Cleaning a No-Clean Flux and Related Reliability IssuesPresenter: Eric Camden
Date Published: 8/13/2013
Potential issues include, partially activated flux residues; localized cleaning that has created a trapped surface residue and other unseen issues. We will also look at the types of failure modes directly related to improperly processed flux residues. Proven cleaning methods for no-clean flux will also be discussed with a focus on both cleaning at time of original manufacturing as well as recovery cleaning for hardware that was improperly processed during the original build.
Who Should Attend: Directors of quality, program managers, really anyone that has a desire to produce PCBA's with as little process residue as possible.
About The Presenter: Eric Camden is a Lead Investigator at Foresite, Inc., an analytical testing and consulting laboratory. Over the past 13+ years, Eric has worked with many large OEMs and contract manufacturing companies optimizing their manufacturing processes and assisting with the identification of electronic hardware failures utilizing various analytical techniques. He is active in industry-related organizations and speaks regularly at many industry conferences around the world. He is also a J-STD-001 and IPC-A-610 certified instructor trainer as well as IPC-A600 certified specialist.
no-clean, flux, reliability, residues
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