Pan Pacific Symposium 2013 Proceedings

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TITLE AUTHOR
2013 iNEMI TECHNOLOGY ROADMAP OVERVIEW Bill Bader and Chuck Richardson  Abstract
IMPACT OF LEAD-FREE COMPONENTS AND TECHNOLOGY SCALING FOR HIGH RELIABILITY APPLICATIONS Chris Bailey, Ph.D.  Abstract
Technical Communications: Strategies For Success Chrys Shea  Abstract
THE QUEST FOR RELIABILITY STANDARDS Dieter W. Bergman  Abstract
REQUIREMENTS ON A CLASS “0” EPA – BASICS, STANDARDS, ESD EQUIPMENTS AND MEASUREMENTS Dipl.-Ing. Hartmut Berndt  Abstract
Three Dimensional Integration Research Focusing on Device Embedded Substrate Hajime Tomokage  Abstract
MICROSTRUCTURE CONTROL OF UNI-DIRECTIONAL GROWTH OF ?-CU6SN5 IN MICROBUMPS ON (111) ORIENTED AND NANOTWINNED CU Han-wen Lin, Jia-ling Lu, Chien-min Liu, Chih Chen, King-ning Tu, Delphic Chen, and Jui-Chao Kuo  Abstract
ALTERNATIVES TO SOLDER IN INTERCONNECT, PACKAGING, AND ASSEMBLY Herbert J. Neuhaus, Ph.D., and Charles E. Bauer, Ph.D.  Abstract
JETTING FINE LINES FOR HIGH VISCOSITY FLUIDS ONTO 2D AND 3D ELECTRONIC PACKAGES Horatio Quinones  Abstract
DIELECTRICS FOR EMBEDDING ACTIVE AND PASSIVE COMPONENTS J. Kress, R. Park, A. Bruderer, and N. Galster; and SH Cho  Abstract
THE CHALLENGES OF LGA SERVER SOCKET TRENDS Jackson Chang, Michael Hung, Bono Liao, and Nick Lin; Andrew Gattuso; and Bob McHugh  Abstract
ACOUSTIC MICRO IMAGING ANALYSIS METHODS FOR 3D PACKAGES Janet E. Semmens  Abstract
3D INTEGRATION A THERMAL-ELECTRICAL-MECHANICAL-RELIABILITY STUDY K. Weide-Zaage, J. Schlobohm, H. Frémont, A. Farajzadeh, J. Kludt  Abstract
A NANO SILVER REPLACEMENT FOR HIGH LEAD SOLDERS IN SEMICONDUCTOR JUNCTIONS Keith Sweatman, Tetsuro Nishimura, and Teruo Komatsu  Abstract
3D-TSV VERTICAL INTERCONNECTION USING Cu/SnAg DOUBLE BUMPS AND NON-CONDUCTIVE FILMS (NCFs) Kyung-Wook Paik,Yongwon Choi, and Jiwon Shin  Abstract
2Advanced Semiconductor Engineering Test RD Martin Anselm, Ph.D., and Wayne Jones  Abstract
AEROSOL JET? PRINTING OF CONDUCTIVE EPOXY FOR 3D PACKAGING Michael J. Renn, Ph.D., and Kurt K. Christenson, Ph.D.; Donald Giroux; and Daniel Blazej, Ph.D.  Abstract
DESIGN AND FABRICATION OF ULTRA-THIN FLEXIBLE SUBSTRATE Ming-Kun Chen, Yu-Jung Huang, Yi-Lung Lin, and Shen-Li Fu  Abstract
A MECHANISTICALLY JUSTIFIED MODEL FOR LIFE OF SnAgCu SOLDER JOINTS IN THERMAL CYCLING P. Borgesen, L. Yang, A. Qasaimeh, L. Yin, and M. Anselm  Abstract
TAMPER PROOF, TAMPER EVIDENT ENCRYPTION TECHNOLOGY Phil Isaacs, Thomas Morris Jr., and Michael J. Fisher; and Keith Cuthbert  Abstract
LOW-COST AND HIGH PERFORMANCE SILICON INTERPOSERS AND PACKAGES (LSIP) – A NEW GEORGIA TECH PRC INDUSTRY CONSORTIUM Rao R. Tummala, Ph.D., Venkatesh Sundaram, Ph.D., Qiao Chen, Hao Lu, and Gokul Kumar  Abstract
Panel Level Packaging - A Manufacturing Solution For Cost-Effective Systems Rolf Aschenbrenner, K.-F. Becker, T. Braun, and A. Ostmann  Abstract
SILICON V-GROOVE ALIGNMENT BENCH FOR OPTICAL COMPONENT ASSEMBLY Terry Bowen  Abstract
Cleaning High Reliability Assemblies with Tight Gaps, a Detailed Analysis Thomas M. Forsythe  Abstract
A NEW MANUFACTURING MODEL FOR SUCCESSFULLY COMPETING IN HIGH LABOR RATE MARKETS Tom Borkes  Abstract
BVA: SOLUTION FOR NEXT GENERATION VERY FINE-PITCH PACKAGE-ON-PACKAGE (PoP) APPLICATIONS Vern Solberg and Ilyas Mohammed  Abstract
3D IC INTEGRATION TECHNOLOGY DEVELOPMENT IN CHINA Wei Koh, Ph.D.  Abstract
COMPUTED TOMOGRAPHY ON ELECTRONIC COMPONENTS BETTER WAYS TO DO FAILURE ANALYSIS PLUS 4D CT THE NEW FRONTIER Wesley F. Wren  Abstract
SIDE WALL WETTING INDUCED VOID FORMATION DUE TO SMALL SOLDER VOLUME IN MICROBUMPS OF Ni/SnAg/Ni UPON REFLOW Y. C. Liang, C. Chen, and K. N. Tu  Abstract
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