Medical Electronics Symposium 2013 Proceedings

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TITLE AUTHOR
Electronic Modules for Medical Applications – Miniaturization and Functionalization of a Printed Circuit Board Alexander Kasper  Abstract
Wireless Communication & Charging Platform for Solid State Batteries in Miniature Implantable Medical Devices Andrew Kelly  Abstract
Winning With Emerging Medical Technologies Bruce R. Kline  Abstract
Using Nanocoatings: Opportunities & Challenges for Medical Devices Cheryl Tulkoff  Abstract
Using Nanocoatings: Opportunities & Challenges for Medical Devices Cheryl Tulkoff  Abstract
Establishing Effective Accelerated Testing Conditions and Criteria for Confirming Medical Electronics Reliability for HDI Circuits Don Banks, Rema Nair, and Bill Birch  Abstract
Shock Resistant and Thermally Reliable Low Ag SAC Solder Doped with Mn Dr. Ning-Cheng Lee  Abstract
Adressing the More than Moore Challenges from within the OEM Community Erik Jung  Abstract
Key Strategies for Medical Microelectronics Fred Sporon-Fiedler and Ravi Subrahmanyan  Abstract
Qualification Methods for Portable Devices Grady White  Abstract
Medical Device Substrate Reliability Hans-Peter Klein, Ph.D.  Abstract
Opportunity Analysis for EMS Providers in the Medical Industry - EMS providers competitive positioning at a crossroad Kiran Unni  Abstract
Simplify Selection and Improve Reliability of Small Form Factor Resistors, Capacitors, and Magnetics Used in Medical Devices M. Olver, J. Adsero, J. Petheram, P. Gormally  Abstract
How small can it be - Flex and Flex-Rigid PCBs Markus Wille  Abstract
Design Rules for Cleaning Medical Electronic Circuitry Mike Bixenman, Dale Lee, Bill Vuono, and Steve Stach  Abstract
Designing More Reliable Medical Products Mike Silverman and Cheryl Tulkoff  Abstract
Tin Whiskers 101 Professor Ronald C. Lasky, Ph.D., P.E.  Abstract
Reliability Requirements for Class III Medical Assemblies Ravi Parthasarathy  Abstract
Engineering Development Solutions Using a Global Engineering Team (Worksharing Playbook) Scott Gleason  Abstract
How Component Cleanliness Is Affecting Field Performance of No Clean High Reliability Products Terry Munson  Abstract
Flex Based Embedded Die Packaging: 3D System in Packages for Medical Electronics Miniaturization Theodore Tessier, Jon Aday, and Kazuhisa Itoi  Abstract
RoHS2 Data: A Much Needed Solution for the Medical Industry Tierney Powers  Abstract
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