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Properties and Applications of Low Temperature Solders

Presenter: Ning-Cheng Lee, Ph.D.
Company: Indium Corporation
Date Published: 1/28/2014

Description: Overview:
Since the dawn of the electronics industry, the soldering process has mainly encompassed component manufacturing and printed circuit board assembly with hierarchic melting range selection. The former uses solder alloys with melting temperatures around 300°C, which will not melt in the subsequent PCB assembly process, where the solders typically melt around 200°C. Low temperature solders with melting temperature < 170°C are currently mainly used for niche applications. However, iNEMI roadmap predicts low temperature soldering to become one of the mainstream processes by 2017. Low temperature soldering is greatly desired for a number of special applications, such as heat sensitive devices, systems with more hierarchic levels, parts with significant difference in coefficient of thermal expansion, components exhibiting severe thermal warpage, or products with highly miniaturized design. This course will cover the varieties of low temperature solders with emphasis on lead-free alloys, their physical, mechanical, and soldering properties, and the applications involved with those alloys.

Outline:
1. Design of low temperature solder alloys
2. In-bearing systems and their properties
3. Bi-bearing systems and their properties
4. Recent development in B-bearing low temperature alloys
5. Applications of low temperature solders

Who Should Attend:
Any one interested in low temperature soldering, their applications, and wants to know how to achieve it should take this course

Instructor Bio:
Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973. Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received 1991 award from SMT Magazine and 1993 and 2001 awards from SMTA for best proceedings papers of SMI or SMTA international conferences, 2008 award from IPC for Honorable Mention Paper – USA Award of APEX conference, and Best Paper Award of SMTA China South 2010. He was honored as 2002 Member of Distinction from SMTA, 2003 Lead Free Co-Operation Award from Soldertec, 2006 Exceptional Technical Achievement Award from CPMT, 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from SMTA, and 2010 Electronics Manufacturing Technology Award from CPMT. He serves on the board of governors for CPMT and served on the SMTA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Components Packaging Manufacturing Technology. He has numerous publications and frequently gives presentations, invited to seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.

Key Words: 

low temperature, solders, in-bearing, Bi-bearing, B-bearing



Pricing:
  Members: $200.00 (Log on to receive the member rate)
  Non-Members: $300.00



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