Additive Electronics TechXchange


Call for Abstracts

The format of this techXchange is to showcase the needs and requirements of the end users and provide an opportunity for the supply chain to respond.

Still Accepting Abstracts!

You are invited to share your research at the conference on any of the topics below:

  • Additive PCB Technologies
  • Advanced HDI Technology
  • Assembly
  • Chemistry
  • Design Software
  • Flexible Hybrid Electronics (FHE)
  • Inspection Equipment
  • Laser Technology
  • Modified Semi Additive Processing (mSAP)
  • Molded Interconnect Devices
  • Printed Technologies
  • Raw Materials
  • Semi Additive Processing (SAP)

  • Submit Your Abstract

    Submission Guidelines for Abstracts

    Abstracts are solicited to describe original, unpublished, and non-commercial work. The abstract should be at least 300 words and must clearly state purpose, results and conclusions. Technical conference agenda presentations will be limited to 30 minutes, including five minutes for questions.

     

     

    Conference Registration

    A registration fee is associated with the conference and all speakers and session chairs are required to register. Speakers and chairs are eligible for a reduced price and SMTA members save even more!