engineering management. He holds over twenty-five patents relating to wafer level processing, fan-out and other packaging, adaptive patterning, factory automation software, design systems, processes and equipment. He also served as chairman of the SEMI International Test Assembly & Packaging committee and annual conference.
*Note: TMV and FusionQuad are trademarks of Amkor


Tanja Braun, Ph.D.

Group Manager Assembly and Encapsulation Technologies and Project Leader of Panel-Level Consortium, Fraunhofer IZM

Tanja Braun studied mechanical engineering at Technical University of Berlin with a focus on polymers and micro systems and joined Fraunhofer IZM in 1999. In 2013 she received her Dr. degree from the Technical University of Berlin for the work focusing on humidity diffusion through particle-filled epoxy resins.Tanja is heading a group on Assembly & Encapsulation Technologies. Recent research is focused on wafer and panel level packaging technologies and Tanja Braun is leading the Fan-out Panel Level Packaging Consortium activities at Fraunhofer IZM Berlin. Results of her research concerning packaging for advanced packages have been presented at multiple international conferences. Tanja Braun holds also several patents in the field of advanced packaging.


Rahul Manepalli, Ph.D.

Sr. Director of Engineering, SPTD & Sr. Principal Engineer, Intel Corporation

Rahul Manepalli is a Sr. Principal Engineer and the Director of Module Engineering in Substrate and Package Technology Development Group in Intel Corporation. Rahul manages the Module Engineering group responsible for development of next generation Substrate and Package Technologies for all of Intel’s packaging needs. He has over 20 years of experience in Packaging (Assembly & Substrate materials, processes and modules) and has lead the startup and development of multiple Intel factories and Technology Development teams. He holds over 40 + worldwide patents in the area of electronic packaging and has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.


Max Min, Ph.D.

Director, Package and SI/PI Architect, Samsung Foundry

Dr. Max Min is a Director from Samsung Foundry in San Jose. He has been working on Package and Signal and Power Integrity for 10 years. He was with R&D and Sales and is now with Marketing in Samsung Foundry. He received his Ph.D. degree in Electrical and Computer Engineering from Georgia Institute of Technology in 2004.


Hong Xie

VP Research Institute for Advanced Packaging, Tongfu Microelectronics 


Shin-Puu Jeng, Ph.D.

Director, TSMC

Dr. Shin-Puu Jeng is a director in TSMC. He was the recipient of National Industrial Innovation Award from the Ministry of Economic Affairs, Outstanding Engineer Award from Chinese Institute of Engineers, as well as Prolific Inventor, Best Disclosure and, more recently, Most Valuable Invention Awards from TSMC. He and his team won the 2016 Outstanding Paper Award from ECTC, and the 2019 Golden Apple Award from the Idea Forum in TSMC. He was the general chair of IITC and the executive co-chair of IMPACT. He worked on the development of CoWoS, 3DIC with TSV, organic interposer and fanout packages in TSMC. He received his Ph.D degree from University of Florida, and conducted his post-doctoral studies at Yale University.