SMTA International 2005 Proceedings

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TITLE AUTHOR
RELIABILITY OF MIXED SOLDER INTERCONNECTS - CASE STUDIES Adam Zbrzezny et al.  Abstract
COMPONENTS & LEADED SURFACE MOUNT PACKAGES Alan Donaldson  Abstract
PARADIGM SHIFT IN APPLYING UNDERFILL-UPDATE Alec J. Babiarz  Abstract
STUDY OF NOISE FACTORS IN SOLDER PASTE PRINTING Aleksandra Djordjevic  Abstract
CHALLENGES ASSOCIATED WITH CONCURRENT MANUFACTURING (PB-BASED &PB-FREE) IN AN EMS ENVIRONMENT Amey Teredesai and Tony Batalha  Abstract
ASSEMBLY OF JCAA/JG-PP TEST VEHICLES Ana L. Campuzano-Contreras  Abstract
ASSEMBLY AND RELIABILITY OF HIGH CTE CERAMIC LAND GRID ARRAY Andrew Mawer et al.  Abstract
ACCELERATION FACTOR TO RELATE THERMAL CYCLES TO POWER CYCLES FOR CERAMIC AREA ARRAY PACKAGES Andrew Perkins and Suresh K. Sitaraman  Abstract
PROCESS AND RELIABILITY ISSUES WITH LEAD-FREE CSP REWORK Arun Gowda et al.  Abstract
INFLUENCE OF SURFACE CHARACTERISTICS ON THE IN-SITU PERFORMANCE OF THERMAL GREASES Arun Gowda et al.  Abstract
STUDY ON ASSEMBLY, REWORK PROCESS, MICROSTRUCTURES AND MECHANICAL STRENGTH OF BACKWARD COMPATIBLE ASSEMBLY Bala Nandagopal et al.  Abstract
OPTIMIZING THE REFLOW PROCESS UTILIZING A TIN/COPPER ALLOY Bob Gilbert  Abstract
SOLDERBALL(TM) INTERCONNECTS FACILITATE SMT REFLOW & ELIMINATE CO-PLANARITY ISSUES FOR SUB-ASSEMBLIES AND POWER MODULES Carlos Juvera et al.  Abstract
A FEASIBILITY STUDY OF 01005 CHIP COMPONENTS IN A LEAD-FREE SYSTEM Chrys Shea et al.  Abstract
CHARACTERIZING TRANSFER EFFICIENCIES AND THE FINE FEATURE STENCIL PRINTING PROCESS Chrys Shea, Greg Wade, Esse Leak, and Ron Tripp  Abstract
MASS IMAGING OF LEAD FREE MATERIALS - WHAT IMPACT DOES STENCIL TECHNOLOGY HAVE? Clive Ashmore  Abstract
THE EFFECT OF SURFACE FINISH ON THE RELIABILITY OF PB-FREE SOLDER JOINTS IN CHIP SCALE PACKAGES Corey Reichman and Robert Darveaux  Abstract
PRINTED CIRCUIT BOARD CONSIDERATIONS FOR LEAD FREE ASSEMBLY Dale Lee  Abstract
GOLD BUMP TECHNOLOGIES: A COMPARISON OF SERIAL PROCESSING (BALL BUMPING) AND BATCH PROCESSING (PLATING) Daniel Evans, Jr. and Mark S. Greenwell  Abstract
EVALUATION OF RELIABILITY AND METALLURGICAL INTEGRITY OF WIRE BONDS AND LEAD FREE SOLDER JOINTS ON FLEX CIRCUIT MODULES Daniel T. Rooney, Ph.D. et al.  Abstract
ONE PROCESS, DIFFERENT RESULTS: METHODOLOGIES FOR ANALYZING A STENCIL PRINTING PROCESS USING PROCESS CAPABILITY INDEX ANALYSES Daryl L. Santos et al.  Abstract
MEASUREMENT VARIATION IN THE FILL OF INTRUSIVELY REFLOWED LEAD FREE SOLDER JOINTS WITH DIFFERENT BOARD FINISHES BY X-RAY INSPECTION David Bernard et al.  Abstract
JCAA/JG-PP NO-LEAD SOLDER PROJECT: -20ºC TO +80ºC and -55ºC TO +125ºC THERMAL CYCLE TESTING David D. Hillman  Abstract
JCAA/JG-PP NO-LEAD SOLDER PROJECT: -20ºC TO +80ºC and -55ºC TO +125ºC THERMAL CYCLE TESTING David D. Hillman  Abstract
EVALUATION OF OSP SURFACE FINISHES FOR LEAD-FREE SOLDERING David Geiger, Yueli Liu, and Dr. Dongkai Shangguan  Abstract
MINIMIZING FLUX RESIDUES ON THE COMPONENT BODY Deepak Manjunath  Abstract
FILLING BLIND MICROVIAS TO IMPROVE RELIABILITY Dennis Fritz, Jim Watkowski, and Maria Nikolava  Abstract
EMERGING NANOTECHNOLOGY AND ITS EFFECT ON ELECTRONICS MANUFACTURING Dr. Alan Rae and Dr. Robert C. Pfahl, Jr.  Abstract
RELIABILITY AND PERFORMANCE OF THERMALLY CONDUCTIVE ADHESIVES Dr. Brian J. Toleno  Abstract
iNEMI OPTOELECTRONICS ROADMAP FOR 2004 Dr. Laura J. Turbini  Abstract
SIX SIGMA R&D AND THE SUPPLY CHAIN Dr. William L. Olson and Dr. Jim Liu  Abstract
REWORKABLE NO-FLOW UNDERFILLING FOR BOTH TIN-LEAD AND LEADFREE REFLOW ASSEMBLED UNDER AIR Dr. Wusheng Yin and Dr. Ning-Cheng Lee  Abstract
EFFECT OF FLUX AND COOLING RATE ON MICROSTRUCTURE OF FLIP CHIP SAC BUMP Dr. Wusheng Yin and Dr. Ning-Cheng Lee et al.  Abstract
BENCHMARKING OF LEAD-FREE NO-CLEAN FLUXES SOLDERING PERFORMANCE ON OSP BOARD Dr. Xiaobai Wang and Christine Poon  Abstract
A KINETIC APPROACH OF PROFILING FOR VOIDING CONTROL AT LEAD-FREE REFLOW SOLDERING Dr. Yan Liu et al.  Abstract
EPC/RFID IMPLEMENTATION IN MANUFACTURING Edward Adelakun, David Halliday, and Azhar Zaidi  Abstract
EFFECT OF UNFILLED UNDERFILL ON BOARD LEVEL RELIABILITY Edward S. Ibe et al.  Abstract
CAPABILITY MATURITY MODEL FOR SUPPLY CHAIN IMPROVEMENT: A CASE STUDY Edwin B. Smith, III  Abstract
ENHANCING THE TARNISH PERFORMANCE OF IMMERSION SILVER FINISHES Elizabeth Norwood and John Swanson  Abstract
KEY ISSUES IN SUPPORTING LEAD-FREE AND COMPLEX PROTOTYPES IN THE ELECTRONICS MANUFACTURING SERVICES ENVIRONMENT Elliot L. Shev  Abstract
SOLDER AS THERMAL INTERFACE MATERIAL FOR HIGH POWER DEVICES Fay Hua and Carl Deppisch  Abstract
SURVEY OF SUCCESSFUL RFID CASE STUDIES IN ELECTRONICS MANUFACTURING François Monette  Abstract
FIRST PASS YIELD ENHANCEMENT THROUGH STRATEGIC IMPLEMENTATION OF AOI AS A PROCESS IMPROVEMENT TOOL Fredrika M. Haneborg-Luhr  Abstract
CONVERSION OF ONGOING PRODUCTS TO RoHS COMPLIANCE Gary Schulte  Abstract
TOWARD LEAD-FREE COMPLIANT PIN CONNECTIONS George J.S. Chou, Ph.D. and Robert D. Hilty, Ph.D.  Abstract
SCALING UP RFID MANUFACTURING - ADDRESSING THE NEED FOR HIGH VOLUME PRODUCTION Gerald Steinwasser  Abstract
RELIABILITY AND SOLDERABILITY OF THE LEAD FREE HASL PROCESS Glenn Sikorcin  Abstract
LEAD-FREE SOLDER JOINTS AND FAILURE MECHANISM ON DIFFERENT FINISHES H.-J. Albrecht  Abstract
ASSESSING THE RELIABILITY OF NEW CONNECTOR DESIGNS Heather McCormick and George Riccitelli  Abstract
DEVELOPMENT OF A "SYSTEMS BASED" COMPLIANCE APPROACH TO THE EUROPEAN UNION’S ROHS DIRECTIVE Holly Evans  Abstract
microPowerChip: INTEGRATED POWER FOR WIRELESS MICROSYSTEMS J. DeGreeff, P. Fleig, and C. Lakeman  Abstract
ASSEMBLY AND BOARD LEVEL RELIABILITY CONSIDERATIONS FOR 0.4 MM PITCH BALL GRID ARRAY PACKAGES J. Scanlan, A. Syed, WJ. Kang, and M. Abe et al.  Abstract
ADHESIVE FLIP CHIP FOR LARGE ARRAYED DEVICES James E. Clayton  Abstract
THE USE OF CLOSED-LOOP PROCESS CONTROLS IN DISPENSING APPLICATIONS James Klocke  Abstract
RELIABILITY EVALUATION OF LEAD-FREE SNAGCU PBGA676 COMPONENTS USING TIN-LEAD AND LEAD-FREE SNAGCU SOLDER PASTE Jasbir Bath et al.  Abstract
iNEMI LEAD-FREE MICRO-BGA, CBGA, MICTOR CONNECTOR AND THROUGH-HOLE DIP REWORK EVALUATIONS Jasbir Bath et al.  Abstract
LOW TEMPERATURE, SPOT CURE CONDUCTIVE ADHESIVE TECHNOLOGIES FOR RFID TAGS ASSEMBLY Jayesh Shah et al.  Abstract
ACCELERATION FACTORS AND THERMAL CYCLING TEST EFFICIENCY FOR LEAD-FREE SN-AG-CU ASSEMBLIES Jean-Paul Clech  Abstract
JCAA/JG-PP LEAD-FREE SOLDER PROJECT: COMBINED ENVIRONMENTS TEST Jeff Bradford, Joe Felty, and Bill Russell  Abstract
PRINTED ELECTRONICS FOR LOW COST RFID Jie Zhang and Daniel Gamota  Abstract
FREE SILICON: THE ONLY SUCCESSFUL MARKETING STRATEGY LEFT? Jim Walker  Abstract
CONSIDERATION IN THE DEVELOPMENT OF THE 01005 COMPONENT ASSEMBLY PROCESS Joe Belmonte and Srinivasa Aravamudhan  Abstract
RELIABILITY OF SAC BGA USING SnPb PASTE FOR HARSH ENVIRONMENT ELECTRONICS John L. Evans, Ph.D et al.  Abstract
A COMPARISON OF CLEANING TECHNOLOGIES FOR NEW LEAD-FREE SOLDER PASTE FORMULATIONS John R. Sanders et al.  Abstract
RELIABILITY OF TIN TERMINATED COMPONENTS IN A LEAD-FREE SYSTEM Jorge A. Manriquez, Ph.D. et al.  Abstract
A STUDY OF THE FAILURE MECHANISMS IN LEAD-FREE AND EUTECTIC TIN-LEAD SOLDER BUMPS FOR FLIP CHIP ASSEMBLY Julia Y. Zhao, David Mackessy, and John Jackson  Abstract
INTERMETALLIC GROWTH IN LEAD-FREE SOLDERS ON PCB SUBSTRATES K. Sweatman, S. Suenaga, and T. Nishimura  Abstract
EFFECT OF CLEANING PROCESS PARAMETERS AND MATERIALS ON FLUX RESIDUE FOR FLIP CHIP ASSEMBLY Kaustubh Nagarkar et al.  Abstract
SUNTRON’S LEAN MANUFACTURING LINE Keith Garrison and Sal Bora  Abstract
GETTING STARTED WITH AOI - A PROGRAMMER’S VIEW Ken Klima  Abstract
DEVELOPMENT AND DEPLOYMENT OF LEAD-FREE ASSEMBLY PROCESS WORLD-WIDE Kim Hyland  Abstract
BUILDING A "REASONABLE STEPS" DEFENSE: LABORATORY TESTING Kris Erickson et al.  Abstract
APPLICATION OF A NEAR INFRARED DEFECT INSPECTION PROCESS FOR FLIP CHIP ASSEMBLY L. Todd Woods et al.  Abstract
INTEGRATION OF ACTIVE AND PASSIVE COMPONENTS USING CHIP IN POLYMER TECHNOLOGY Lars Boettcher et al.  Abstract
SALT ATMOSPHERE, TEMPERATURE HUMIDITY, AND MECHANICAL SHOCK ENVIRONMENTAL STRESS TESTING RESULTS OF THE JG-PP / JCAA LEAD FREE SOLDERING PROGRAM Lee Whiteman  Abstract
MULTI-ROW LEADLESS TAPP - HIGH PERFORMANCE PACKAGING AT VERY FINE PITCH Leo M. Higgins III, Ph.D.  Abstract
CREATING A HIGH SERVICE EMS ENVIRONMENT THROUGH BUSINESS PROCESS ALIGNMENT Leo Reynolds  Abstract
IMPACT OF CRACKING BENEATH SOLDER PADS IN PRINTED CIRCUIT BOARDS ON RELIABILITY OF BALL GRID ARRAY PACKAGES M. Mukadam, G. Long, P. Butler, and V. Vasudevan  Abstract
INVESTIGATION OF THE PERFORMANCE OF SAC AND SACBi LEAD-FREE SOLDER ALLOYS WITH OSP AND IMMERSION SILVER PCB FINISHES Manivannan Sampathkumar et al.  Abstract
EFFECT OF DEVIATING FROM THE REFLOW PROCESS WINDOW FOR LEAD-FREE ASSEMBLY Manivannan Sampathkumar et al.  Abstract
PRODUCT MATERIAL CONSIDERATIONS - CUSTOMER AND INDUSTRY ISSUES Marie Cole and Jay Dietrich  Abstract
SUPPLY CHAIN DATA EXCHANGE FOR MATERIAL DISCLOSURE Mark Myles  Abstract
PROCESS CONTROL THROUGH VOLUMETRIC OPTICAL INSPECTION Matthew T. Holzmann  Abstract
LEAD-FREE WAVE SOLDER FLUX EVALUATION Michael Havener  Abstract
COMBINED PRINTED SOLDER PASTE AND PRINTED ADHESIVE PROCESS FOR DEVICES GOING THROUGH WAVE SOLDER Michael Kochanowski  Abstract
PROCESS AND DESIGN CONSIDERATIONS FOR PERFORMING HIGH VOLUME PB Free FLIP CHIP on FLEX ASSEMBLIES Michael Peterson  Abstract
EFFECTS OF MICROSTRUCTURE, PCB FINISH AND PROCESSING ON LEAD-FREE RELIABILITY Milos Dusek and Chris Hunt  Abstract
QUALIFICATION OF ALIVH-G BOARDS FOR HANDSET ASSEMBLY Mumtaz Y. Bora  Abstract
AN ACCELERATION MODEL FOR Sn-Ag-Cu SOLDER JOINT RELIABILITY UNDER VARIOUS THERMAL CYCLE CONDITIONS N. Pan et al.  Abstract
A COMPARISON OF THE ISOTHERMAL FATIGUE BEHAVIOR OF SN-AG-CU TO SN-PB SOLDER Nathan Blattau and Craig Hillman  Abstract
INTEGRATED MANUFACTURING AND ITS EFFECT ON FRONT-END Nick Misra  Abstract
JOB CLUSTERING - AN UNTAPPED LEAN MANUFACTURING OPPORTUNITY Nir Dvir  Abstract
CRACK GROWTH RATE MEASUREMENT AND ANALYSIS FOR WLCSP Sn-Ag-Cu SOLDER JOINTS Paresh Limaye et al.  Abstract
A NEW GENERATION OF CONDUCTIVE INKS FOR ENHANCED PERFORMANCE IN SMART LABEL APPLICATIONS Paul Berry et al.  Abstract
FLIP CHIP ULTRASONIC GOLD TO GOLD INTERCONNECT FOR SMALL DIE WITH HIGH BUMP COUNT Philip Couts  Abstract
MODELS FOR THERMO-MECHANICAL RELIABILITY TRADE-OFFS FOR LEADED AND LEADFREE FLIP-CHIP ELECTRONICS IN EXTREME ENVIRONMENTS Pradeep Lall et al.  Abstract
STENCIL PRINTING AND REFLOW PARAMETER 'OPTIMIZATION' DURING ASSEMBLY OF 0201 COMPONENTS BY A DESIGNED EXPERIMENT APPROACH Praveen Kumar Manjeshwar et al.  Abstract
EFFECT OF BALL SIZE ON UNDERCOOLING OF Sn-Ag-Cu SOLDER JOINTS R. Kinyanjui, L. P. Lehman, and E. J. Cotts  Abstract
CASE STUDIES IN PREVENTING COMPONENT DAMAGE FROM LEAD-FREE HEAT Rahul Raut, Brian Lewis and Tom Hunsinger  Abstract
ASSEMBLY OF RFID FLIP CHIPS ON STRAPS USING A HIGH SPEED CHIPSHOOTER Richard Boulanger and Peter Borgesen et al.  Abstract
APPLICATIONS OF RFID INTELLIGENT FEEDERS FOR PRODUCTION MANAGEMENT Robert J Black, Jr.  Abstract
RELIABILITY OF PCB ALTERNATE SURFACE FINISHES IN A HARSH INDUSTRIAL ENVIRONMENT Robert Veale  Abstract
A PROTOCOL FOR RoHS AND WEEE COMPLIANCE Ronald C. Lasky et al.  Abstract
BEST PRACTICES FOR POST-ERP IMPLEMENTATION AT AN EMS PROVIDER S. Ramakrishnan, S. Parimoo, and K. Srihari, Ph.D.  Abstract
MODEL BASED APPROACHES FOR SELECTING RELIABLE UNDERFILLFLUX COMBINATIONS FOR FLIP CHIP PACKAGES Satyanarayan Iyer et al.  Abstract
PACKAGING OF HIGH-POWER LEDS USING Au STUDBUMP INTERCONNECTS Shatil Haque et al.  Abstract
SELF-CENTERING OF CHIP COMPONENTS IN A PB-FREE ASSEMBLY AS A FUNCTION OF COMPONENT AND SOLDER PASTE PRINT OFFSETS Srinivasa Aravamudhan et al.  Abstract
FILLET WETTING AND DIE COLLAPSE OF WAFER-LEVEL FLIP CHIP ASSEMBLIES Stephen C. Busch and Daniel Baldwin, Ph.D.  Abstract
THE OPTIMIZED REFLOW PROFILE FOR REWORK OF HIGH I/O LEAD FREE AREA ARRAY PACKAGES Stephen Schoppe  Abstract
OPTIMIZING CLEANING ENERGY IN ELECTRONIC ASSEMBLY SPRAY IN AIR SYSTEMS: PHASE II Steve Stach and Mike Bixenman  Abstract
HOW DEFECT COVERAGE AS A VARIABLE CAN BE USED TO DETERMINE TEST AND INSPECTION STRATEGIES Stig Oresjo  Abstract
PB-FREE WAVE SOLDERING PROCESS OPTIMIZATION Sunil Gopakumar et al.  Abstract
SOLDER-JOINT RELIABILITY AND BOARD ASSEMBLY OF PQFN PACKAGES Terry Burnette et al.  Abstract
JCAA/JG-PP NO-LEAD SOLDER PROJECT: VIBRATION TEST Thomas A. Woodrow, Ph.D.  Abstract
JCAA/JG-PP NO-LEAD SOLDER PROJECT: THERMAL SHOCK TEST Thomas A. Woodrow, Ph.D.  Abstract
OPTIMIZING LEAN MANUFACTURING IN ELECTRONICS MANUFACTURING SERVICES Todd Baggett  Abstract
REPLACEMENT OF WIRE-BOND INTERCONNECTS FOR DIRECT CHIP ATTACH OF POWER SEMICONDUCTORS Todd P. Oman  Abstract
CASE STUDY IMPLEMENTATION OF LOW SOLIDS VOC COMPLIANT CLEANING TECHNOLOGY AT A LARGE EMS OPERATION Tom Gervascio and Mike Bixenman  Abstract
EFFECTIVE FLUX REMOVAL UNDER STRINGENT ENVIRONMENTAL LIMITATIONS Umut Tosun and Sylvain Chamousset  Abstract
Pb-FREE PROCESS DEVELOPMENT AND MICROSTRUCTURAL ANALYSIS OF CAPACITOR FILTER ASSEMBLIES USING SOLDER PREFORMS Vatsal A. Shah et al.  Abstract
QUALIFICATION TESTING OF Pb-FREE ASSEMBLIES USING BALL STACKED CHIP SCALE IC PACKAGING Vern Solberg and Ignacio Osorio  Abstract
MATERIAL LOGISTICS FOR LEAD-FREE W. James Hall and Phil Zarrow  Abstract
MICROVIA-IN-PAD TECHNOLOGY CHALLENGES ON BGA PACKAGE PERFORMANCE Wendy Chet Ming, Ngoh et al.  Abstract
TEST METHODS AND COMPLIANCE WITH PRODUCT SUBSTANCE BANS William L. Olson and William F. Hoffman III  Abstract
DEVELOPING A BUSINESS CASE FOR IMPLEMENTING RFID IN MANUFACTURING William M. Scott  Abstract
CHARACTERIZATION OF SOLDER JOINT STRENGTH FOR HIGH I/O FCBGA PACKAGE WITH VARIOUS COMPRESSIVE LOAD FORCES AND COMPONENT PAD SURFACE FINISHES X. Zhou, J. Bath, K. Hyland, and D. Willie et al.  Abstract
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