SMTA International 2004 Proceedings

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TITLE AUTHOR
EFFECT OF LEAD-FREE SOLDER COMPOSITION ON VOIDING AT MICROVIA A. Dasgupta, Ph.D., B. Huang, Ph.D., Dr. N.-C. Lee  Abstract
BOARD LEVEL RELIABILITY OF QFP AND QFN TYPE PACKAGES WITH MATTE SN LEAD FINISH Ahmer Syed et al.  Abstract
HOT AIR LEAD-FREE REWORK OF BGA PACKAGES & SOCKETS Alan Donaldson and Raiyo Aspandiar  Abstract
THE ROLE OF TEMPERATURE EXTREMES IN THERMAL SHOCK ON FAILURE RATES FOR FLIP CHIPS ASSEMBLED WITH FILLED NO-FLOW UNDERFILLS Ananth Prabhakumar et al.  Abstract
COMPARISON OF BUMP AND SUBSTRATE TECHNOLOGIES FORFLIP CHIP BGA Andrew Mawer, Diane Hodges Popps, Tom Koschmieder  Abstract
INSPECTION OF LEAD-FREE SOLDER JOINTS ON PRINTED CIRCUIT ASSEMBLIES USING AUTOMATED INSPECTION TECHNIQUES Andrew Pollock  Abstract
EFFECT OF ASSEMBLY PROCESS CONDITIONS ON SYSTEM-LEVEL PERFORMANCE OF THERMAL INTERFACE MATERIALS Arun Gowda et al.  Abstract
MECHANICAL AND THERMAL CHARACTERIZATION OF LEAD FREE SOLDER Arv Sinha and Joe Kuczynski  Abstract
PROCESSING HEAT-SENSITIVE COMPONENTS IN LEAD-FREE AND OTHER CONDITIONS B. Lewis, P. Chouta, A. Singer et al.  Abstract
POTENTIAL FOR WHISKER FORMATION IN LEAD-FREE ELECTROPLATED CONNECTOR FINISHES B. Rickett and P. Elmgren et al.  Abstract
PLASTIC BALL GRID ARRAY PACKAGE WARPAGE AND IMPACT ON TRADITIONAL MSL CLASSIFICATION FOR PB-FREE ASSEMBLY B.T. Vaccaro et al.  Abstract
EFFECT OF LEAD-FREE ALLOY COMPOSITION ON TOMBSTONING Benlih Huang, Ph.D. and Ning-Cheng Lee, Ph.D.  Abstract
THE SUPPLY CHAIN ENGINEERING SOLUTION Bill Coker  Abstract
ACTIVE COMPONENT COOLING DURING PROCESSING Brian Lewis, Prashant Chouta, and Adam Singer  Abstract
FLIP-CHIP UNDERFILL AND FLUX RESIDUE INTERACTION IN A Pb-FREE PROCESS Brian Toleno, Ph.D. et al.  Abstract
A NEW MODEL FOR OUTSOURCING COMPLEX ASSEMBLIES Bruce W. Hueners  Abstract
EFFECT OF SOLDER PASTE VOLUME ON THERMOMECHANICAL RELIABILTY Chris Achong and Dennis Krizman  Abstract
OPTIMIZING STENCIL DESIGN FOR LEAD-FREE SMT PROCESSING Chrys Shea and Ranjit S Pandher  Abstract
HYBRID RF MEMS CIRCUIT PACKAGING Daniel J. Hyman, Ph.D.  Abstract
THE INTERACTION OF PWB SURFACE FINISHES AND 0201 COMPONENTS Dave Hillman and Jennifer Waskow  Abstract
IMPACT OF UNDERFILL AND SOLDER JOINT ALLOY SELECTION ON FLIP CHIP SOLDER JOINT RELIABILITY Dave Hillman and Ross Wilcoxon  Abstract
DOES PCB PAD FINISH AFFECT VOIDING LEVELS IN LEAD-FREE ASSEMBLIES? David Bernard and Keith Bryant  Abstract
USE OF DIGITAL X-RAY IMAGING AS A PROCESS CONTROL TOOL FOR LEAD-FREE PWB ASSEMBLY David Bernard et al.  Abstract
X-RAY INSPECTION OF AREA ARRAY PACKAGES USING TIN-LEAD AND LEAD-FREE SOLDERS David Geiger, Todd Castello, Dr. Dongkai Shangguan  Abstract
EFFECTS OF SUBSTRATE DESIGN ON UNDERFILL VOIDING FOR FLIP CHIP PROCESSING USING NO-FLOW UNDERFILL MATERIALS David Milner, Chetan Paydenkar, Dr. Daniel Baldwin  Abstract
SELECTIVE SOLDER PLATFORM JUSTIFICATION David Philips and Jeff Pekas  Abstract
0201 ASSEMBLY & MATERIALS CONSIDERATIONS David Suraski  Abstract
CONTROLLING COPPER BUILD UP IN AUTOMATIC SOLDERING EQUIPMENT USING LEAD-FREE SOLDER David Suraski and Karl Seelig  Abstract
ASSESSING THE MANUFACTURABILITY & RELIABILITY OF FINE PITCH ARRAY PACKAGES: AN IN-DEPTH STUDY Dennis Krizman, Chris Achong, Scott Waters  Abstract
THE EFFECTS OF IMMERSION SILVER CIRCUIT BOARD SURFACE FINISH ON ELECTROCHEMICAL MIGRATION Donald P. Cullen  Abstract
A HOLISTIC APPROACH TO LEAD-FREE TRANSITION AND ENVIRONMENTAL COMPLIANCE Dongkai Shangguan, Ph.D.  Abstract
EFFICIENT LINE CHANGEOVER: THE KEY TO LEAN MANUFACTURING Douglas Farlow  Abstract
WHY CLEAN A NO-CLEAN? Douglas Watson  Abstract
THE NORTH AMERICAN ELECTRONICS MARKET: THE CURRENT OUTLOOK AND POSITIONING FOR THE FUTURE Eric Miscoll  Abstract
EFFECT OF THE REFLOW PROFILE ON BGA VOIDING IN A LEAD-FREE PROCESS Felix Bruno and Frank Grano et al.  Abstract
MATERIAL CONTROL FOR LEAD-FREE MANUFACTURING François Monette  Abstract
INTRUSIVE REFLOW USING A LEAD-FREE PROCESS Frank Grano and Felix Bruno  Abstract
PCB DESIGN AND ASSEMBLY PROCESS STUDY OF 01005 SIZE PASSIVE COMPONENTS USING LEAD-FREE SOLDER Fredrik Mattsson et al.  Abstract
SELECTIVE SOLDERING - AN OVERVIEW OF THE PROCESS, THE EQUIPMENT AND THE ASSOCIATED BOARD DESIGN REQUIREMENTS Gary Dick  Abstract
A HISTORY OF TIN WHISKER THEORY: 1946 TO 2004 George T. Galyon  Abstract
BOARD DESIGN AND PROCESS OPTIMIZATION FOR PASTE-INHOLE USING LEAD-FREE SOLDER Gerhard Pfennich and Harald Fockenberger et al.  Abstract
PERFORMANCE MODELING OF A VME RIGID/FLEX ASSEMBLY Greg Bartlett and Robert Larmouth et al.  Abstract
SAC AND SnPb SOLDER JOINT THERMAL STRESS AND STRAIN CHARACTERIZATION FOR RESISTOR PACKAGES Guihua Shi, Ming Zhou and Hua Lu  Abstract
INTERFACE DESCRIPTION AND FAILURE MECHANISM OF SNAGCU SOLDERS IN BGA PACKAGES H.-J. Albrecht  Abstract
EVALUATING THE MANUFACTURABILITY AND RELIABILITY OF NEW CONNECTOR DESIGNS Heather McCormick, George Riccitelli, Jullie Tran  Abstract
3D X-RAY TESTS AND ANALYSES OF LEAD-FREE PBGA (PLASTIC BALL GRID ARRAY) PACKAGE SOLDER JOINTS J. Lau et al.  Abstract
TIN WHISKER MITIGATION: APPLICATION OF POST MOLD NICKEL UNDERPLATE ON COPPER BASED LEAD FRAMES AND EFFECTS OF BOARD ASSEMBLY REFLOW J. W. Osenbach et al.  Abstract
A CHARACTERIZATION OF COMPONENT RELIABILITY ON METALBACKED SUBSTRATES FOR USE IN HARSH AUTOMOTIVE ENVIRONMENTS James R. Thompson et al.  Abstract
LEAD-FREE AND TIN-LEAD REWORK DEVELOPMENT ACTIVITIES WITHIN THE NEMI LEAD-FREE ASSEMBLY AND REWORK PROJECT Jasbir Bath et al.  Abstract
IMBEDDED COMPONENT / DIE TECHNOLOGY: A HIGH RELIABILITY PACKAGING SOLUTION Jason B. Gjesvold  Abstract
SHOP FLOOR INFORMATION SYSTEMS EMERGING AS COMMERCIAL, OFF-THE-SHELF TECHNOLOGY Jason Spera  Abstract
AN OBSTACLE-CONTROLLED CREEP MODEL FOR SN-PB AND SN-BASED LEAD-FREE SOLDERS Jean-Paul Clech  Abstract
AOI PROCESS IMPROVEMENT Jeff Danner  Abstract
DEFENSE & AEROSPACE ELECTRONICS MANUFACTURING OUTSOURCING - REALITIES & TRENDS Jeff Kaylor  Abstract
STENCIL PRINTING SOLDER PASTE AND TRANSFER EFFICIENCY - ESTABLISHING THE BASELINE Jeffrey D. Schake / Mark A. Whitmore  Abstract
UV LASER-BASED MEMS AND MOEMS MICROMACHINING Jeffrey P. Sercel  Abstract
A COMPONENT LEVEL PREDICTIVE RELIABILITY MODELING METHODOLOGY Jennifer V. Muncy and Daniel F. Baldwin  Abstract
LEAN CULTURE STRATEGY DRIVES COST SAVINGS FOR EMS PROVIDERS Jim Lanigan  Abstract
REWORK EQUIPMENT: LASER VERSUS HOT GAS COMPARISON John Davis, Charlie Fieselman, Kris Slesinger  Abstract
UPDATE OF GLOBAL TRENDS IN LEAD-FREE SOLDERING John Lau and Katrina Liu (Beijing Normal Univers.)  Abstract
VOLUME CT (COMPUTED TOMOGRAPHY) OFFERS 3D INFORMATION ON DEFECTS IN MANUFACTURING Jon Dupree  Abstract
ASSEMBLY PROCESS AND PACKAGE DESIGN FOR HIGH PERFORMANCE FLIP CHIP Jon G. Aday, Danny T. Brady, David McCann  Abstract
INFORMATION SYSTEM DESIGN PROCESSES FOR ELECTRONICS MANUFACTURING SYSTEMS Joseph C. Su et al.  Abstract
LEADFRAME BASED NEAR CHIPSCALE PACKAGE WITH HIGHER NUMBER OF INPUT-OUTPUT TERMINALS K. Ramakrishna  Abstract
CHARACTERIZATION AND RELIABILITY PERFORMANCE OF AN ADVANCED UNDERFILL ENCAPSULANT FOR LEAD-FREE FLIP CHIP INTERCONNECTION Kalyan Ghosh et al.  Abstract
INTEGRATION OF QFD AND DOE METHODOLOGIES FOR NEW PRODUCT INTRODUCTION IN THE ELECTRONICS MANUFACTURING ARENA Kaustubh Nagarkar and K. Srihari, Ph.D.  Abstract
CONFORMAL COAT IMPACT ON AREA ARRAY PACKAGE SOLDER JOINT RELIABILITY Keith Kirchner and David Nelson  Abstract
THE EFFECTS OF PLATING MATERIALS, BOND PAD SIZE AND BOND PAD GEOMETRY ON SOLDER BALL SHEAR STRENGTH Keith Rogers and Craig Hillman  Abstract
THE TIME IS RIGHT FOR INJECTION-MOLDED PACKAGES Ken Gilleo, Ph.D. et al.  Abstract
MICROSCOPIC MODEL OF ELECTRONICS ASSEMBLY PROCESS USING NEXT EVENT SIMULATION Ketan Shah and Kenneth Ebeling  Abstract
ELECTROLESS NICKEL / ELECTROLESS PALLADIUM / IMMERSION GOLD PROCESS FOR MULTI-PURPOSE ASSEMBLY TECHNOLOGY Kuldip Johal and Hugh Roberts et al.  Abstract
DEVELOPMENT OF 3D-REDISTRIBUTION AND BALLING TECHNOLOGIES FOR FABRICATION OF VERTICAL POWER DEVICES Lars Boettcher et al.  Abstract
CONDUCTIVE ANODIC FILAMENT FORMATION - EFFECT OF FEATURE SIZES ON PRODUCT RELIABILITY Lavanya Gopalakrishnan, Mason Hu, Mark Brillhart  Abstract
JOINING TECHNOLOGY WITH LOW MELTING SOLDERS AND HEAT RESISTANT ADHESIVES M. Nowottnick, W. Scheel, K. Wittke, U. Pape  Abstract
USAGE & INTERPRETATION OF RELIABILITY PREDICTIONS Manthos Economou  Abstract
FOUR STAGES OF AOI IMPLEMENTATION! Mark J. Norris  Abstract
LEAD CONTAMINATION RISKS IN LEAD FREE SOLDER JOINTS FOR HIGH TEMPERATURE APPLICATIONS Mark Privett et al.  Abstract
AUTOMATIC OPTICAL INSPECTION OF CIRCUIT ASSEMBLIES IN A HIGH MIX/LOW VOLUME ENVIRONMENT Matthew T. Holzmann  Abstract
LEAD-FREE SOLDER PASTE EVALUATION Michael Havener / Robert Farrell  Abstract
PROCESS WINDOW STUDY DETERMINING THE DEFECT-FREE PROCESSING WINDOW FOR SMALL SURFACE MOUNT COMPONENTS USING A RESPONSE SURFACE DESIGN OF EXPERIMENT Michael Johnston  Abstract
LOW COST AIR CAVITY LCP (LIQUID CRYSTAL POLYMER) PACKAGING Mike Zimmerman  Abstract
THE IMPACT OF THERMAL CYCLE REGIME ON THE SHEAR STRENGTH OF LEAD-FREE SOLDER JOINTS Milos Dusek, Martin Wickham and Christopher Hunt  Abstract
BGA WARPAGE AND ASSEMBLY CHALLENGES Mradul Mehrotra et al.  Abstract
WHITE RESIDUE FORMATION ON PRINTED CIRCUIT BOARD ASSEMBLIES Mulugeta Abtew et al.  Abstract
SUB 100 nm SILICON - THE IMPACT ON NEXT GENERATION IC PACKAGING Nick Pearne  Abstract
METHODOLOGY FOR PROGNOSTICATION OF ELECTRONICS AND MEMS PACKAGING P. Lall, N. Islam, K. Rahim, J. Suhling  Abstract
DEFECT TRACKING AND YIELD ENHANCEMENTS THROUGH IMPROVED DATA COLLECTION SYSTEMS IN AN ELECTRONICS MANUFACTURING ENVIRONMENT P. Sathyanarayanan et al.  Abstract
A COMPARISON OF EPOXY AND CYANATE ESTER UNDERFILLS FOR FCOB ASSEMBLY Paul Morganelli, Ph.D.  Abstract
LEAD-FREE PROCESS AND PRODUCT TRANSITION * Phase II. Paste Characteristic Study by Response Assessment and Printing Optimization by Taguchi Method Paul P.E. Wang, Ph.D. et al.  Abstract
AN INVESTIGATION INTO LEAD-FREE BGA REWORK WITH CONSIDERATION TO PROFILE REQUIREMENTS OF IPC/JEDEC J-STD-020B Peter Verbiest  Abstract
0.8 MM BGA SOLDER JOINT RELIABILITY UNDER FLEXURAL LOAD Phil Geng et al.  Abstract
MODELS FOR SOLDER-JOINT RELIABILITY OF COMPONENTS ON METAL-BACKED PRINTED CIRCUIT BOARDS Pradeep Lall et al.  Abstract
SHOCK-INDUCED FAILURE PREDICTION MODEL FOR FINE-PITCH BGAs AND CSPs Pradeep Lall et al.  Abstract
SURFACE MOUNT CHALLENGES WITH LEAD-FREE REFLOW Prawin Paulraj and Norman J Armendariz  Abstract
ACCELERATED TESTING OF FLIP CHIP UNDERFILLS AND THE EFFECT OF MOISTURE AND TEMPERATURE ON THE AGING OF UNDERFILLS R. Chaware et al.  Abstract
A NEW HIGH PERFORMANCE ORGANIC SUBSTRATE R. Gorrell, D. Le-Huu, S. Qu, D. Banks, D. Hanson  Abstract
EFFECT OF SOLDER PASTE AND SURFACE FINISH ON 0201 ASSEMBLY PROCESS DEFECTS Rahul A. Newasekar and S. Manian Ramkumar et al.  Abstract
QUALIFICATION AND RELIABILITY FOR MEMS AND IC PACKAGES Reza Ghaffarian, Ph.D.  Abstract
DESIGNING EMBEDDED RESISTORS Richard Snogren  Abstract
CAMERA MODULE PACKAGING TECHNOLOGY Robert Darveaux et al.  Abstract
LEAD-FREE PROCESS TRANSITION-PHASE II: PASTE PERFORMANCE ASSESSMENT BY SURFACE FINISH AND MECHANICAL STRENGTH CORRELATION Robert Farrell et al.  Abstract
COMPARATIVE STUDY BETWEEN FOAM AND SPRAY FLUXING OF NO CLEAN FLUX FOR CONVENTIONAL WAVE SOLDERING MACHINE Rodolfo del Mundo Jr.  Abstract
TIN PEST: A FORGOTTEN ISSUE IN LEAD-FREE SOLDERING? Ronald C. Lasky, Ph.D., PE  Abstract
OPTIMIZING CLEANING ENERGY IN BATCH AND INLINE SPRAY SYSTEMS Steve Stach / Mike Bixenman  Abstract
JET DISPENSING UNDERFILLS FOR STACKED DIE APPLICATIONS Steven J. Adamson  Abstract
JEDEC DROP TEST PREPARATIONS FOR QUALIFICATION OF CERAMIC LGAs Steven O. Dunford and Juscelino H. Okura  Abstract
WHEN GLOBAL SOURCING ISN’T WORLD CLASS - OVERCOMING SOURCING CHALLENGES IN EMERGING MARKETS Susan E. Mucha  Abstract
INVESTIGATIONS OF THE MICROSTRUCTURE OF LEAD-FREE SOLDER JOINTS AND RELIABILITY BEHAVIOR BY THE EXAMPLE OF CHIP RESISTANCE COMPONENTS Th. Herzog, K.-J. Wolter  Abstract
SOLDER PASTE EVALUATION TECHNIQUES TO SIMPLIFY THE TRANSITION TO PB-FREE Timothy Jensen  Abstract
LEADFREE (NO-CLEAN) - UNHEATED CLEANING? Umut Tosun / Dirk Ellis  Abstract
SELECTIVE SOLDERING WITH SN3.9AG0.6CU: PROCESS DEVELOPMENT Ursula G. Marquez et al.  Abstract
EFFECT OF HEAT TREATMENT ON TIN WHISKER GROWTH Y. Fukuda, T. Fang, M. Pecht, and M. Osterman  Abstract
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