SMTA International 2013 Proceedings

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TITLE AUTHOR
European Union RoHS Recast – Implication For Exemption And Substance Review Adam Wheeler, Jackie Adams, Marie Cole, Curtis Grosskopf, Jeff Lagler, Sophia Lau, Dale Wilhite, and Kurt Van der Herten  Abstract
New Directions In Electrical Test Scalability & Automation Alan Albee and Bobby Griffis  Abstract
Lead Tinning Requirements For The 21st Century Alan Cable and Roger Cox  Abstract
Demonstrated Process And Reliability Of 0.35 mm Pitch BGA Devices For Mobile Environment Alan Choi, Brian Roggeman and Mark Schwarz  Abstract
Nanomaterials And Printed Electronics Alan Rae  Abstract
Mining Electronics For Rare Earths Alan Rae  Abstract
Conformal Coating 101: General Overview, Process Development, And Control Methods Alex Zeitler  Abstract
Effect Of Mixed Alloy BGA Reballing On Board Level Drop Test Reliability Andrew Daya and S. Manian Ramkumar, Ph.D.  Abstract
Effect Of Sn Grain Morphology On Failure Mechanism And Reliability Of Lead-Free Solder Joints In Thermal Cycling Tests Babak Arfaei, Ph.D. and Martin Anselm, Ph.D.; Shantanu Joshi, Sam Mahin-Shirazi, Peter Borgesen, Ph.D. and Eric Cotts, Ph.D.; James Wilcox, Ph.D.; and Richard Coyle, Ph.D.  Abstract
Reliability Testing Of PWB Plated Through Holes Using Interconnect Stress Testing Thermal Cycling Before And After Pb-Free Reflow Preconditioning Bill Birch  Abstract
Materials Testing of PWB Substrates to Determine Survivability Through Lead Free Assembly Bill Birch and Jason Furlong  Abstract
Data Fusion For Augmented Electronic Counterfeit Detection Efficacy Bill Cardoso, Ph.D.  Abstract
Probe Technologies To Improve First Pass Yields Brian Crisp, Ken Snyder and Tom Merline; Brook Sandy-Smith  Abstract
Electrical Performance Evaluation Of High-Frequency Laminates As A Function Of Temperature And Humidity Brian Wright  Abstract
Optimizing Assembly Of QFNs Brook Sandy-Smith and Seth Homer  Abstract
Solder Assembly Solutions For 3DIC Packaging Charles G. Woychik Ph.D., Ellis Chau, Sitaram Arkalgud Ph.D., Andrew Cao Ph.D. and Vern Solberg  Abstract
Reliable Plated Through Via Design And Fabrication Cheryl Tulkoff and Craig Hillman, Ph.D.  Abstract
Best Practices For Improving The PCB Supply Chain: Performing The Process Audit Cheryl Tulkoff, Greg Caswell, and Craig Hillman, Ph.D.  Abstract
A Technology To Reduce Pad Cratering Defects And The Impact On Product Cost Chet A. Palesko, Amy J. Palesko; and Chris Hunrath, Ken Parent  Abstract
Improving Electronics Sustainability With A Novel Reusable, Unzippable, Sustainable Electronics (Reuse) Interconnect System Chris Hunt and Martin Wickham; Robin Pittson; and John Lewison  Abstract
Fine Tuning The Stencil Manufacturing Process And Other Stencil Printing Experiments Chrys Shea and Ray Whittier  Abstract
Gold Embrittlement In Lead-Free Solder Craig Hillman, Ph.D., Nathan Blattau, Joelle Arnold, Thomas Johnston, and Stephanie Gulbrandsen; Julie Silk; and Alex Chiu  Abstract
High I/O BGA Connector Solder Joint Integrity Investigation D. Hillman, R. Wilcoxon, K. Cho, J. Sailer, J. Waskow, J. Crawford, T. Wade  Abstract
Overcoming The Challenges Presented With Automated Selective Conformal Coating Of Advanced Electronic Assemblies By Employing Plasma Treatment Technology David Foote  Abstract
Copper Corrosion Effects From Cleaning Agent Entrapment David Thomas Lober and Mike Bixenman, D.B.A; and Linda Woody  Abstract
Impact Of Lead Free Assembly On Laminate Electrical Performance For High Layer Count And High Reliability PCB Deassy Novita, Ph.D., Gary Brist, and Gary Long  Abstract
A.R.E.A.- A Roadmap Of Technology And Reliability Characterization Denis Barbini, Ph.D. and Martin Anselm, Ph.D.  Abstract
ESD Concept – Person, Workplace, Machinery, Transportation Dipl.-Ing. Hartmut Berndt  Abstract
Is A High Phosphorus Content In The Nickel Layer A Root Cause For “Black Pad” On Enig Finishes? Dipl.-Ing. Mustafa Özkök, Joe McGurran, and Kenneth Lee, Ph.D.  Abstract
Ultra Fine Pitch Reballing –What Needs To Change? Don Naugler and Robert Wettermann  Abstract
Acceptance Testing Of Pb-Free Bar Solder Alloys Elizabeth Elias Benedetto, Aileen Allen, Kris Troxel, Jian Miremadi  Abstract
Case Study: Tools To Assure Compatibility Of Conformal Coatings And No-Clean Lead-Free Solder Pastes Emmanuelle Guéné and Céline Puechagut  Abstract
Understanding Electrical Leakage And Electrochemical Migration In Electronics Eric Camden  Abstract
Jetetch Cuprotect And Copper IC Inspection Erik Jordan  Abstract
Next Generation No-Clean Lead Free Solder Paste Evaluation For Fine Pitch Applications Fei Xie, Ph.D., Daniel F. Baldwin, Ph.D., Paul N. Houston, Brian J. Lewis, Han Wu  Abstract
Effect Of Variation In The Reflow Profile On The Microstructure Of Near Eutectic SnAgCu Alloys Francis Mutuku, Babak Arfaei, Ph. D. and Eric J. Cotts, Ph.D  Abstract
Effect Of Variation In The Reflow Profiles Of Pb Free Solder On Lifetimes In Room Temperature Fatigue Tests Francis Mutuku, Eric Cotts, Ph.D. and Babak Arfaei, Ph.D., Martin Anselm, Ph.D.  Abstract
Can Selective Soldering Meet Fine Pitch And Other Trends? Gerjan Diepstraten  Abstract
The Effect Of Coating And Potting On The Reliability Of QFN Devices Greg Caswell and Cheryl Tulkoff  Abstract
Investigations Of Sintering Technology For Power Electronics Hans-Jurgen Albrecht, N. Busche, J. Strogies, and K. Wilke  Abstract
A Multi-Level Finite Element Study To Analyze The Chippackage- Interaction For Cu/Low-K Interconnects Hardik Parekh, Fahad Mirza, Samip Shah, and Dereje Agonafer  Abstract
Fine Pitch Re-Ball And Reliability Harry Schoeller, Ph.D. and Michael Meilunas  Abstract
Soldering In Nitrogen Atmosphere – Do Quality Aspects Justify The Costs? Heike Schlessmann and Ronny Horn, Ph.D.  Abstract
Corrosion Resistance Of High Temperature Lead-Free BiAgX TM Paste HongWen Zhang, RunSheng Mao and Ning-Cheng Lee, Ph.D.  Abstract
High Reliability Pb-Free Halogen Free Solder Ian J. Wilding and Gavin J. Jackson  Abstract
A Pseudo-Stress, Pseudo-Strain Methodology To Predict Lead-Free Solder Joint Reliability Jean-Paul Clech  Abstract
Stencil Aperture Design Considerations For 0.3 CSP Ultra-Fine Pitch Printing Jeff Schake, Mark Whitmore and Clive Ashmore  Abstract
Improved Prediction of Compressive Forces Required in Thermal Interface Pad Applications Jeffrey Marcus Jennings  Abstract
Voiding Mitigation For Bottom Terminated Components Jennifer Nguyen, David Geiger and Murad Kurwa  Abstract
Developing A Knowledge Based Risk Identification System For Sophisticated SMT Assembly Design And Development Jingsong Xie, Ph.D.; Yu-Ming Ye and Ji-Fan Wang  Abstract
Conductive Anodic Filament (CAF) Performance Of PWB Materials Before And After Pb-Free Reflow Joe Smetana, Kim Morton, and Thilo Sack  Abstract
Strain Rate And Cyclic Dependencies Of PCBA Pad Crater Susceptibility John McMahon, Brian Standing, Michael Thomson, Jim Wilcox, Derek Robertson, and Matt Kelly  Abstract
Warpage Mitigation Processes In The Assembly Of Large Body Size Mixed Pitch BGA Coreless Packages For Use In High Speed Network Applications John Savic and Weidong Xie; Nokibul Islam, Park Gun Oh, Raj Pendse and KyungOe Kim  Abstract
Flex Based Embedded Die System In Package Modules Jon Aday, Theodore Tessier, and Kazuhisa Itoi  Abstract
High Density Assembly In PCB Cavities Jonas Sjoberg, Ranilo Aranda, David Geiger and Murad Kurwa  Abstract
New Requirements For SIR- Measurement Jörg Trodler and Mathias Nowottnick  Abstract
New Interconnection For High Temperature Application: HotPowCon (HPC) – Part 2 Jörg Trodler, Mathias Nowottnick, and Andreas Fix, Timo Herberholz  Abstract
Solder Joint Crack Investigations In Real Cases Jose M. Servin and Cynthia Gomez  Abstract
Effects Of Materials, Design And Process On Intermetallic Formation And Evolution In Solder Microbumps K. Schnabl, L. Wentlent, K. Mootoo, E. Perfecto, M. Lu, and P. Borgesen  Abstract
Alternative Lead-Free Alloys For SMT Assembly Karl F. Seelig  Abstract
Production Testing Of Ni-Modified SnCu Solder Paste Karl Seelig, Timothy O’Neill, Kevin Pigeon & Mehran Maaleckian; Andy Monson and Walter Machado; and Chrys Shea  Abstract
Legacy Management: Cross-Industry Sustaining Engineering And Managing Obsolescence Counterfeit Risk Kaye Porter  Abstract
Modified Hypereutectic Sn-Cu Pb-Free Solder For Power Semiconductor Die Attach Keith Sweatman, Motonori Miyaoka, Takatoshi Nishimura, Xuan Quy Tran, Stuart McDonald, and Kazuhiro Nogita  Abstract
In Search Of A Workable Counterfeit Risk Mitigation Strategy: Lessons Learned In Review Of The Current State Of The Electronics Industry As Regards Counterfeit Mitigation Requirements For Suppliers Kevin Sink  Abstract
Converting High Volume IC Manufacturing To Cu Wire Packaging Larry Bright  Abstract
Power Electronics Packages With Embedded Components – Recent Trends And Developments Lars Boettcher, Stefan Karaszkiewicz, Dionysios Manessis and Andreas Ostmann  Abstract
A Process For Improved QFN Reliability Lenora Toscano, John Ganjei, Ph.D, Richard Retallick, and Gu Hong, Ph.D  Abstract
Impact Of Component Bake On Solder Joint Quality Lilia May, Dudi Amir, Srinivasa R. Aravamudhan, Garrett D.Cogburn, Christopher Kovalchick, Rajen S. Sidhu, Suddhasattwa Nad, Wade Hezeltine  Abstract
Nanocopper As A Replacement For Solder -- A Question Of Reliability? Luke Wentlent, Karl Schnabl, S. Khasawneh, K. Mootoo, J. Owens, J. Jiang, A. A. Zinn, J. Beddow, R. Stoltenberg, J. Chang, E. Hauptfleisch, D. Blass, and Peter Borgesen, Ph.D.  Abstract
Investigation On Pad Crater Failure Of BGA Solder Joints Luo Daojun, Zou Yabin and He Guanghui  Abstract
Facilitating The Reduction Of Head-In-Pillow Defects And Improving Assembly Reliability & In-Line Productivity Using Nitrogen Reflow Maëva S. Tureau, Ph.D., Gregory K. Arslanian, Christine C. Dong, Ph.D.  Abstract
Fix The Process Not Just The Product Mary Elmallakh, M. Sc. and Paul Groome; and Andy Shelton  Abstract
Solder Joint Encapsulant Adhesive – Pop TMV High Reliability And Low Cost Assembly Solution Mary Liu, Ph.D. and Wusheng Yin, Ph.D.  Abstract
Silica Gel Coating For Thermal Management Of Electronic Components Mathias Nowottnick, Felix Bremerkamp and Dirk Seehase  Abstract
Plasma Stencil Treatments: A Statistical Evaluation Matt Kelly, P.Eng., William Green, Marie Cole, Ruediger Kellmann  Abstract
Accountability Structure In A Contract Manufacturing Engineering Department Michael E. Gerner  Abstract
Progression To 0.3 mm Pitched BGA SMT Assembly Michael Kochanowski, M.B.A.  Abstract
Enclosed Media Printing As An Alternative To Metal Blades Michael L. Martel  Abstract
Fine Pitch Reliability Comparisons Between Components Assembled On Motherboards Containing Filled Or Unfilled Microvia-In-Pad Michael Meilunas and Martin Anselm, Ph.D.  Abstract
QFN Design Considerations to Improve Cleaning Mike Bixenman, Dale Lee, Bill Vuono, and Steve Stach  Abstract
Electronic Assembly Misprint Cleaning Advancements Mike Bixenman, DBA and Dirk Ellis; Jody Saultz, Eric Becker, Greg Calvo and Jim Morris  Abstract
Eliminating Wave Soldering With Low Melting Point Solder Paste Mitch Holtzer and Tuck Weng Mok  Abstract
Low Temperature Alloy Development For Electronics Assembly – Part II Morgana Ribas, Ph.D., Sujatha Chegudi, Anil Kumar, Sutapa Mukherjee, Siuli Sarkar, Ph.D.; Ranjit Pandher, Ph.D., Rahul Raut, and Bawa Singh, Ph.D.  Abstract
Penetration Into An International Market: The Aspects Of Sales Channels Management Moshe Shavit, D.B.A. and Kewal K. Verma, Ph.D.  Abstract
A Study Of Lead-Free Low Silver Solder Alloys With Nickel Additions Munehiko Nakatsuma, Takehiro Wada, Kimiaki Mori, Koichi Shimokawa, Takeshi Shirai, Atsushi Irisawa, Roberto Garcia, Jasbir Bath  Abstract
Solder / Metallization Interdiffusion – Case Studies Nausha Asrar, Ph.D.  Abstract
Factors Impacting Solder Extrusion In Reworkable Underfills Neil Poole, Ph.D.  Abstract
Predicting The Reliability Of Package-On-Package Interconnections Using Computational Modeling Software Paul T. Vianco, Ph.D., Michael K. Neilsen, Jerome A. Rejent, J. Mark Grazier, and Alice C. Kilgo  Abstract
Benefit And Challenges Of Manufacturing With Printed Circuit Board Cavities Pedro J. Martinez, William O. Alger, Weston C. Roth, and Sanjay Goyal  Abstract
Capillary IC – A New Platform For Detection Of Ionic Compounds On Electronic Components Peter Bodsky  Abstract
Life Prediction Of Lead-Free Electronics Under Simultaneous Automotive Environments Of High Temperature And Vibration Pradeep Lall, Ph.D. and Geeta Limaye  Abstract
Process And Material Envelope For Allowable Package-On-Package Warpage Pradeep Lall, Ph.D., Kewal Patel, and Vikalp Narayan  Abstract
High Strain Rate Properties Of SAC105 And SAC305 Leadfree Alloys After Extended High Temperature Storage Pradeep Lall, Sandeep Shantaram; and David Locker  Abstract
Print Performance Studies Comparing Electroform And Laser-Cut Stencils Rachel Miller Short and William E. Coleman Ph.D.; and Joseph Perault  Abstract
Solderability And Oxide Thickness Measurement To Determine Long Term Storage Of BGA And QFP Rama Hegde, Ph.D. Terry Burnette and Andrew Mawer  Abstract
Design For Reliability With Computer Modeling Randy Schueller, Ph.D. and Cheryl Tulkoff  Abstract
Ultra-Flat And Almost No Profile ED-Copper Foils For High Speed Digital Pcbs And Chip Scale Packaging Raymond Gales  Abstract
Overview Of Industry Roadmaps For Printed Electronics Reza Ghaffarian, Ph.D.  Abstract
The Effect Of Pb Mixing Levels On Solder Joint Reliability And Failure Mode Of Backward Compatible, High Density Ball Grid Array Assemblies Richard Coyle, Raiyo Aspandiar, Vasu Vasudevan, Steve Tisdale, Iulia Muntele, Richard Popowich, Debra Fleming, and Peter Read  Abstract
Inemi Pb-Free Alloy Characterization Project Report: Part Vi – The Effect Of Component Surface Finish And Solder Paste Composition On Thermal Fatigue Of Sn100c Solder Balls Richard Coyle, Richard Parker, Babak Arfaei, Keith Sweatman, Keith Howell, Stuart Longgood, and Elizabeth Benedetto  Abstract
Inemi Pb-Free Alloy Characterization Project Report: Part V – The Effect Of Dwell Time On Thermal Fatigue Reliability Richard Coyle, Richard Parker, Michael Osterman, Stuart Longgood, Keith Sweatman, Elizabeth Benedetto, Aileen Allen, Elviz George, Joseph Smetana, Keith Howell, Joelle Arnold  Abstract
Thermal Cycle Fatigue Life Models For Wlcsp Solder Joints Robert Darveaux  Abstract
Smt Assembly Challenges And Proven Solutions For Improving Yields Robert Dervaes  Abstract
Stencil And Solder Paste Inspection Evaluation For Miniaturized SMT Components Robert Farrell and Chrys Shea  Abstract
Using Weibull Analysis To Interpret Failure Data In Electronics Assembly Stress Testing Ronald C. Lasky, Ph.D., P.E.  Abstract
01005 Passive Component Rework Ronald Wachter  Abstract
Evaluation of Solder Pastes for High Reliability Applications Scott J. Anson Ph.D., PE; Michael McLaughlin and Abner Argueta  Abstract
Characterization Of Solder Paste Wetting/Spreading Performance – Current Status In International Norms And Standards Sebastian Stengel and Prof. Dr.-Ing. Marcus Reichenberger; and Jörg Trodler and Albert Heilmann  Abstract
Characteristics Of EPIG Deposits For Fine Line Applications Shigeo Hashimoto, Katsuhisa Tanabe, Masayuki Kiso, Kota Kitajima, Tatsushi Someya, and Don Gudeczauskas and George Milad  Abstract
Lead Free Antimony – Based Alloy Characterization Siew Kee Lee, You Chye How, and YS Khoo  Abstract
Underfill Encapsulants And Edgebond Adhesives For Enhancing Of Board Level Reliability Simon Chang, Edward S. Ibe, and Karl I. Loh  Abstract
Impact Of Low Silver Solder Pastes On Area Array Solder Joint Quality Srinivasa Aravamudhan, Raiyo Aspandiar, Ph.D., Lilia May, Ph.D., Suddhasattwa Nad, Scott Mokler, and Dudi Amir  Abstract
International Counterfeit Avoidance Certification By The IEC IECQ Stanley H. Salot Jr.  Abstract
Lead-Free Laminate DMA And Tma Data To Develop Stress Versus Temperature Relationship For Predicting Plated Hole Reliability Stephanie Moran, Joseph Smetana Jr., and Michael Freda  Abstract
Transducer And System Dependency Of Scanning Acoustic Microscope Images For Plastic Encapsulated Microelectronics Stephen C. Hwang  Abstract
Effect Of Warpage On SMT Process Of Pop Package And Its Solution Stephen Guo, Fubin Song, Jeff Qi and James Huang; and Alex Chen  Abstract
Enhancing Mechanical Shock Performance Using Edgebond Technology Steven Perng, Tae-Kyu Lee, and Cherif Guirguis; and Edward S. Ibe  Abstract
Manufacturability Assessment Of Next-Generation PCB Surface Finishes Sue Teng, J. Oliver and Scott Priore  Abstract
Advanced Organic Substrate Technologies to Enable Extreme Electronics Miniaturization Susan Bagen, Dave Alcoe, Kim Blackwell, Frank Egitto, Steven Rosser, Rabindra Das, and Glen Thomas  Abstract
Impact Of FPC Fabrication Process On SMD Reliability Susie Johansson, John Dzarnoski, Yangjun Xing  Abstract
A Method For Quickly Evaluating Aluminum Pad Corrosion Terence Q. Collier  Abstract
Effect Of System Design And Test Conditions On Wafer Level Package Drop Test Reliability Tiao Zhou, Ph.D. and Xuejun Fan, Ph.D.  Abstract
Alloy And Process Optimization For Low Ag Solders Timothy Jensen and Edward Briggs  Abstract
Can Nano-Coatings Really Improve Stencil Performance? Tony Lentz  Abstract
Concentration Monitoring & Closed Loop Control – A Technological Advancement Umut Tosun, M.S.Chem.Eng., and Axel Vargas; and Bryan Kim, Ph.D.  Abstract
The Second Generation Shock Resistant And Thermally-Reliable Low Ag SAC Solder Doped With Mn Vahid Goudarzi, Matthew Brown, Weiping Lin, Ning-Cheng Lee, and Jeffrey Chang Bing Lee  Abstract
State-Of-The-Art Test Techniques Vaughan Carlson  Abstract
Manufacturability Assessments Of Board Level Adhesives On Fine Pitch Ball Grid Array Components Venmathy Rajarathinam, James Wade, Alan Donaldson, Raiyo Aspandiar, Devadoss Chelladurai, Scott Mokler  Abstract
Higher Density Pop Semiconductor Packaging Solution: Bridging The Infrastructure Gap Between Wire-Bond And TSV Interconnect Vern Solberg, Belgacem Haba Ph.D., Wael Zohni, Ilyas Mohammed Ph.D. and Charles Woychik Ph.D.  Abstract
Investigation Of The Root-Cause Of Solder Bubbles In A Via Wang Yang and Luo Daojun  Abstract
Comparing LGA And BGA Assemblies In Terms Of Solder Pad Cratering Y. Zeng, Pericles Kondos, J. Jiang, Martin Anselm and Peter Borgesen  Abstract
Voiding And Reliability Of Bga Assemblies With Sac And 57Bi42Sn1Ag Alloys Yan Liu, Joanna Keck, Erin Page, and Ning-Cheng Lee, Ph.D.  Abstract
Reliability Improvement Of Array QFN Package You-Chye How  Abstract
3-D Fracture Analysis Of The Beol Region Of A Flip Chip Package During Die Attach Process Zaeem Baig, Fahad Mirza, Hardik Parekh and Dereje Agonafer  Abstract
2D/3D X-Ray Inspection: Process Control And Developmet Tool Zhen (Jane) Feng, Ph. D., Tho Vu, Michael Xie, David A. Geiger, Murad Kurwa; Zohair Mehkri; and Evstatin Krastev, Ph. D.  Abstract
Long-Term Aging Effects on Reliability Performance of Lead-Free Solder Joints Zhou Hai, Jiawei Zhang, Chaobo Shen, John L. Evans, Ph.D. and M. J. Bozack  Abstract
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