Chapters: Great Lakes (Chicago)

Chapter Meeting

 

Advanced Nano Coating (Presented by Stentech)

&

Stencil Cleaning Best Practices (Presented by Kyzen)

 


Thursday, August 27th, 2020

 

Location:

Webinar/Virtual Meeting

URL:

TBD

 

 

 

Time:

11:00 -11:30 am

Advanced Nano Coating

By Brent Nolan

Stentech

11:30 am -12:00 pm

Stencil Cleaning Best Practices

By Dr. Mike Bixenman

Kyzen Corporation

12:00-12:15 pm

Adjournment

 

Cost:

Members

FREE

 Non-Members  FREE
   
Click HERE to register
   

**Pay via Cash/Check (onsite) or Credit Card (via PayPal - see button during RSVP process)

 

 

 

“Advanced Nano Coating”

 
By Brent Nolan – Stentech

 

With the continued miniaturization of electronic packaging, the challenge continues to be the ability to get enough solder paste down in the right geometry shape to not only place the component to solder, but also to meet the ever-changing IPC requirements.

 

About the Speaker:

Brent Nolan is a 35 year veteran of the Electronic manufacturing industry, Brent began his journey in the printed circuit board industry in 1985. He Managed both wet and dry processes for 10 years at Cuplex Inc in Garland Texas before joining his partner in business at Lone Star Circuits / Global Innovation Corp. where Brent was President and COO for 20 years.

Brent left GIC in 2013 and has entrenched himself in Stencil and Pallet manufacturing for 7 years, he is currently a Partner in Stentech. 

 

Stencil Cleaning Best Practices

By Dr. Mike Bixenman – Chief Technology Officer/Co-Founder of Kyzen Corporation

 
 
Stencil printing solder paste is a well-known and proven process technology for surface mounted components. Solder paste deposition on fine pitch and area array packages offer an attractive, cost-saving, and high-volume production alternative. The cleanliness of the stencil is critical to the success of the stencil printing process. Insufficient solder is the primary cause of defects originating from the stencil printing process; therefore, stencil cleanliness is an essential process step for delivering the proper amount of solder paste to the PCB pads. Stencil cleaning must remove all solder particles and flux vehicle from stencil apertures without damaging the stencil, bonding adhesive or mounting mesh.

 

The degree of cleanliness required varies with complexity of the board design. Stencils are usually cleaned to a visually clean condition. The stencil cleaning objectives are the removal of contaminants in the form of non-reflowed solder paste, flux residues, uncured adhesives, and other process residues. The purpose of this presentation is to review Best Practices for cleaning at the stencil printer and once the printing process is completed.

 

About the Speaker:

 

Dr. Michael Bixenman, Chief Technology Officer (CTO) and co-founder of KYZEN Corp. and Magnalytix, LLC, has over 30 years of experience in the design of electronic assembly cleaning materials and process integration. Sharing his research, knowledge, and expertise is Mike’s passion as he is the author and co-author of over 100 technical papers and presentations presented all over the world. He believes in the power of collaboration by working with others to solve problems quickly. An active member of several industry associations, he has chaired and led many committees, symposiums, and task groups that are committed to understanding the cleaning and reliability challenges of today’s ever-changing electronics industry. Dr. Bixenman holds four earned degrees, including a Doctorate in Business Administration (DBA).

 

 

RSVP to Gerri Noble at gnoble@ntech-inc.com or via the SMTA Great Lakes Chapter Webpage or by clicking HERE.

 

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