Design for Cleaning and Reliability WebtorialPresenter: Mike Bixenman
Company: KYZEN Corporation
Date Published: 9/1/2015
Residues under component terminations can impact device functions over time. The problem is that the standoff heights within the Z-Axis of miniaturized components are approaching one mil. During reflow, flux residues can become entrapped under the bottom terminations. Mobile ions within the flux residues form leakage currents, especially when the device is operating within humid environments. Ionics in flux residue can exacerbate contamination levels under the part, which can lead to high resistance shorts across pads.
Companies who require devices to meet long term reliability must clean electronic hardware. This two part Webtorial will teach Design for Cleaning and Reliability.
Session #1: Design for Cleaning Interrelationships surrounding the Cleaning Process Reduction of Residues under Bottom Terminated Components Cleaning Process Factors Matching the Cleaning Process to the Application Material Compatibility Process Control Tracking and Monitoring
Session #2: Design for Reliability Failure Modes Materials Characterization Process Validation System Health Condition Monitoring Continuous Improvement
Instructor Bio: Dr. Mike Bixenman is the Chief Technology Officer and Co-Founder of Kyzen Corporation. Mike is an active research fellow who tackles industry problems by running collaborative research studies with industry experts. The co-authors of this research – Mark McMeen and Jason Tynes of STI Electronics designed the Sensor Test Board / Test Method and David Lober of Kyzen Corporation worked on the test method. Kyzen has joined the STI research team to conduct research on an improved test method to measure the resistance of residues from non-cleaned and cleaned test boards using low residue solder pastes under a series of bottom terminated components.
Design, Cleaning, Reliability, BTCs
Members: $200.00 (Log on to receive the member rate)