Join us in 2021

Mark Your Calendars Today!

18th - 20th May, 2021

Amsterdam, Netherlands |  Park Plaza Amsterdam Airport

View the Advance Program

The technical committee released the 2021 conference program. Session topics include:

  • Automotive Reliability
  • Reliability of Leadless and Bottom Terminated Components
  • Electronics Reliability
  • Climatic Reliability
  • Solder Material Advancement for Harsh Environments


    SMTA Europe hosts the Electronics in Harsh Environments Conference in Amsterdam, Netherlands. The conference focuses on building reliable electronics used in power electronics and harsh environments.

    Thermal, power and signal integrity requirements can present challenges when on devices that operate within harsh environments. Component integration, paired with a growing complexity of the package architectures, larger form factors and higher interconnection densities increase the risk of in-field failures. Over powering or over heating of a device can have serious consequences including internal package failure, down-stream device errors and second level interconnect solder joint failures. Soldering residues are more problematic, and if not understood, can result in both intermittent and complete device failure.

    This conference tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. Specific topics include building reliable high density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high temperature soldering, solder material advances, and new standards are presented.


    Pre-Conference Webinar


    2019 Conference Recap Video




    Technical Committee

    Conference Chair: Mike Bixenman, DBA,MBA, KYZEN Corporation

    Richard Boyle, Henkel Electronics

    Nigel Burtt, Renishaw plc

    Keith Bryant, KB Consultancy

    Richard Coyle, Ph.D., Nokia Bell Labs

    Maurice Dore, Valeo Detection Vision Systems

    Bob Willis,