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PDC1: Polymers in Wafer Level Packaging

Tuesday, October 27, 2020 @ 8:30am-12:00pm (US Pacific)

Instructor: Jeff Gotro, Ph.D., Innocentrix, LLC

OBJECTIVE:

The course will provide an overview of polymers and the important structure-property-process-performance relationships for polymers used in wafer level packaging. The main learning objectives will be: 1) understand the types of polymers used in wafer level packages, including underfills (pre-applied and wafer applied), mold compounds, and substrate materials 2) gain insights on how polymers are used in Fan Out Wafer Level Packaging, specifically mold compounds and polymer redistribution layers (RDL) 3) learn the key polymer and processes challenges in Fan Out Wafer Level Packaging 4) Understand the materials and process challenges for polymer used in panel level packaging.

OUTLINE:

 

WHO SHOULD ATTEND:

Packaging engineers involved in the development, production, and reliability testing of electronic packages would benefit. Those interested in gaining a basic understanding of the role of polymers and polymer-based materials used in electronic packaging will also find this PDC valuable.

ABOUT THE INSTRUCTOR:

Jeff Gotro, Ph.D., is the President and Founder of InnoCentrix, LLC. InnoCentrix provides a wide range of consulting services to the polymer industry. Jeff has over thirty-five years of experience in polymers having held scientific and leadership positions at IBM, AlliedSignal, Honeywell International, National Starch Electronic Materials and InnoCentrix.

Jeff authored a chapter in the Encyclopedia of Polymer Science & Technology on Thermosets in 2017. He is an expert in thermosetting polymers used in electronic packaging including chemistry, processing and applications. Jeff holds 15 issued US Patents and has 4 patent applications currently filed and pending in the United States Patent and Trademark Office. Jeff has published 61 technical papers and four book chapters in technical journals and conference proceedings. Jeff has a Bachelor of Science in Mechanical Engineering and Materials Science from Marquette University and a Ph.D. in Materials Science from Northwestern University with a specialty in polymer science (polymer chemistry, physics, and characterization).

 

PDC2: From Wafer to Panel Level Packaging

Thursday, October 29, 2020 @ 8:30am-12:00pm (US Pacific)

Instructors: Tanja Braun, Ph.D. & Michael Topper, Fraunhofer IZM


OBJECTIVE:

Panel Level Packaging (PLP) is one of the latest trends in microelectronics packing. Besides technology developments towards heterogeneous integration including multiple die packaging, passive component integration in package and redistribution layer or package-on-package also approach larger substrates formats. These are targeted in this course. Manufacturing is currently done on wafer level up to 12”/300 mm and 330 mm respectively. For higher productivity and therewith lower costs, larger form factors are introduced. Instead of following the wafer level roadmaps to 450 mm, PLP might be the next big step. PLP has the opportunity to adapt processes, materials and equipment from other technology areas. Printed Circuit Board (PCB), Liquid Crystal Display (LCD) or solar equipment is manufactured on panel sizes and offer new approaches also for PLP. However, an easy upscaling of technology when moving from wafer to panel level is not possible. Materials, equipment and processes have to be further developed or at least adapted. This course will give a status of the current Fan-in and Fan-out Wafer Level Packaging as well as Panel Level Packaging including Fan-out Panel Level Packaging substrate embedding approaches. This will include materials discussion, technologies, applications and market trends as well as cost modelling.


OUTLINE:

WHO SHOULD ATTEND:

Anyone who is interested in Advanced Packaging, Fan-in and Fan-out Wafer Level Packaging and the transition to Panel Level Packaging. Engineers and managers are welcome as detailed technology descriptions as well as market trends, applications and cost modelling are presented.


ABOUT THE INSTRUCTORS:

Michael Töpper has a M.S. degree in Chemistry and a PhD in Material Science. Since 1994 he is with the Packaging Research Team at TU Berlin and Fraunhofer IZM. In 1997 he became head of a research group. In 2006 he was also a Research Associate Professor of Electrical and Computer Engineering at the University of Utah, Salt Lake City. The focus of his work was Wafer Level Packaging applications with a focus on materials. Since 2015 he is part of the business development team at Fraunhofer IZM. Michael Töpper is Senior Member of IEEE-CPMT and has received the European Semi-Award in 2007 for WLP. He has published several book chapters and is author and co-author of over 250 publications.

Tanja Braun studied mechanical engineering at Technical University of Berlin with a focus on polymers and micro systems and joined Fraunhofer IZM in 1999. In 2013 she received her Dr. degree from the Technical University of Berlin for the work focusing on humidity diffusion through particle-filled epoxy resins.
Tanja is heading a group on Assembly & Encapsulation Technologies. Recent research is focused on wafer and panel level packaging technologies and Tanja Braun is leading the Fan-out Panel Level Packaging Consortium activities at Fraunhofer IZM Berlin. Results of her research concerning packaging for advanced packages have been presented at multiple international conferences. Tanja Braun holds also several patents in the field of advanced packaging.