Virtual Conference and Expo

Live Virtual Exposition: October 13-14, 2020
On-Demand Conference & Expo: October 13-30, 2020


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Bridging the Boundaries: Wafer, Panel and Beyond

IWLPC 2020  will provide attendees the opportunity to network and attend presentations by industry experts on an international level.

IWLPC is a highly regarded technical conference that covers leading edge advancements in wafer-level packaging.








Learn About the Virtual Experience

Download the Attendee Event Guide


IWLPC  is now in its 17th successful year as a well-established international conference, boasting annual representation from over 19 countries. The technical program and exhibition focus on semiconductor packaging and advanced wafer-level packaging technology featuring 3 tracks in WLP, 3D Integration, and Advanced Manufacturing and Test. This year is a continuation of Bridging the Boundaries: Wafer, Panel and Beyond  reflecting the enablement of 5G communications, AI, and IoT, automotive and more.

Chat with Conference Attendees & Speakers in Real-Time!



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Technical Presentations will be Available

to View On-Demand from October 13-30, 2020.  


IWLPC has been at the forefront of showcasing packaging technology evolution.

The conference comprises of three parallel technical tracks with presentations on Wafer-Level Packaging, 3D Integration, and Advanced Manufacturing & Test.


View the Technical Program

Click the image below to view the event brochure. 


Download as a printable PDF 


Keynote Speaker


Trends, Challenges, Opportunities in Advanced Packaging for Smart Computing Era

    Dan Oh, Ph.D.

   Engineering VP of the Test & System Package (TSP)

   Samsung Electronics 


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Panel Discussion
Meeting Future Advanced Packaging Challenges: What's Next?

As the industry moves into the next silicon nodes and enters the era of heterogeneous integration, packaging plays an increasingly important role. Material selection, design, and fabrication of features, inspection, test, and reliability will be critical. The industry struggles with options to achieve high-density substrate to support high-bandwidth memory (HBM) plus logic. New versions of FO-WLP are being adopted. The panel members will discuss views on the challenges and possible solutions.

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Attend a LIVE Professional Development Course!

PDC1: Polymers in Wafer Level Packaging

Tuesday, October 27, 2020

8:30am-12:00pm (US Pacific Time)

Instructor: Jeff Gotro, Ph.D. Innocentrix, LLC


PDC2: From Wafer to Panel Level Packaging

Thursday, October 29, 2020

8:30am-12:00pm (US Pacific Time)

Instructors: Tanja Braun, Ph.D. & Michael Topper, Fraunhofer IZM

 Save the Dates for 2021! 

September 14-16, 2021

Conference and Exhibition: September 14-15, 2021

Professional Development Courses: September 16, 2021


DoubleTree by Hilton San Jose

2050 Gateway Pl, San Jose, CA 95110

 Stay Connected and Join the IWLPC LinkedIn Group!


IWLPC 2019 Photo Gallery


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