2000 Emerging Technologies Proceedings

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TITLE AUTHOR
DOES HIGH RELIABILITY EQUAL ZERO DEFECTS? Alexander J. Porter  Abstract
INTERCONNECTIONS IN 3 DIMENSIONS FOR HIGH SPEED COMPONENTS Christian VAL, CEO  Abstract
FLIP-CHIP AND GaAs : A ROUTE FOR RF PACKAGING Claude Drevon  Abstract
COST OPTIMIZATION OF HIGH DENSITY SUBSTRATES USING PLANAR RESISTORS Daniel Brandler  Abstract
CIRCUIT CONSTRUCTIONS AND MATERIAL SELECTIONS OF FLEX CIRCUITS FOR HIGH DENSITY INTERCONNECTS Darryl J. McKenney and Dominique Numakura  Abstract
CONSIDERATIONS FOR THE PIN PROBE TESTING OF NO-CLEAN SOLDER PASTE RESIDUES David Suraski  Abstract
LASER-ASSISTED PLATING OF PRINTED CIRCUIT BOARD (PCB) MICROVIAS E. S.W. Leung, W. K.C. Yung, W.B. Lee  Abstract
LASER SOLDERING APPLICATIONS FOR RF SHIELD REWORK Edgar Cerda  Abstract
SmartMediaTM CARD PACKAGING USING Au STUD BUMP AND ACF In-Ku Kang  Abstract
DIELECTRIC CHARACTERIZATION OF EMBEDDED CAPACITANCE FILMS AT MICROWAVE FREQUENCIES J. Obrzut and R. Nozaki  Abstract
SOLDERABILITY OF LEAD FREE METALLIZATIONS ON BOARD- AND COMPONENT-LEVEL UNDER DIFFERENT ATMOSPHERES, ESPECIALLY NITROGEN Jens Tauchmann  Abstract
CIRCUIT CARD ASSEMBLY PRODUCT DEVELOPMENT FOR HIGH DENSITY ELECTRONIC PACKAGING Michael G. Luke  Abstract
EVALUATION OF GAS CHEMISTRY EFFECTS ON WIRE BOND INTEGRITY AND PACKAGE INTERFACIAL ADHESION IN THE BGA PACKAGE Michael Leoni  Abstract
LITHIUM POLYMER CELL HIGH VOLUME MANUFACTURING Napoleon C. Cailipan  Abstract
THE EFFECT OF COPPER ADDITIONS IN THE ALUMINUM ALLOY METALLIZATIONS ON THE FORMATION OF INTERDIFFUSION ZONES AND VOIDS IN GOLD BALL BONDS Narendra Noolu  Abstract
EFFECTS OF BACKSIDE SCRATCHES ON RELIABILITY OF FLIP CHIPS ON ORGANIC BOARD ASSEMBLIES Prasad Godavarti  Abstract
IC AND MEMS TRENDS AND RELIABILITY Reza Ghaffarian, Ph.D.  Abstract
A UNIQUE, POLYIMIDE FILM BASED SUBSTRATE TECHNOLOGY THE NEO MANHATTAN TAPE INTERPOSER (NMTI) Stephen G. Pierce  Abstract
FLUORINATED SOLDERING TECHNOLOGY Stephen M. Bobbio  Abstract
METALLURGICAL AND RELIABILITY ASPECTS OF LEAD-FREE MIXED TECHNOLOGY ELECTRONIC ASSEMBLY FOR MOBILE COMMUNICATION PRODUCTS Steven O. Dunford & Dr. Puligandla Viswanadham  Abstract
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