Stencil Printing - A Practical Guide to Defect Prevention and Yield ImprovementPresenter: Chrys Shea
Company: Shea Engineering Services
Date Published: 11/18/2014
Solder paste Mechanics of the printing process Troubleshooting process problems Stencil design Stencil materials and manufacturing processes Automatic Solder Paste Inspection (SPI) Review and Q&A
Who should attend: SMT assembly process engineers and technicians responsible for production or new product introductions processes Engineers and technicians just entering the SMT field who want to quickly learn the science and art of stencil printing SMT quality personnel interested in helping improve print and end-of-line yields OEM supplier quality engineers responsible for supporting and/or assessing SMT assembly contractors
Instructor Bio: Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. With several hundred publications to her credit, Chrys leverages her 20+ years of process engineering and management experience to create documents, presentations, web pages and other items that deliver complex technical topics clearly and effectively.
Chrys is a favorite speaker at SMTA events, and has twice received the SMTAI “Best of Conference” award for her work on solder paste printing. In 2012 she was honored with the SMTA “Member of Technical Distinction” award.
Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island, and is a past president of the Philadelphia SMTA Chapter. She launched Shea Engineering services in 2008.
Stencil, Printing, SMT, Print Yields, defect prevention
Members: $200.00 (Log on to receive the member rate)