Pan Pacific Symposium 2014 Proceedings

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TITLE AUTHOR
Advanced Technologies & Materials for Packaging of Power Electronic Modules Anton Miric, M. Sc.  Abstract
2013 iNEMI Technology Roadmap Overview Bill Bader and Chuck Richardson  Abstract
Intellectual Assets Management - Possibilities and Difficulties Bill Brox  Abstract
Polymer-Based Electronics: Economically Viable Renewable Energy System Bozena Kaminska, Jasbir N. Patel, and Badr Omrane  Abstract
Power Conversion Trends That Will Impact System Packaging and Assembly Carl Blake  Abstract
Single Enterprise Methodology Charles Barnhart, Sr.  Abstract
Virtual Prototyping for Power Electronics Packaging - Current Status and Future Challenges Chris Bailey  Abstract
Measurement and Modeling of the Polyimide Dielectric Coating Induced Wafer Warpage Chunsheng Zhu, Wenguo Ning, Gaowei Xu, Le Luo, Chunsheng Zhu, and Wenguo Ning  Abstract
Research on a Lifetime Prediction Model for IR-LEDS Under High Pulse Currents Cong Shao, Shunong Zhang, Ph.D., and Zhonghua Liu  Abstract
Embedded Product Descriptions in XML Supply Chain Data Transfer Methodology Dieter W. Bergman  Abstract
Recent Advances in the X-Ray Inspection Technology with Emphasis on Large Board Computer Tomography and Automation Evstatin Krastev and John Tingay  Abstract
Local Mechanical Testing and Parameter Identification for Modeling of Interconnection Materials Falk Naumann, Georg Lorenz, Matthias Petzold  Abstract
New Era for Packaging and Coming Challenges for Interposers Gilles Poupon, Y. Lamy and A. Rouzaud  Abstract
3D Technology Interconnect Reliability TCAD H. Ceric, R. L. de Orio, A. P. Singulania, and S. Selberherr  Abstract
Electrical Design of Silicon, Glass and Organic Interposer Channels Heegon Kim, Hyunsuk Lee, Jonghyun Cho, Youngwoo Lee and Joungho Kim  Abstract
Disruptive Innovation Pulls Manufacturing Out of the Box Herbert J. Neuhaus, Ph.D. and Charles, E. Bauer, Ph.D.  Abstract
Statistics of Crack Initiation and Propagation (SCRIP) Horatio Quinones  Abstract
Fault Injectionand Simulation of the Solder Joint Mechanical Creep in Integrated Circuit Hu Weiwei, Ph.D., Meng Xiangkun, Sun Yufeng, Zhao Guangyan  Abstract
Compact Thermal Models for Virtual Prototyping of Electronic Assemblies: Past, Present & Future J.H.J. Janssen  Abstract
Simultaneous Analysis of Package Warping and Internal Defect Condition Using Acoustic Micro Imaging Janet E. Semmens  Abstract
The Internet of Everything Evolution Judy Priest  Abstract
Reliability of Flex-To-Flex Interconnections on Inkjetprinted PCBs Using Electrically Conductive Adhesives Juha Niittynen, Santtu, Koskinen, Matti Mäntysalo, Janne Kiilunen, Juha Pippola, and Laura Frisk  Abstract
Investigation of Chip-Package Interaction in 3D Integration K. Weide-Zaage, J.Kludt, H. Frémont, A. Tetelin  Abstract
Advances in Etch and Deposition Technologies for 2.5 and 3D BEoL Processing Keith Buchanan, Dave Thomas, Hefin Griffiths, Kathrine Crook, Daniel Archard, Mark Carruthers, Steve Burgess, and Stephen Vargo  Abstract
Semiconductor Die Attach with High Copper Solder Alloys Keith Sweatman, Takatoshi Nishimura, and Tetsuro Nishimura  Abstract
Optimization of Leveler Concentration to Minimize the Contamination of Copper in Via Filling Ki-Tae Kim and Jae-Ho Lee  Abstract
Simulation-Driven Packaging of Proof of Concept Thermoelectric Modules Klas Brinkfeldt, Michael Edwards, Dag Andersson, Julia Simon, Sébastien Noël and Krunoslav Romanjek  Abstract
Novel Nanofiber Anisotropic Conductive Films (ACFS) For Fine Pitch Assembly Kyung-Wook Paik, Tae-Wan Kim, Sang-Hoon Lee, and Kyoung-Lim Suk  Abstract
3D TSV Interposer Interconnection Using NCF Materials Kyung-Wook Paik, Yongwon Choi, and Ji-won Shin  Abstract
3D Integration: Status and Requirements M. Juergen Wolf and Klaus-Dieter Lang  Abstract
Fraunhofer Cluster 3D Integration M. Juergen Wolf, P.E., Stefan Schulz, Peter Schneider and Ehrenfried Zschech  Abstract
Thin Wafer Processing for 3D Integration: Status and Update Markus Wimplinger, Jürgen Burggraf, Harald Wiesbauer, Thomas Uhrmann, Thorsten Matthias, Garrett Oakes, and Masaya Kawano  Abstract
Digital Health: Facts, Fiction, and Future! Matthew K. Hudes  Abstract
Alignment and Performance for Chip-To-Chip Communication Meihui Guo, Jen-Feng Huang, and Yu-Jung Huang  Abstract
Device Embedding Technology in PCBs Route to Success? Michael Weinhold  Abstract
Optimal Designs for Response Surface Models with Correlated Responses Mong-Na Lo Huang  Abstract
Multi-Die Embedding in Fan-Out WLP NANIUM S.A.  Abstract
A New Embedded Structure Package For Next Generation, WFOPTM (Wide Strip Fan-Out Package) Naoki Hayashi, Hirokazu Machida, Nobukaki Shintani, Norihito Masuda, Kiyoaki Hashimoto, Atsushi Furuno, Katsushi Yoshimitsu, Yoshimi Kikuchi, Mitsuru Ooida, Akio Katsumata and Yoichi Hiruta  Abstract
Reliability Time-Bombs in Electronics & Photonics Systems Nihal Sinnadurai  Abstract
Transient Liquid Phase Sintered Joints for Wide Bandgap Power Electronics Packaging Patrick McCluskey and Hannes Greve  Abstract
No-Clean Pb-Free Flux: A Chemical View of Reliability Phil Isaacs, Eddie Kobeda and Jing Zhang  Abstract
Microelectronic Interposers: From R&D To Manufacturing Rao Tummala, Brett Sawyer, Chandrasekharan Nair, Vijay Sukumaran, Yuya Suzuki, Hao Lu and Venky Sundaram  Abstract
PoP Rework - A Case Study Robert Wettermann  Abstract
Under Bump Metal Etching - A Little Known Key Process in Wafer Level Packaging Ross Kulzer  Abstract
Principles and Implementation of LED Packaging Technologies for White Light Illumination S. W. Ricky Lee  Abstract
Path to the Future of Glass Interposers Shintaro Takahashi, Masaki Mikayama, Nobuhiko Imajo  Abstract
Semiconductor Die Attach with Nano-Ag: A Case Study of Commercial Application Takatoshi Nishimura, Keith Sweatman, Tetsuro Nishimura, Teruo Komatsu  Abstract
Optical Fiber Array Connector Designed for Assembly Automation Terry P Bowen, Aleksandar K Angelov, Steve Dellinges, Thomas Huegerich, Wayne Montoya, Frances T Peralta, Nick Pugliano, Sandeep Razdan, Jibin Sun, Jian Wang, John Wasserbauer, and Haipeng Zhang  Abstract
Winning Business - Sometimes The Best Idea Is Not Enough Timothy K. Duggins  Abstract
Electronic Product Assembly in High Labor Rate Markets - A Case Study in Exploiting the Counterweight to Low Labor Rate Competition: Automation Tom Borkes  Abstract
Asymptotic Behavior of Beta Distribution Wen-Jang Huang  Abstract
The Future of Organic and Printed Electronics: OE-A Roadmap Wolfgang Clemens, Donald Lupo, Mark Verrall, Klaus Hecker and Sven Breitung  Abstract
Failure Analysis in a Mixed-Signal Chip Yu-Jung Huang, Shen-Li Fu, Ming-Kun Chen and Yi-Lung Lin  Abstract
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