Material and Process Optimization for Head-in-Pillow EliminationPresenter: Timothy Jensen
Company: Indium Corporation
Date Published: 1/12/2012
Description: The Head-in-Pillow (HIP) defect is an open solder joint in a BGA or CSP where the solder paste deposit doesn't coalesce to the ball on the component. The result is an apparent solder joint with a hairline gap between the solder reflowed to the PCB paste and the solder ball itself. In this webinar, we will discuss the changes in the electronics industry that have made HIP defects much more prevalent than in the past. We will review why this defect is so much more troublesome than other process defects. Process and material selection can have a significant impact on the potential for HIP defects. We will discuss the printing and reflow processes to analyze ways that optimization can help to significantly reduce the potential for HIP. Although the focus will be on the SMT process, there will be some overview of the BGA component manufacturing process and how it can impact HIP. Solder paste selection plays a major role in HIP prevention and this webinar will discuss the critical solder paste attributes that can help minimize HIP.
Head-in-Pillow, HiP, BGA, CSP, Defect, Solder Paste
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