SMTA International 2000 Proceedings

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TITLE AUTHOR
AREA ARRAY REWORK – MOVING INTO THE NEXT MILLENNIUM Aaron Unterborn & Don Adams  Abstract
REWORK OF "MIRROR IMAGED" AREA ARRAY ASSEMBLIES Abhijit Limaye  Abstract
BGA SOLDER JOINT VOID AND ITS EFFECT ON THERMAL FATIGUE Agata Doroszuk  Abstract
LGA vs. BGA: WHAT IS MORE RELIABLE? A 2ND LEVEL RELIABILITY COMPARISON Ahmer Syed and Robert Darveaux  Abstract
FLIP CHIP SMT ASSEMBLY PROCESS TRADE-OFF COST ANALYSIS Alan R. Reinnagel  Abstract
LEAD FREE SOLDER FLUX VEHICLE SELECTION PROCESS Andrew Butterfield  Abstract
AUTOMOTIVE PBGA ASSEMBLY AND BOARD-LEVEL RELIABILITY WITH LEAD-FREE VERSUS LEAD-TIN INTERCONNECT Andrew Mawer and Kim-Marie Levis  Abstract
EVALUATING AND IMPLEMENTING POST-PLACEMENT/PRE-REFLOW INSPECTION Andrew Yates  Abstract
ADVANTAGES OF NON-CONTACT DISPENSING IN SMT ASSEMBLY PROCESSES Anthony F. “Frank” Piracci  Abstract
A WAFER LEVEL CHIP SIZE PACKAGE FOR MICROMECHANICAL AND MICROLENSES APPLICATIONS Avner Badihi  Abstract
CAN X-RAY IMAGING SERVE AS A METROLOGY TOOL? B. S. Mani  Abstract
THE IMPACT OF LEAD-FREE REFLOW TEMPERATURES ON THE MOISTURE SENSITIVITY PERFORMANCE OF PLASTIC SURFACE MOUNT PACKAGES B.T. Vaccaro, R.L. Shook, D.L. Gerlach  Abstract
POST-SOLDER CLEANING OF LEAD-FREE SOLDER PASTE RESIDUES Beth A. Bivins  Abstract
MEASUREMENT OF LARGE SOLDER VOIDS USING X-RAY IMAGE ANALYSIS Bill Olson and Mark Cholewczynski  Abstract
CHALLENGES IN MEMS PACKAGING Bishnu Gogoi  Abstract
IMPLEMENTING SELECTIVE SOLDERING: A COST EFFECTIVE ALTERNATIVE TO TRADITIONAL MASS SOLDERING Bob Klenke  Abstract
'BLACK BOX' ELECTRONICS MANUFACTURING - A PARADIGM SHIFT IN PROCESS CONTROL Brian Coll  Abstract
FLIP CHIP ON FLEX (FCOF): A ONEPASS PROCESS FOR CLEAN PRODUCTS Bryan D. Roecker and Greg Christner  Abstract
A CONSTITUTIVE MODEL FOR Pb/Sn SOLDER ALLOYS C. Basaran  Abstract
MINI-WAVE SELECTIVE SOLDERING – A MANUFACTURING ALTERNATIVE FOR DOUBLE-SIDED SURFACE MOUNT ASSEMBLIES Charlie Davis  Abstract
DESIGNING DISPENSING EQUIPMENT FOR VERY HIGH SPEED Chris Lee and Craig Lazinsky  Abstract
DFM: WHAT DOES IT REALLY MEAN? Dale Lee  Abstract
EXPERIMENTAL VALIDATION OF THE IMPACT OF THERMAL EXPANSION OFPRINTED CIRCUIT BOARDS SOLDER JOINT RELIABILITY Dan Rose, Brian Hunter  Abstract
PRODUCTION APPLICATION OF FLAT SOLDERABLE TIN FINISHES: SOME PRACTICAL CONSIDERATIONS David H. Ormerod  Abstract
A TRUE NO CLEAN / NO RESIDUE SMT PROCESS Demetrios Hatzis  Abstract
NEGOTIATING THE CEM SEA CHANGE Dirk McCoy  Abstract
EVAUATION OF IMMERSION SILVER FINISH FOR AUTOMOTIVE ELECTRONICS Dongkai Shangguan  Abstract
COMBINING VISUAL AND X-RAY INSPECTION OF AREA ARRAY DEVICES Douglas J. Peck  Abstract
MEMS PACKAGING & ASSEMBLY ISSUES Dr. Ken Gilleo  Abstract
IMPACT OF HIGHER MELTING LEAD-FREE SOLDERS ON THE RELIABILITY OF PRINTED WIRING ASSEMBLIES Dr. Laura J. Turbini  Abstract
WAFER LEVEL INTERCONNECTS WITH LEAD-FREE AND LOW ALPHA SOLDERS Dr. Ning-Cheng Lee  Abstract
DESIGN OF EXPERIMENTS FOR LEAD FREE MATERIALS, SURFACE FINISHES AND MANUFACTURING PROCESSES OF PRINTED WIRING BOARDS Dr. Sammy Shina  Abstract
CAPACITOR INDUCED BGA ASSEMBLY FAILURES Dudi Amir  Abstract
HUMAN ERROR AND MISTAKE PROOFING IN ELECTRONICS MANUFACTURING Edwin B. Smith III  Abstract
PIN IN PASTE PROCESS FOR ODD FORM ASSEMBLY Eyal Epstein  Abstract
A COMPARISON OF IMMERSION AND ELECTROLYTIC GOLD AS A FINAL FINISH FOR PCBS George M. Dalich Ph.D.  Abstract
USING PRODUCTION DEFECT DATA TO IMPROVE AN SMT ASSEMBLY PROCESS Glen Leinbach  Abstract
INTEGRATED PROFILING FOR THE REFLOW PROCESS Greg Jones  Abstract
THE STATE OF COMPONENT LOCATING AND HANDLING FOR ODD-FORM ASSEMBLY Gregory W. Holcomb  Abstract
BOARD LEVEL RELIABILITY OF LEAD FREE SOLDERED INTERCONNECTIONS H.-J. Albrecht  Abstract
CSP BOARD LEVEL RELIABILITY, RESULTS H.-J. Albrecht  Abstract
IMPACT OF IMPROPER SELECTION AND THE MISUSE OF INSPECTION MACHINES ON MEASUREMENT DATA Harjinder Ladhar  Abstract
MICROSTRUCTURAL ANALYSIS OF ORGANIC LAMINATE SUBSTRATES J. Stephen Tsai  Abstract
FLIP CHIPS AND ACOUSTIC MICRO IMAGING: AN OVERVIEW OF PAST APPLICATIONS, PRESENT STATUS, AND ROADMAP FOR THE FUTURE Janet E. Semmens  Abstract
DRIVING CONTINUOUS PROCESS IMPROVEMENT: A SECOND LOOK AT THE WAVE-SOLDER PROCESS Jeff Kennedy  Abstract
FEA RELIABILITY ASSESSMENT METHODOLOGY INVESTIGATION TO IMPROVE PREDICTION ACCURACY Jeff Riebling, Mark Brillhart  Abstract
STENCIL DESIGN IMPROVEMENT FOR BUMPING WAFERS BY PRINTING SOLDER PASTE Jeffrey D. Schake  Abstract
ULTRA-THIN FLIP CHIP ON BOARD ASSEMBLY Jie Zhang  Abstract
IMPLEMENTING SOLID SOLDER DEPOSITS IN A MANUFACTURING ENVIRONMENT Joanne DeBlis  Abstract
SMT PROCESS CONTROL STRATEGIES USING AXI (AUTOMATED X-RAY INSPECTION) John P. Garvin  Abstract
0201” PROCESS CONSIDERATIONS FOR REDUCED DEFECTS Jon Medernach  Abstract
THE RELIABILITY ASSESSMENT OF WAFER-LEVEL CSP (Omega-CSP) Jong-Heon Kim  Abstract
DEVELOPMENTS IN ODD-FORM ASSEMBLY Joseph Morris  Abstract
THE TERNARY EUTECTIC OF Sn-Ag-Cu SOLDER ALLOYS K.-W. Moon  Abstract
THE IMPACT OF AUTOMATED OPTICAL INSPECTION Kevin A. Towle  Abstract
CAUTION! INTERNATIONAL SPEED BUMP AHEAD Kirk Douglass  Abstract
ELECTROLESS Ni-P/Pd/Au PLATING FOR SEMICONDUCTOR PACKAGE SUBSTRATE Kiyoshi Hasegawa  Abstract
CSPs FOR PORTABLE ELECTRONICS Kobi Spector  Abstract
UNDERFILL CHARACTERIZATION FOR FLIP CHIP BGA FEATURING USE OF A RIGID SUBSTRATE Kunio Sakamoto  Abstract
DEVELOPMENT OF A RELIABLE STACK PACKAGE: D2BLP (DOUBLE DENSITY BOTTOM LEADED PACKAGE) Kwang-Seong Choi  Abstract
AN EXTREMELY - THIN PROFILE, BALL GRID ARRAY STYLE CHIP SCALE PACKAGE Lee Smith  Abstract
WIRE BONDING AND RELIABILITY OF MULTI-LAYER COPPER INTERCONNECT STRUCTURES Lei Mercado  Abstract
ELIMINATING SMT BOTTLENECKS Leo van de Vall  Abstract
ENCAPSULATION PROCESSES FOR ADVANCED SEMICONDUCTOR APPLICATIONS Lisa Marie Ryan  Abstract
AIRBORNE RADAR EVALUATION OF PRINTED CIRCUIT CONDUCTIVE FILAMENT GROWTH Lon E. Chase  Abstract
COMPARISON OF AG, NI/AU, AND SOLDER PWB SURFACE FINISHES ON THE SECOND LEVEL RELIABILITY OF FINE PITCH AREA ARRAY ASSEMBLIES Lon E. Chase  Abstract
TEST AND INSPECTION: TOOLS TO IMPROVE PROCESS CONTROL Lynn Leone  Abstract
QUALITY COST MODELS AND THE METHOD “STATISTICAL PROCESS CONTROL” M. Oppermann  Abstract
DESIGN AND PROCESS EFFECTS ON THE RELIABILITY OF 1.0 MM PITCH CBGA Marie Cole  Abstract
2000 STATUS OF BGA / CSP STANDARDIZATION Mark Bird  Abstract
VECTORAL IMAGING … THE NEW DIRECTION IN AUTOMATED OPTICAL INSPECTION Mark J. Norris  Abstract
THE EVERCHANGING EMS BUSINESS MODEL Mark Lyell  Abstract
SOLDERING PROCESS USING LIGHT BEAM TECHNOLOGY Masaharu Takagi, Toshikazu Yamaji, Steve Bellavia  Abstract
CHALLENGES AND SOLUTIONS IN REWORK PROCESS FOR CERAMIC COLUMN GRID ARRAY PACKAGES Mei Wang, Alington Lewis, Sammy Yi  Abstract
3D VISION TECHNOLOGY APPLICATIONS FOR COMPONENT PLACEMENT Michael Cieslinski  Abstract
EVALUATION OF GAS CHEMISTRY EFFECTS ON WIRE BOND INTEGRITY AND PACKAGE INTERFACIAL ADHESION IN THE BGA PACKAGE Michael Leoni  Abstract
E-COMMERCE: NEW BUSINESS MODELS FOR ELECTRONICS MANUFACTURING AND SUPPLY CHAIN MANAGEMENT Michael S. Chester  Abstract
FAILURE ANALYSIS AND CLOSED-LOOP CORRECTIVE ACTION FOR PROCESS IMPROVEMENTS Michael Snider  Abstract
TWO-SCALE MODEL-BASED SIMULATION OF A SOLDER ALLOY Michael W. Woodmansee  Abstract
SPC FOR SMT – DETERMINATION AND IMPLEMENTATION OF PROCESS CONTROLS AND DATA COLLECTION IN ELECTRONICS ASSEMBLY Mike McMonagle  Abstract
AIRCRAFT FLIGHT TESTS AND RELIABILITY IMPROVEMENTS OF MEMS PRESSURE SENSOR ASSEMBLY N.P. Kim  Abstract
INVESTIGATION OF REPAIRABLE UNDERFILL MATERIALS FOR RELIABILITY ENHANCEMENTS Nael Hannan and Puligandla Viswanadham  Abstract
NOVEL LOCALIZABLE HDI-PCB SOLUTION Naoto Minari  Abstract
BALL MEMS TECHNOLOGY Nobuo Takeda  Abstract
THE ROLE OF QUALITY AND TEST MODELING IN THE MANUFACTURE OF COMPLEX ELECTRONIC ASSEMBLIES Paul A. Thistle  Abstract
THE BENEFITS OF TURNOVER AND WHAT YOU SHOULD DO TO PREVENT IT Paul E. Slobodian, Ed. D.  Abstract
LASER REWORK TECHNOLOGY ENERGY SOURCE PERFORMANCE AND PROCESS SPECIFIC CSP RELIABILITY STUDIES Paul E. Wang Ph.D,  Abstract
REAL-TIME FACTORY DATA COLLECTION AND WEB REPORTING Paul Limon and Craig Kirby  Abstract
FLIP CHIP ASSEMBLY WITH REFLOW ENCAPSULANTS Pericles A. Kondos, Ph.D.  Abstract
DEVELOPMENT OF HIGH DENSITY THIN FILM SUBSTRATES Preeti Pande, Bob Werner and Rao Mahidhara  Abstract
HIGH SPEED STENCIL PRINTING OF SOLDER PASTE A DOE FULL FACTORIAL EXPERIMENT Prof. S. Manian Ramkumar & Jason Lemery  Abstract
CERAMIC GRID ARRAY TECHNOLOGIES FOR ACPI APPLICATIONS Raj. N. Master and O. T. Ong  Abstract
THE WORLDWIDE OEM ELECTRONICS ASSEMBLY MARKET, 1999 Randall Sherman  Abstract
IMPACT OF PRINT PARAMETERS AND CSP PITCH AND I/O ON PASTE QUALITY AND VOLUME Reza Ghaffarian  Abstract
COMPARISON OF IC AND MEMS PACKAGING RELIABILITY APPROACHES Reza Ghaffarian, Ph.D.  Abstract
THERMAL CYCLING TEST RESULTS OF CSP AND RF PACKAGE ASSEMBLIES Reza Ghaffarian, Ph.D.  Abstract
X-RAY SOLDER SLICING USING TRANSMISSION X-RAY SYSTEMS AND STANDALONE SOFTWARE Richard B.Knight, Jr.  Abstract
CONTRACT MANUFACTURERS AND MEMS PRODUCT COMMERCIALIZATION Richard D. Olmsted, Ph.D.  Abstract
A PERSPECTIVE ON FLIP CHIP TECHNOLOGIES IN AUTOMOTIVE ELECTRONICS Richard D. Parker  Abstract
RELIABILITY OF AREA ARRAY SOLDER JOINTS IN BENDING Robert Darveaux  Abstract
EVAUATION OF IMMERSION SILVER FINISH FOR AUTOMOTIVE ELECTRONICS Robert Gordon  Abstract
eDFM – WEB BASED DESIGN FOR MANUFACTURABILITY Robert Rowland and Scott Buttars  Abstract
SMALL PROCESS IMPROVEMENTS EQUAL LARGE PROFITS Ronald C. Lasky, Ph.D., PE  Abstract
PREDICTION OF PCB THICKNESS FOR SELECTION OF A SUITABLE PCB MANUFACTURING TECHNOLOGY S. Pochareddy  Abstract
SNAP ARRAY CSP™ THE DEVELOPMENT OF SUPER THIN CSP WITH 0.5 mm TOTAL HEIGHT AND 3D STACKED CSP Seigo Matsuzono and Shoji Uegaki  Abstract
FLUXES FOR LEAD-FREE SOLDERS CONTAINING ZINC Semyon Vaynman, Morris E. Fine  Abstract
FLUORINATED SOLDERING TECHNOLOGY Stephen M. Bobbio  Abstract
CSP AND MICRO-BGA PROCESS AND DAMAGE ASSESSMENT WITH ACOUSTIC MICRO IMAGING (AMI) Steven R. Martell and J.E. Semmens  Abstract
YEAR 1999 DEFECT LEVEL AND FAULT SPECTRUM STUDY Stig Oresjo  Abstract
BOARD LEVEL RELIABILITY OF LEAD-FREE PACKAGES Swaminath Prasad  Abstract
PACKAGING THE MICRO-MACHINE T. P. Glenn  Abstract
SOLDER/SUBSTRATE INTERACTIONS BETWEEN LEAD-FREE SOLDERS AND CuNi ALLOYS T.M. Korhonen  Abstract
RELIABILITY OF LEAD FREE SOLDER JOINTS ON MANUFACTURING CONDITIONS Th. Herzog , K.-J. Wolter, Th. Zerna  Abstract
ATTACHMENT RELIABILITY OF CHIP SCALE PACKAGES WITH VARIOUS CONSTRUCTIONS Theo I. Ejim  Abstract
CHIP SCALE PACKAGE SOLDER ATTACH RELIABILITY OPTIMIZATION Thomas F. Long  Abstract
MOLDED UNDERFILL FOR FLIP CHIP IN PACKAGE Tim Chen  Abstract
“PRODUCING” THE DESIGN: DESIGNING ELECTRONIC PRODUCTS IN THE YEAR 2000 AND BEYOND Tom Borkes  Abstract
EFFECT OF THERMAL CYCLING RAMP RATES ON SOLDER JOINT FATIGUE LIFE V. S. Sastry, J. C. Manock, and T. I. Ejim  Abstract
RELIABLE AND LOW COST WAFER LEVEL PACKAGING Implementing the Wide Area Vertical Expansion (WAVE) Process Vern Solberg, David Light and Joseph Fjelstad  Abstract
A LOW COST, LOW I/O WAFER LEVEL CSP FOR ESD PROTECTION Vrej Barkhordarian Ph.D.  Abstract
STENCIL DESIGN GUIDELINES William E. Coleman  Abstract
FATIGUE DAMAGE ACCUMULATION IN 63Sn-37Pb SOLDER ALLOY Y. Wei and C. L. Chow  Abstract
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