CONFERENCE RESCHEDULED!

In light of the rapid outbreak of the Coronavirus (COVID-19), SMTA Europe is taking precautionary measures for our conference participants and delegates and has decided to reschedule the 2020 Electronics in Harsh Environments Conference.

 

The conference will now take place 1st - 3rd December, 2020 at the Park Plaza Amsterdam Airport in Amsterdam, Netherlands.

 

 

Electronics in Harsh Environments Conference

New Dates: 1-3 December 2020

Amsterdam, Netherlands

Park Plaza Amsterdam Airport

 

Register Today!

 

SMTA Europe hosts the Electronics in Harsh Environments Conference in Amsterdam, Netherlands. The conference focuses on building reliable electronics used in power electronics and harsh environments.

Thermal, power and signal integrity requirements can present challenges when on devices that operate within harsh environments. Component integration, paired with a growing complexity of the package architectures, larger form factors and higher interconnection densities increase the risk of in-field failures. Over powering or over heating of a device can have serious consequences including internal package failure, down-stream device errors and second level interconnect solder joint failures. Soldering residues are more problematic, and if not understood, can result in both intermittent and complete device failure.

This conference tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. Specific topics include building reliable high density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high temperature soldering, solder material advances, and new standards are presented.

 

Pre-Conference Webinar


View the Advance Program

The technical committee released the 2020 conference program. Session topics include:

  • Automotive Reliability
  • Reliability of Leadless and Bottom Terminated Components
  • Electronics Reliability
  • Climatic Reliability
  • Solder Material Advancement for Harsh Environments
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    2019 Conference Recap Video