Pan Pacific Symposium 2005 Proceedings

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TITLE AUTHOR
DESIGN TECHNIQUES FOR DEVELOPING INTEGRATED ANTENNAS FOR WIRELESS SENSORS A. Gandelli, M. Mussetta, P. Pirinoli, and R. Zich  Abstract
NANOTECHNOLOGY AND LOW TEMPERATURE ELECTRONICS ASSEMBLY Alan Rae  Abstract
PARIDIGM SHIFT IN APPLYING UNDERFILL Alec J. Babiarz  Abstract
GENERAL APPROACH IN REDUCING EMI FOR 3D MICROELECTRONICS SENSORS Alessandro Gandelli et al.  Abstract
FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TEST Anurag Bansal, Sam Yoon, and Vadali Mahadev  Abstract
ASSEMBLY CONCERNS FOR TEST IN STRIP Bob Fenton  Abstract
OPTIMIZED FINAL MANUFACTURING FOR WAFER LEVEL PACKAGING Bob Fenton  Abstract
SELECTIVE SOLDER PASTE DEPOSITION RELIABILITY TEST RESULTS Bob Wettermann  Abstract
IMPROVEMENT OF THE ACCURACY OF HIGH SPEED MILLING ON SO-DIMM DEPANEL PROCESS OF PCA C.Y. Ho et al.  Abstract
ORIGINAL DESIGN MANUFACTURERS VIABLE ALTERNATIVE/DISTINCT BUSINESS PRACTICES Charlie Barnhart  Abstract
3D CHIP STACK WITH WAFER THROUGH HOLE TECHNOLOGY Chien-Wei Chien et al.  Abstract
MULTI-OBJECTIVE OPTIMIZATION IN MCM PLACEMENT Ching-Mai Ko, Yu-Jung Huang, and Shen-Li Fu  Abstract
BENEFITS AND CHALLENGES OF SYSTEM LEVEL INTEGRATION & MINIATURIZATION Craig S. Mitchell  Abstract
IMPLEMENTATION OF A LEAD FREE WAVE SOLDERING PROCESS: AN IN-DEPTH LOOK AT THE CRITICAL ISSUES Denis Barbini  Abstract
NEXT GENERATION INTERCONNECT TECHNOLOGIES FOR CHIP ON FLEXIBLE SUBSTRATES Dominique Numakura and Robert Turunen  Abstract
SUPPLY CHAIN IMPACT OF LEAD-FREE SOLDERING Dongkai Shangguan, Ph.D.  Abstract
ELECTRONICS PACKAGING & BOARD ASSEMBLY: TECHNOLOGY TREND AND IMPACT ON THE SUPPLY CHAIN Dongkai Shangguan, Ph.D.  Abstract
EFFECTS OF STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF IMMERSION SILVER BOARD FINISHES WITH PB-BASED AND PB-FREE SOLDERS Edwin Lopez et al.  Abstract
"SEE NO DEFECT, SPEAK NO DEFECT, HEAR NO DEFECT" A PRODUCT QUALITY DEVELOPMENT PROGRAM BASED ON RANDOM DPA Eric Fremd  Abstract
LEAD-FREE SOLDER INSPECTION WITH X-RAY Friedhelm W. Maur  Abstract
A NOVEL LOW-COST, HIGH-PERFORMANCE THERMALLY AND ELECTRICALLY CONDUCTIVE ADHESIVE Fritz Byle and Jin Liu  Abstract
3-D DESIGN AND DATA COLLABORATION OF NEW TECHNOLOGY SIP Gordon Jensen and Masayuki Kayama  Abstract
PROCESS MATERIAL RELATED ADVANCED ASSEMBLY EQUIPMENT CRITERIA Guenter Schiebel  Abstract
UNDERFILL TECHNOLOGY FOR THE ENCAPSULATION OF LARGE, DENSELY POPULATED DIE WITH SMALL GAP FOR ADVANCED FLIP CHIP PACKAGING Guoyun Tian et al.  Abstract
LEAD-FREE PRODUCT AND PROCESS CONVERSION PHASE III - REFLOW PROCESS OPTIMIZATION* Hana Hsu et al.  Abstract
40GBS HIGH I/O PIN COUNT SURFACE MOUNTABLE CERAMIC PACKAGE Hui Wu et al.  Abstract
PLASMA TREATMENT FOR UNDERFILL PROCESS IN FLIP CHIP PACKAGING James D. Getty and Jack Zhao  Abstract
EVALUATION OF STACKED DIE PACKAGES USING ACOUSTIC MICRO IMAGING Janet E. Semmens  Abstract
IMBEDDED COMPONENT / DIE TECHNOLOGY: TECHNOLOGY REASSESSMENT & UPDATE Jason B. Gjesvold  Abstract
THE SNAGCU SOLDER JOINT INTEGRITY OF GREEN WLCSP IN LEAD FREE SMT Jeffrey C.B. Lee et al.  Abstract
REPORT ON FIELD TESTS OF A DEVELOPMENTAL FABRIC TECHNOLOGY FOR CLEANING FINE-PITCH STENCILS Kimberly F. Abbett, Ph.D. et al.  Abstract
THERMAL RC - NETWORKS FOR ACCURATE MODELING OF SYSTEM-IN-PACKAGE Kimmo Kaija and Eero Ristolainen  Abstract
ELECTROLESS NICKEL / IMMERSION GOLD PROCESS TECHNOLOGY FOR IMPROVED DUCTILITY OF FLEX AND RIGID-FLEX APPLICATIONS Kuldip Johal and Hugh Roberts et al.  Abstract
A STUDY ON RELIABILITY OF FLIP-CHIP SOLDER JOINTS USING PB-FREE SOLDERS AND ELECTROLESS Ni-P UBMS Kyung-Wook Paik et al.  Abstract
INFLUENCE OF DIELECTRIC MATERIALS AND VIA GEOMETRY ON THE THERMOMECHANICAL BEHAVIOR OF SILICON THROUGH INTERCONNECTS Mario Gonzalez et al.  Abstract
STENCIL PRINTING WITH LEAD-FREE SOLDER PASTE Mark J. Curtin  Abstract
ALIGNED WAFER BONDING FOR 3D INTERCONNECT TECHNOLOGIES Matthias Thorsten et al.  Abstract
A NOVEL ADHESIVE FOR IC PACKAGING Michael Kropp, PhD. and Andrew Behr  Abstract
SN-ZN LEAD-FREE SOLDERING TECHNOLOGIES FOR PERSONAL COMPUTERS Motoji Suzuki et al.  Abstract
CONSIDERATIONS FOR HEAT SPREADER ATTACH OPTIMIZATION ON HIGH PERFORMANCE FLIP CHIP BGA PACKAGES Mukul Joshi, Kumar Nagarajan, and Nael Zohni  Abstract
OVERVIEW OF ANISOTROPIC CONDUCTIVE ADHESIVES FOR FLAT PANEL DISPLAYS AND SEMICONDUCTOR PACKAGING APPLICATIONS Myung Jin Yim and Kyung-Wook Paik  Abstract
EFFECT OF BAKING TIME AND TEMPERATURE ON LEAD FREE SECOND LEVEL INTERCONNECT SOLDER JOINT MICROSTRUCTURES, MICROHARDNESS AND IMC MORPHOLOGY Norman J. Armendariz and Vasu Vasudevan  Abstract
RELIABILITY ANALYSIS OF SOME CERAMIC LEAD-FREE SOLDER ATTACHMENTS Olli Salmela et al.  Abstract
RESIDUAL STRESS CORRELATION TO ATC RELIABILITY SCALE IN THE µPGA-SOLDER JOINT-PCB PAD SYSTEM* Paul P.E. Wang, Ph.D. et al.  Abstract
MANUFACTURING OPTIMIZATION AND RELIABILITY OF LARGE SOLDERED DAUGHTER MODULES FOR HIGH PERFORMANCE COMMUNICATION APPLICATIONS R. Scott Priore, S. Camerlo, and M. Brillhart  Abstract
THERMAL MANAGEMENT OF HEAT-SENSITIVE COMPONENTS IN THE REFLOW AND REWORK PROCESSES Rahul Raut et al.  Abstract
HIGH PERFORMANCE, HIGH POWER, HIGH I/O CHIPS FIRST BUILD-UP TECHNOLOGY Ray Fillion / Charles E. Bauer, Ph.D.  Abstract
REALIZING LOW COST AND HIGH RELIABILITY IN CSP PACKAGES WITH SURFACE TREATMENT AND MATERIAL TECHNOLOGY Ryota Furukawa  Abstract
CONTINUED EVALUATION OF THE EFFECTS OF PROCESSING CONDITIONS AND AGING TREATMENTS ON PB-FREE SHEAR STRENGTH AND MICROSTRUCTURE S. Bukhari, D. Santos, L. Lehman, and E. Cotts  Abstract
ANALYSIS OF TESTING RESULTS OF SURFACE MOUNTED LEAD FREE SOLDERING MATERIALS AND PROCESSES Sammy Shina et al.  Abstract
MATERIAL DESIGN FOR THE NEXT GENERATION LOW-K/CU FLIP-CHIP PACKAGES Sarathy Rajagopalan and Kishor Desai et al.  Abstract
THE STATUS OF PACKAGING INDUSTRY IN TAIWAN Shen-Li Fu, Ph.D. et al.  Abstract
DIE ATTACH PROCESSES FOR HIGH RELIABILITY CHIP-ON-BOARD (COB) MANUFACTURING Steve Sytsma & Dan Lynch  Abstract
SHORT RANGE RADIO FREQUENCY ISSUES FOR SENSORS INSTALLED IN A HOME ENVIRONMENT T. Dishongh, Ph.D., B. Needham, and K. Rhodes  Abstract
DEVELOPMENT OF LOW DIELECTRIC CONSTANT AND LOW DIELECTRIC LOSS TANGENT FILM USED IN A HIGH FREQUENCY RANGE Taku Fujino  Abstract
SMT DEVELOPMENT AND INDUSTRY TRAINING Tanxi Wang and Yuming Wang  Abstract
RF & MICROPROCESSOR CIRCUITS FOR MEMS SENSOR PACKAGING Thomas Jorgensen et al.  Abstract
CLEANING IMPLICATIONS OF LEAD-FREE ASSEMBLY AND PACKAGING Thomas M. Forsythe  Abstract
HIGH-K INSULATION MATERIAL FOR EMBEDDED CAPACITOR Toshihisa Nonaka  Abstract
SEMICONDUCTOR PACKAGING TECHNOLOGY DEVELOPMENT TRENDS IN CHINA Wei Koh, Ph.D. and Sarah Shen et al.  Abstract
ASSEMBLY OF A SERIAL LINK TEST VEHICLE USING FLIP-CHIP, SMT, AND BGA ATTACH PROCESSES: A CASE STUDY Wendy Wilkins, Barry Gilbert, and Erik Daniel  Abstract
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