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Methods for Reworking Leadless Packages - LGA, QFNs and More

Presenter: Bob Wettermann and Ray Cirimele
Company: BEST
Date Published: 11/19/2009

StenTech

Description: Methods for Reworking Leadless Packages LGAs and QFNs have become increasingly common package types used in many portable products due to their reduced real estate requirements on the PWB. In fact there are many industry marketing trends that point to leadless devices crossing over area array devices in terms of the number of placements in the next few years.

This webinar is designed for engineers, quality engineering, process developers and repair techs who are faced with reworking these devices.

After a review of the device types, several different rework methods including the use of a split vision rework system, manual soldering, a stencil “bump” method and other variations will be reviewed with process pictures and videos. Industry standard inspection criteria for such devices will also be reviewed.

Key Words: 

Leadless Packages, rework, LGA, QFN, split vision, stencil bump,



Pricing:
  Members: $0.00 (Log on to receive the member rate)
  Non-Members: $75.00



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